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1. 发明申请

US20090021911A1 FAN ASSEMBLY 审中-公开
标题翻译：风扇装配
公开(公告)号：US20090021911A1
公开(公告)日：2009-01-22
申请号：US11850042
申请日：2007-09-05
申请人： SHENG-HUNG LEE , LI-PING CHEN , HUNG-CHIEH CHANG
发明人： SHENG-HUNG LEE , LI-PING CHEN , HUNG-CHIEH CHANG
IPC分类号： H05K7/20
CPC分类号： F04D25/166 , F04D29/601
摘要： A fan assembly for dissipating heat from an electronic device, includes a fan bracket (30), a fan module (40), and a chassis (10). The fan bracket has a main body (31), a flange (33) extends out from one side of the main body, the main body defines a recess (36) on the other side thereof, and the recess extends into the flange. The fan module includes a fan (41) and a fastening body (43) attached to a first side of the fan, the fastening body forming a ferruled portion (431), a second side opposite to the first side of the fan received in the recess of the bracket. The chassis has a positioning post (15) formed thereon, for inserting in the ferruled portion of the fastening body.
摘要翻译：一种用于从电子设备散热的风扇组件，包括风扇支架（30），风扇模块（40）和底盘（10）。风扇支架具有主体（31），凸缘（33）从主体的一侧延伸出来，主体在其另一侧上形成凹部（36），并且凹部延伸到凸缘中。风扇模块包括风扇（41）和附接到风扇的第一侧的紧固体（43），紧固体形成套圈部分（431），与风扇的第一侧相对的第二侧支架的凹槽。底盘具有形成在其上的定位柱（15），用于插入紧固体的套圈部分。

2. 发明申请

US20100002369A1 COMPUTER ENCLOSURE 失效
标题翻译：电脑外壳
公开(公告)号：US20100002369A1
公开(公告)日：2010-01-07
申请号：US12210510
申请日：2008-09-15
申请人： SHENG-HUNG LEE , LUNG-SHENG TSAI , CHIA-KANG WU , HO-CHIN TSAI , YI-LUNG CHOU , LI-PING CHEN
发明人： SHENG-HUNG LEE , LUNG-SHENG TSAI , CHIA-KANG WU , HO-CHIN TSAI , YI-LUNG CHOU , LI-PING CHEN
IPC分类号： H05K7/14
CPC分类号： G06F1/181 , G06F1/187
摘要： A computer enclosure for mounting a disk drive bracket includes a chassis for receiving the disk drive bracket, and an extending plate releasably positioned and aligned at an end of the chassis. One portion of the disk drive bracket is fixed on the chassis, and the other portion is fixed on the extending plate. The disk drive bracket is completely mounted on the chassis and the extending plate.
摘要翻译：用于安装磁盘驱动器支架的计算机外壳包括用于接收磁盘驱动器支架的底盘和可释放地定位并对准在底盘端部的延伸板。磁盘驱动器支架的一部分固定在底盘上，另一部分固定在延伸板上。磁盘驱动器托架完全安装在机箱和扩展板上。

3. 发明申请

US20120148397A1 FAN MODULE 有权
标题翻译：风扇模块
公开(公告)号：US20120148397A1
公开(公告)日：2012-06-14
申请号：US13207760
申请日：2011-08-11
申请人： HO-CHIN TSAI , SHENG-HUNG LEE , LI-PING CHEN
发明人： HO-CHIN TSAI , SHENG-HUNG LEE , LI-PING CHEN
IPC分类号： F01D25/28
CPC分类号： G06F1/20 , F03D80/00 , Y02E10/72
摘要： A fan module includes a fan with an electrical connector, and a positioning member. The connector comprises an end portion and a head portion. The positioning member, mounted to the fan, comprises a first body and a second body located on the first body. The first body is mounted to a first side of the fan, and the second body is mounted to a second side of the fan, that is substantially perpendicular to the first side. The second body defines a mounting hole, a latching portion is located in the mounting hole, and a maintaining portion is also located on the first body of the positioning member. The head portion is inserted through the mounting hole, and the latching portion engages the head portion in the mounting hole. The end portion is located between the maintaining portion and the second body.
摘要翻译：风扇模块包括具有电连接器的风扇和定位构件。连接器包括端部和头部。安装到风扇的定位构件包括位于第一主体上的第一主体和第二主体。第一主体安装在风扇的第一侧，第二主体安装到风扇的第二侧，大致垂直于第一侧。第二主体限定安装孔，闩锁部分位于安装孔中，保持部分也位于定位部件的第一主体上。头部插入穿过安装孔，并且闩锁部分与安装孔中的头部接合。端部位于保持部和第二主体之间。

4. 发明申请

US20100130120A1 AIR CONDUCTING DEVICE 审中-公开
标题翻译：空气导管装置
公开(公告)号：US20100130120A1
公开(公告)日：2010-05-27
申请号：US12464554
申请日：2009-05-12
申请人： SHENG-HUNG LEE , CHIA-YUN TSAI , GONG-JIN FAN , GUO-AN HE , LI-PING CHEN
发明人： SHENG-HUNG LEE , CHIA-YUN TSAI , GONG-JIN FAN , GUO-AN HE , LI-PING CHEN
IPC分类号： F24F13/08
CPC分类号： G06F1/20 , G06F1/185
摘要： An air conducting device includes a body, a baffle and a plurality of tongues. The body defines an airflow passageway therein. The baffle extends from the body to divide the airflow passageway into a first passageway and a second passageway. The first passageway is capable of receiving at least one first heat generating component therein. The second passageway is capable of receiving at least one second heat generating component therein. The first heat generating component is located in one of a plurality a slots. A plurality of tongues are located in the first passageway. Each tongue corresponds to the location of the plurality of slots. A guide channel is defined between every two adjacent tongues.
摘要翻译：导气装置包括主体，挡板和多个舌片。主体在其中限定一个气流通道。挡板从主体延伸以将气流通道分成第一通道和第二通道。第一通道能够在其中容纳至少一个第一发热部件。第二通道能够在其中容纳至少一个第二发热部件。第一发热部件位于多个狭槽中的一个。多个舌片位于第一通道中。每个舌片对应于多个狭槽的位置。在每两个相邻的舌头之间定义一个引导通道。

5. 发明申请

US20100020487A1 AIRFLOW CONDUCTING APPARATUS 审中-公开
标题翻译：气流导管装置
公开(公告)号：US20100020487A1
公开(公告)日：2010-01-28
申请号：US12208665
申请日：2008-09-11
申请人： SHENG-HUNG LEE , LI-PING CHEN , XIU-ZHONG YIN
发明人： SHENG-HUNG LEE , LI-PING CHEN , XIU-ZHONG YIN
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , G06F1/185 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： An airflow conducting apparatus is used for dissipating heat from at least one memory module received in a corresponding socket on a motherboard. The airflow conducting apparatus includes an airduct and a valve piece. The airduct is positioned over the socket and configured to guide air to flow therethrough. The valve piece is attached to an inside of the airduct. The valve piece includes a plurality of parallel elastic flaps. Each flap has at least one configuration that deflects air flowing through the airduct.
摘要翻译：气流传导装置用于从容纳在主板上的相应插座中的至少一个存储器模块散热。气流传导装置包括一个气流和一个阀片。气囊位于插座上并构造成引导空气流过其中。阀片连接到气体的内部。阀片包括多个平行的弹性翼片。每个翼片具有至少一种使流过该空气的空气偏转的构造。

6. 发明申请

US20130329371A1 ELECTRONIC DEVICE WITH CONNECTOR 有权
标题翻译：带连接器的电子设备
公开(公告)号：US20130329371A1
公开(公告)日：2013-12-12
申请号：US13543648
申请日：2012-07-06
申请人： SHENG-HUNG LEE , LI-PING CHEN , XIAN-HUANG GAO , JIN-JIA YU , CHENG-WANG ZHAO
发明人： SHENG-HUNG LEE , LI-PING CHEN , XIAN-HUANG GAO , JIN-JIA YU , CHENG-WANG ZHAO
IPC分类号： H05K5/02
CPC分类号： G06F1/183 , G06F1/20
摘要： An electronic device includes an enclosure, a bracket, a connector, and a fan. The enclosure includes a bottom plate and two side plates located on the bottom plate. The bracket is secured to the side plates and includes a bottom wall. The bottom wall is substantially parallel to the bottom plate and defines an installing opening. Two locking pieces extend from two opposite edges of the installing opening. Each of the locking pieces defines a locking hole. The connector is secured in the installing opening, the connector comprising two resilient portions. A locking protrusion protrudes from each of the resilient portions. The locking protrusions of the resilient portions engage in the locking holes of the locking pieces. The resilient portions are deformable to disengage the locking protrusions from the locking holes. The fan is received in the bracket and adapted to be electrically coupled to the connector.
摘要翻译：电子设备包括外壳，支架，连接器和风扇。外壳包括底板和位于底板上的两个侧板。支架固定在侧板上并包括底壁。底壁基本上平行于底板并且限定了安装开口。两个锁定件从安装开口的两个相对的边缘延伸。每个锁定件限定锁定孔。连接器固定在安装开口中，连接器包括两个弹性部分。锁定突起从每个弹性部突出。弹性部分的锁定突起啮合在锁定片的锁定孔中。弹性部分是可变形的，以将锁定突起与锁定孔分离。风扇被容纳在支架中并且适于电连接到连接器。

7. 发明申请

US20100002372A1 COMPUTER ENCLOSURE WITH AIRFLOW-GUIDING DEVICE 有权
标题翻译：带气流导向装置的计算机外壳
公开(公告)号：US20100002372A1
公开(公告)日：2010-01-07
申请号：US12327628
申请日：2008-12-03
申请人： SHENG-HUNG LEE , CHIEN-SHUN LIN , LI-PING CHEN
发明人： SHENG-HUNG LEE , CHIEN-SHUN LIN , LI-PING CHEN
IPC分类号： H05K7/20
CPC分类号： G06F1/20
摘要： A computer enclosure includes a chassis and an airflow-guiding device mounted to the chassis. A receiving slot is defined in the chassis. An elastic receiving portion is formed around the receiving slot. One side of the airflow-guiding device is detachably fixed on the chassis. A first resilient securing member is formed on another side of the airflow-guiding device corresponding to the receiving slot. A wedge is formed on the first securing member to slide over the receiving portion and insert into the receiving slot.
摘要翻译：计算机机箱包括底盘和安装到底盘的气流引导装置。机箱中定义了接收槽。在接收槽周围形成弹性接收部。气流引导装置的一侧可拆卸地固定在底盘上。第一弹性固定构件形成在对应于接收槽的导风装置的另一侧。楔形件形成在第一固定构件上以在接收部分上滑动并插入接收槽。

8. 发明申请

US20090244861A1 SERVER ENCLOSURE WITH TRANSFER CARD MODULE 失效
标题翻译：带传送卡模块的服务器外壳
公开(公告)号：US20090244861A1
公开(公告)日：2009-10-01
申请号：US12110315
申请日：2008-04-26
申请人： SHENG-HUNG LEE , CHE-JUI CHANG , SI-LEK LAO , LI-PING CHEN
发明人： SHENG-HUNG LEE , CHE-JUI CHANG , SI-LEK LAO , LI-PING CHEN
IPC分类号： H05K5/00 , H05K7/00
CPC分类号： H05K7/1487 , H05K7/1492
摘要： The invention relates to a server enclosure with a transfer card module with a chassis having a side, a mounting bracket attached to the side of the chassis, and a transfer card secured to the mounting bracket. The mounting bracket includes a first sidewall and an opposite second sidewall. A first receiving slot is defined between the first sidewall and the second sidewall. The transfer card includes a printed circuit board. A first connector and a second connector are disposed on one side of the printed circuit board. The first connector is located between the printed circuit board and the first sidewall of the mounting bracket. The second connector is proximate to the mounting bracket and aligned with the first receiving slot of the mounting bracket.
摘要翻译：本发明涉及一种具有传输卡模块的服务器机箱，其具有侧面的底盘，附接到底盘的侧面的安装支架以及固定到安装支架上的转接卡。安装支架包括第一侧壁和相对的第二侧壁。第一接收槽限定在第一侧壁和第二侧壁之间。转印卡包括印刷电路板。第一连接器和第二连接器设置在印刷电路板的一侧。第一连接器位于印刷电路板和安装支架的第一侧壁之间。第二连接器靠近安装支架并与安装支架的第一接收槽对准。

9. 发明申请

US20090067142A1 RETAINING MECHANISM FOR CIRCUIT CARD 审中-公开
标题翻译：电路卡的保留机制
公开(公告)号：US20090067142A1
公开(公告)日：2009-03-12
申请号：US11869757
申请日：2007-10-10
申请人： HO-CHIN TSAI , LI-PING CHEN , SHENG-HUNG LEE
发明人： HO-CHIN TSAI , LI-PING CHEN , SHENG-HUNG LEE
IPC分类号： H05K7/12 , H05K5/02
CPC分类号： G06F1/185 , H05K7/1429
摘要： A retaining mechanism for retaining a circuit card includes a chassis (10), and a retaining member (80). The chassis has a front panel (14) and an opposite back panel (16). The front panel is configured for mounting a first edge of the circuit card thereon. The retaining member is pivotably attached to the back panel, and the retaining member defines a traversing securing slot (84) for receiving a second edge of the circuit card opposite to the first edge. The retaining member has a resilient hook (80) for detachably engaging with the back panel.
摘要翻译：用于保持电路卡的保持机构包括底盘（10）和保持构件（80）。底盘具有前面板（14）和相对的背面板（16）。前面板被配置为将电路卡的第一边缘安装在其上。保持构件可枢转地附接到后面板，并且保持构件限定用于接收与第一边缘相对的电路卡的第二边缘的横向固定槽（84）。保持构件具有用于可拆卸地与后面板接合的弹性钩（80）。

10. 发明申请

US20130163191A1 COMPUTER SYSTEM WITH AIR DUCT 审中-公开
标题翻译：带空气导管的计算机系统
公开(公告)号：US20130163191A1
公开(公告)日：2013-06-27
申请号：US13595341
申请日：2012-08-27
申请人： LI-PING CHEN , SHENG-HUNG LEE , XIAN-HUANG GAO
发明人： LI-PING CHEN , SHENG-HUNG LEE , XIAN-HUANG GAO
IPC分类号： G06F1/20
CPC分类号： G06F1/20
摘要： A computer system includes an enclosure, a printed circuit board, and an air duct. The enclosure comprises a bottom panel, a rear panel, and a mounting panel. The printed circuit board is mounted on the bottom panel and is located between the rear panel and the mounting panel. A plurality of expansion cards is inserted in the printed circuit board. The plurality of expansion cards is substantially parallel to each other. The air duct is placed on the rear panel and the mounting panel. The air duct comprises an air duct body and a guiding plate. The guiding plate comprises a securing portion secured to the air duct body and a plurality of bent elastic tabs extending from the securing portion at an angle. The plurality of bent elastic tabs resists the plurality of expansion cards, thereby guiding air to flow to the plurality of the expansion cards.
摘要翻译：计算机系统包括外壳，印刷电路板和空气导管。外壳包括底板，后面板和安装板。印刷电路板安装在底板上，位于后面板和安装面板之间。多个扩展卡被插入到印刷电路板中。多个扩展卡基本上彼此平行。风管放置在后面板和安装面板上。风道包括空气管道主体和引导板。引导板包括固定到空气管道主体的固定部分和多个从固定部分以一定角度延伸的弯曲弹性片。多个弯曲的弹性突片抵抗多个扩张卡，从而引导空气流向多个扩展卡。

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