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1. 发明申请

US20130068822A1 STENCIL FOR PRINTING SOLDER PASTE ON PRINTED CIRCUIT BOARD 审中-公开
标题翻译：印刷电路板上印刷焊膏的步骤
公开(公告)号：US20130068822A1
公开(公告)日：2013-03-21
申请号：US13294250
申请日：2011-11-11
申请人： SHAO-CHUN CHANG , CHING-FENG HSIEH
发明人： SHAO-CHUN CHANG , CHING-FENG HSIEH
IPC分类号： B23K3/06
CPC分类号： B41F15/36 , B05C17/08 , B41N1/248 , H05K3/1225 , H05K3/3484
摘要： A stencil for printing solder paste on a printed circuit board improves an assembly process, cuts production costs, and saves storage space. The stencil is coupled to a fixing frame having a plurality of fixing portions and a motor unit. The motor unit generates a plurality of pulling forces. The stencil includes a solder paste printing region and a plurality of fixing regions. Vias are disposed in the solder paste printing region. The directions of the pulling forces are coplanar with the solder paste printing region. The edge of the solder paste printing region extends outward to define the fixing regions. The fixing regions are movably fixed to the fixing portions and bear the pulling forces to flatten the solder paste printing region of the stencil.
摘要翻译：用于在印刷电路板上印刷焊膏的模板改善了组装过程，降低了生产成本并节省了存储空间。模板耦合到具有多个固定部分和马达单元的固定框架。马达单元产生多个拉力。模板包括焊膏印刷区域和多个固定区域。通孔布置在焊膏印刷区域中。拉力的方向与焊膏印刷区域共面。焊膏印刷区域的边缘向外延伸以限定固定区域。固定区域可移动地固定到固定部分并承受牵引力以使模板的焊膏印刷区域变平。

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