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1. 发明授权

US10117367B2 Fastening structure for shield can 有权
公开(公告)号：US10117367B2
公开(公告)日：2018-10-30
申请号：US14625104
申请日：2015-02-18
申请人： SAMSUNG ELECTRONICS CO., LTD. , S-Connect Co., Ltd.
发明人： Hyun-Tae Jang , Yong Won Lee , Jung Je Bang , Kwang Sub Lee
IPC分类号： H05K9/00
摘要： A fastening structure for a shield can is capable of ensuring easy attachment/detachment of the shield can and prevents deformation caused by excessive impact when the shield can is attached and detached by improving the fastening structure for a shield can fixed to a printed circuit board. The fastening structure for a shield can provided to shield a printed circuit board on which electronic components are mounted and the electronic components from electromagnetic waves includes a frame provided with a fixing part allowing the frame to be fixed to the printed circuit board, a shield cover provided to surround an outer side of the frame, fastening parts provided at the shield cover and the frame, respectively, such that the shield cover and the frame are attached/detached to/from each other. The fastening parts and the fixing part are disposed without overlapping each other.

2. 发明申请

US20150245543A1 FASTENING STRUCTURE FOR SHIELD CAN 审中-公开
标题翻译：用于屏蔽罐的快速结构
公开(公告)号：US20150245543A1
公开(公告)日：2015-08-27
申请号：US14625104
申请日：2015-02-18
申请人： SAMSUNG ELECTRONICS CO., LTD. , S-Connect Co., Ltd.
发明人： Hyun-Tae Jang , Yong Won Lee , Jung Je Bang , Kwang Sub Lee
IPC分类号： H05K9/00
CPC分类号： H05K9/0032
摘要： A fastening structure for a shield can is capable of ensuring easy attachment/detachment of the shield can and prevents deformation caused by excessive impact when the shield can is attached and detached by improving the fastening structure for a shield can fixed to a printed circuit board. The fastening structure for a shield can provided to shield a printed circuit board on which electronic components are mounted and the electronic components from electromagnetic waves includes a frame provided with a fixing part allowing the frame to be fixed to the printed circuit board, a shield cover provided to surround an outer side of the frame, fastening parts provided at the shield cover and the frame, respectively, such that the shield cover and the frame are attached/detached to/from each other. The fastening parts and the fixing part are disposed without overlapping each other.
摘要翻译：用于屏蔽罐的紧固结构能够确保屏蔽壳的容易的附接/拆卸，并且通过改进固定到印刷电路板的屏蔽罩的紧固结构来防止当屏蔽壳被附接和分离时由过度的冲击引起的变形。可以设置用于屏蔽的紧固结构以屏蔽安装有电子部件的印刷电路板，并且来自电磁波的电子部件包括设置有允许框架固定到印刷电路板的固定部的框架，屏蔽盖设置成围绕框架的外侧，分别设置在屏蔽罩和框架处的紧固部件，使得屏蔽盖和框架彼此附接/分离。紧固部件和固定部件彼此重叠设置。

3. 发明授权

US09832859B2 Printed circuit board assembly and method of manufacturing the same 有权
公开(公告)号：US09832859B2
公开(公告)日：2017-11-28
申请号：US14813448
申请日：2015-07-30
申请人： Samsung Electronics Co., Ltd.
发明人： Yong Won Lee , Hyun-Tae Jang , Jung Je Bang
IPC分类号： H05K7/00 , H05K1/02 , G06F1/18 , H05K9/00 , H05K1/18
CPC分类号： H05K1/0216 , G06F1/18 , H05K1/181 , H05K9/0032 , H05K2201/09972 , H05K2201/10371
摘要： A printed circuit board (PCB) assembly includes a PCB, electronic components mounted on the PCB, a shield can provided to block electromagnetic waves of the electronic components, and an insulating layer provided to prevent an electrical short between the electronic components and the shield can, and the insulating layer is sprayed and formed on the shield can. The insulating layer which is sprayed and formed on the shield can does not have an adhesive layer, and thus the thickness thereof can be remarkably reduced compared to insulating materials requiring an adhesive layer.

4. 发明授权

US11032952B2 Electronic device including shield can 有权
公开(公告)号：US11032952B2
公开(公告)日：2021-06-08
申请号：US15919257
申请日：2018-03-13
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Chang Joon Lee , Yong Won Lee , Hyun Tae Jang
IPC分类号： H05K9/00 , H05K1/02 , H05K1/18 , H05K1/11
摘要： An electronic device includes a printed circuit board (PCB) including a first surface, a second surface facing a direction opposite the first surface, and a side surface surrounding a space between the first surface and the second surface, at least one component disposed on the first surface, a shield can surrounding the at least one component and a partial area of the PCB, and an adhesive that bonds the shield can and the first surface, and that bonds the shield can and the second surface, and at least a portion of the shield can does not bond with the side surface.

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