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1. 发明公开

US20240096748A1 CHIP PROTECTION DEVICE 审中-公开
公开(公告)号：US20240096748A1
公开(公告)日：2024-03-21
申请号：US18453026
申请日：2023-08-21
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Taejun JEON , Yongkwan LEE , Gyuhyeong KIM , Seunghwan KIM , Jongwan KIM , Junwoo PARK
IPC分类号： H01L23/473 , H01L23/00
CPC分类号： H01L23/473 , H01L24/16 , H01L24/32 , H01L24/73 , H01L2224/16052 , H01L2224/16175 , H01L2224/16225 , H01L2224/32221 , H01L2224/73204 , H01L2224/73253 , H01L2924/17151 , H01L2924/172 , H01L2924/177
摘要： A chip protection device includes a protection frame extending around side surfaces of a semiconductor chip mounted on a substrate. The protection frame includes a plurality of side walls, each wall facing and spaced apart from a respective side surface of the semiconductor chip, and a plurality of upper walls, each upper wall extending inward from an upper portion of a respective side wall toward the semiconductor chip. A plurality of apertures are formed through the side walls and through which a fluid enters and exits. The protection frame defines an inner space in which the fluid can flow via the plurality of apertures. Heat from the side surfaces of the semiconductor chip is transferred to the fluid in the inner space.

2. 发明公开

US20240040020A1 FOLDABLE ELECTRONIC DEVICE INCLUDING ANTENNA 审中-公开
公开(公告)号：US20240040020A1
公开(公告)日：2024-02-01
申请号：US18483995
申请日：2023-10-10
申请人： Samsung Electronics Co., Ltd.
发明人： Soonho HWANG , Himchan YUN , Kookjoo LEE , Hojung NAM , Sungkoo PARK , Kyungjae LEE , Donguk CHOI , Seunghwan KIM , Jaebong CHUN
IPC分类号： H04M1/02 , H01Q1/24
CPC分类号： H04M1/0214 , H01Q1/243 , H04M1/0268
摘要： A foldable electronic device is provided that includes a hinge module, a first housing coupled to a first side of the hinge module, a first printed circuit board disposed inside the first housing and including a first wireless communication module, a processor, and a first ground or a second ground, and a second housing coupled to a second side of the hinge module, in which the first housing includes a first segmenting portion, a second segmenting portion, a first conductive portion, and a second conductive portion, in which the second housing includes a second wireless communication module, a third segmenting portion, a fourth segmenting portion, a third conductive portion, and a fourth conductive portion, and in which a matching circuit is disposed between the first conductive portion and the first ground, and a first filter circuit is connected to a signal path between the first conductive portion and the matching circuit.

3. 发明公开

US20230282533A1 INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME 审中-公开
公开(公告)号：US20230282533A1
公开(公告)日：2023-09-07
申请号：US18315558
申请日：2023-05-11
申请人： Samsung Electronics Co., Ltd.
发明人： Junyoung OH , Hyunggil BAEK , Seunghwan KIM , Jungjoo KIM , Jongho PARK , Yongkwan LEE
IPC分类号： H01L23/16 , H01L25/065 , H01L23/498 , H01L23/31 , H01L23/538
CPC分类号： H01L23/16 , H01L25/0657 , H01L23/49811 , H01L23/3128 , H01L23/5389
摘要： A semiconductor package is provided. The semiconductor package includes: a first package substrate; a first semiconductor chip on the first package substrate; an interposer substrate including a lower surface facing the first package substrate, an upper surface opposite to the lower surface, and an upper conductive pad in the upper surface of the interposer substrate; a first dam structure on the upper surface of the interposer substrate and extending along an edge of the upper conductive pad; a first molding layer in contact with the lower and upper surfaces of the interposer substrate and with an outer wall of the first dam structure; and a conductive connector in contact with an inner wall of the at least one first dam structure and with the upper conductive pad.

4. 发明公开

US20230147580A1 WEARABLE ELECTRONIC DEVICE INCLUDING ANTENNA 审中-公开
公开(公告)号：US20230147580A1
公开(公告)日：2023-05-11
申请号：US17980109
申请日：2022-11-03
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Jaehyung KIM , Seunghwan KIM
IPC分类号： G02C11/00 , H01Q1/27 , G02C5/14 , G02C5/02
CPC分类号： G02C11/10 , H01Q1/273 , G02C5/14 , G02C5/02
摘要： An example wearable electronic device including an antenna may include: a bridge; a first rim disposed in a first direction of the bridge, and a second rim disposed in a second direction of the bridge opposite to the first direction; and a first temple configured to be folded or unfolded with respect to the first rim using a first hinge, and a second temple configured to be folded or unfolded with respect to the second rim using a second hinge, wherein the first temple may include a first cut-off portion, and a first conductive portion and a second conductive portion separated by the first segmenting portion, wherein the second temple may include a second segmenting portion, and a third conductive portion and a fourth conductive portion separated by the second segmenting portion, and wherein the first conductive portion may include a printed circuit board on which a wireless communication circuit is disposed, a feeding point electrically connected to the wireless communication circuit, and at least one conductive connection member electrically connecting the first conductive portion and the second conductive portion.

5. 发明申请

US20230046166A1 ELECTRONIC DEVICE INCLUDING ANTENNAS 有权
公开(公告)号：US20230046166A1
公开(公告)日：2023-02-16
申请号：US17890483
申请日：2022-08-18
申请人： Samsung Electronics Co., Ltd.
发明人： Soonho HWANG , Sungkoo PARK , Kyungjae LEE , Sewoong KIM , Seunghwan KIM , Taeik KIM
IPC分类号： H04M1/02
摘要： According to an embodiment, an electronic device comprises: a foldable housing comprising a first housing hingably connected to a second housing, a first side member disposed about a side surface of the first housing and comprising a first plurality of conductive parts, and a second side member disposed about a side surface of the second housing and comprising a second plurality of conductive parts; a communication circuit electrically connected to a first conductive part among the first plurality of conductive parts and configured to transmit and receive a signal in a selected or specified frequency band; a first sensor integrated circuit (IC) electrically connected to at least one of the first plurality of conductive parts and configured to measure capacitance; a second sensor IC electrically connected to at least one of the second plurality of conductive parts and configured to measure capacitance; a first switching circuit electrically connected to the first conductive part and a second conductive part among the first plurality of conductive parts; and a processor and a memory, wherein the memory stores instructions that, when executed, cause the processor to perform a plurality of operations, the plurality of operations comprising: controlling the first switching circuit wherein the first conductive part and the second conductive part are electrically connected, based on at least one of the capacitance measured by the first sensor IC and the capacitance measured by the second sensor IC when the foldable housing is in a folded state.

6. 发明申请

US20220093519A1 INTERPOSERS AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME 有权
公开(公告)号：US20220093519A1
公开(公告)日：2022-03-24
申请号：US17306290
申请日：2021-05-03
申请人： Samsung Electronics Co., Ltd.
发明人： Jongho PARK , Seunghwan KIM , Junyoung OH , Yonghyun KIM , Yongkwan LEE , Junga LEE
IPC分类号： H01L23/538 , H01L23/00 , H01L23/498 , H01L25/10 , H01L23/31
摘要： A semiconductor package includes a first package substrate; a first semiconductor chip on the first package substrate; a first conductive connector on the first package substrate; and an interposer including a central portion on the first semiconductor chip and an outer portion having the first conductive connector attached thereto. The central portion of the interposer includes a bottom surface defining a recess from a bottom surface of the outer portion of the interposer in a vertical direction that is perpendicular to a top surface of the first package substrate. A thickness in the vertical direction of the outer portion of the interposer is greater than a thickness in the vertical direction of the central portion of the interposer.

7. 发明公开

US20230213771A1 ELECTRONIC DEVICE INCLUDING ANTENNA 审中-公开
公开(公告)号：US20230213771A1
公开(公告)日：2023-07-06
申请号：US18114405
申请日：2023-02-27
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Jaewon CHOE , Seunghwan KIM , Jaehoon JO , Nakchung CHOI
IPC分类号： G02B27/01 , G06T19/00
CPC分类号： G02B27/0172 , G06T19/006
摘要： Augmented reality (AR) glasses may include a main housing configured to accommodate lenses of the AR glasses, with at least a portion of the main housing formed of a conductive member A sub-housing forms a leg of the AR glasses. A PCB is disposed in the sub-housing. A conductive hinge structure is configured to interconnect the main housing and the sub-housing such that the sub-housing is foldable with respect to the main housing. The conductive hinge structure is electrically connected to the PCB and the conductive member. A wireless communication circuit is disposed in the sub-housing and is configured to transmit and/or receive a signal of a predetermined frequency band based on an electrical path including the conductive hinge structure and the conductive member by directly feeding power to the conductive hinge structure. Various other embodiments identified through the specification are possible.

8. 发明申请

US20170047639A1 ANTENNA DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME 审中-公开
标题翻译：天线装置和包括其的电子装置
公开(公告)号：US20170047639A1
公开(公告)日：2017-02-16
申请号：US15217516
申请日：2016-07-22
申请人： Samsung Electronics Co., Ltd.
发明人： Kyung-Jae LEE , Kyung-Jong LEE , Sewoong KIM , Soo-Young JANG , Seunghwan KIM , Hosaeng KIM , Jinwoo JUNG
IPC分类号： H01Q1/24 , H01Q7/00 , H01Q1/48
CPC分类号： H01Q1/243 , H01Q1/48 , H01Q7/00 , H01Q9/42
摘要： An electronic device is provided. The electronic device includes a housing including a first face, a second face, and a side face that at least partially encloses a space between the first face and the second face, a conductive member configured to form at least a portion of the side face, a ground member, at least one communication circuit, and a conductive pattern positioned within the housing, the conductive pattern electrically connected to the communication circuit and the ground member, a first electric path positioned within the housing, and configured to electrically interconnect another end of the conductive member and the communication circuit, a second electric path configured to electrically interconnect the first electric path or the conductive member and the ground member, and a third electric path configured to electrically interconnect the first electric path or the conductive member and the ground member, and including a switching circuit.
摘要翻译：提供电子设备。电子设备包括壳体，其包括第一面，第二面和至少部分地围绕第一面和第二面之间的空间的侧面;导电构件，被配置为形成侧面的至少一部分，接地构件，至少一个通信电路和定位在壳体内的导电图案，导电图案电连接到通信电路和接地构件，第一电路定位在壳体内，并且被配置为将互连的另一端所述导电构件和所述通信电路，被配置为使所述第一电路或所述导电构件与所述接地构件电互连的第二电气路径，以及被配置为将所述第一电路或所述导电构件与所述接地构件并且包括开关电路。

9. 发明申请

US20150293943A1 METHOD FOR SORTING MEDIA CONTENT AND ELECTRONIC DEVICE IMPLEMENTING SAME 审中-公开
标题翻译：用于分类媒体内容的方法和实现该媒体内容的电子设备
公开(公告)号：US20150293943A1
公开(公告)日：2015-10-15
申请号：US14673177
申请日：2015-03-30
申请人： Samsung Electronics Co., Ltd.
发明人： Seunghwan KIM
IPC分类号： G06F17/30
CPC分类号： G06F17/30268 , G06F17/30265 , G06F17/3082
摘要： A method of sorting a media content is provided. The method includes receiving at least one search word, extracting at least one media content based on the received search word, identifying a user's selection for the extracted media content, generating a group, and including the at least one media content in the group based on the identified user's selection.
摘要翻译：提供了一种分类媒体内容的方法。该方法包括接收至少一个搜索词，基于所接收的搜索词提取至少一个媒体内容，识别用户对所提取的媒体内容的选择，生成组，以及基于组中的至少一个媒体内容，基于识别用户的选择。

10. 发明申请

US20140043192A1 INTERNAL ANTENNA OF MOBILE TERMINAL 有权
标题翻译：内部手机终端天线
公开(公告)号：US20140043192A1
公开(公告)日：2014-02-13
申请号：US13954256
申请日：2013-07-30
申请人： Samsung Electronics Co., Ltd.
发明人： Jeongwan PARK , Byungchan JANG , Sukho KIM , Seunghwan KIM , Joonho BYUN
IPC分类号： H01Q1/24
CPC分类号： H01Q1/243 , H01Q1/088 , H01Q1/38
摘要： An antenna of a mobile includes at least two internal antennas and a printed circuit board disposed between a front cover and a rear cover. The printed circuit board includes at least one first antenna mounted on an upper surface and the printed circuit board having at least one fastening opening therein. A second antenna is mounted in an upper portion of a side surface of the printed circuit board and included a protruded portion of one end protruded from a body and in which the protruded portion is fastened to the fastening opening to be fastened to a side surface of the printed circuit board and the mobile terminal can be produced having a reduced thickness.
摘要翻译：移动台的天线包括至少两个内部天线和布置在前盖和后盖之间的印刷电路板。印刷电路板包括安装在上表面上的至少一个第一天线和其中具有至少一个紧固开口的印刷电路板。第二天线安装在印刷电路板的侧表面的上部，并且包括从主体突出的一端的突出部分，其中突出部分紧固到紧固开口以紧固到侧面可以制造具有减小的厚度的印刷电路板和移动终端。

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