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1. 发明授权

US12016508B2 Dish washer and controlling method thereof 有权
公开(公告)号：US12016508B2
公开(公告)日：2024-06-25
申请号：US17703575
申请日：2022-03-24
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Daeseon Yeom , Jungchan Ryu , Junho Lee , Minho Jung
IPC分类号： A47L15/42 , A47L15/00
CPC分类号： A47L15/4206 , A47L15/0023 , A47L15/421 , A47L15/4223
摘要： A dish washer includes a cabinet, a tub positioned inside the cabinet, a sump provided in a lower portion of the tub, a case brake provided on a side wall of the tub connected to the sump, and a filter device positioned below the tub inside the cabinet, to selectively filter or unfilter water received from a water supply source, and to supply the filtered water or the unfiltered water to the case brake, the water passed through the case brake is collected in the sump, the case brake is located higher than the sump to prevent a backflow of the water collected in the sump to the case brake.

2. 发明公开

US20240145509A1 IMAGE SENSOR INCLUDING NANO-PHOTONIC MICROLENS ARRAY AND ELECTRONIC APPARATUS INCLUDING THE IMAGE SENSOR 审中-公开
公开(公告)号：US20240145509A1
公开(公告)日：2024-05-02
申请号：US18380914
申请日：2023-10-17
申请人： Samsung Electronics Co., Ltd.
发明人： Sangeun MUN , Sookyoung Roh , Junho Lee
IPC分类号： H01L27/146 , G02B3/00
CPC分类号： H01L27/14627 , G02B3/0006
摘要： An image sensor includes a sensor substrate including a plurality of pixels for sensing incident light, and a nano-photonic microlens array including a plurality of nano-photonic microlenses corresponding respectively to the plurality of pixels, wherein each of the plurality of nano-photonic microlenses includes a plurality of nano-structures that are arranged two-dimensionally to condense incident light onto corresponding pixels, and a gap between two nano-structures that are arranged directly facing each other across a boundary between two adjacent nano-photonic microlenses is greater than an arrangement period of the plurality of nano-structures in each of the plurality of nano-photonic microlenses.

3. 发明授权

US11688928B2 Structure for blocking noise in at least one designated band and electronic device comprising same 有权
公开(公告)号：US11688928B2
公开(公告)日：2023-06-27
申请号：US16957158
申请日：2018-12-21
申请人： Samsung Electronics Co., Ltd.
发明人： Junho Lee
IPC分类号： H01Q1/22 , H01K1/02 , H01Q1/24 , H05K1/02
CPC分类号： H01Q1/2283 , H01Q1/243 , H05K1/0216 , H05K1/0243
摘要： An electronic device according to various embodiments may include a housing, an antenna structure positioned in the housing, and a wireless communication circuit. The antenna structure may include a first conductive layer including a first opening, a second conductive layer positioned in parallel with the first conductive layer, and including a second opening which overlaps at least in part with the first opening when the first conductive layer is seen from above, a third conductive layer positioned in parallel with the first conductive layer and interposed between the first conductive layer and the second conductive layer, a first insulating layer interposed between the first conductive layer and the third conductive layer, a second insulating layer interposed between the second conductive layer and the third conductive layer, a first conductive plate electrically separated from the first conductive layer and disposed within the first opening, a second conductive plate electrically separated from the second conductive layer and disposed within the second opening, a first conductive via electrically coupled between the first conductive plate and the third conductive layer through the first insulating layer, and a second conductive via electrically coupled between the second conductive plate and the third conductive layer through the second insulating layer. The wireless communication circuit may be configured to transmit or receive a signal having a frequency between 3 Giga Hertz (GHz) and 100 GHz and is electrically coupled to the antenna structure. Various embodiments may be possible.

4. 发明授权

US10965359B2 Wireless communication device capable of fast beam selection and method of operation thereof 有权
公开(公告)号：US10965359B2
公开(公告)日：2021-03-30
申请号：US16794753
申请日：2020-02-19
申请人： Samsung Electronics Co., Ltd.
发明人： Joontae Kim , Junho Lee , Sungyoon Cho
IPC分类号： H04B7/06 , H04W16/28 , H04B7/0408 , H04B7/155
摘要： Provided is a method of operating a wireless communication device including a phased array including a first antenna group and a second antenna group to form a beam for transmitting and receiving signals polarized in different directions, which includes receiving first signals polarized in a first direction; receiving second signals polarized in a second direction; measuring power of the first signals and power of the second signals; analyzing a relationship between a channel corresponding to the first receiving beam and a channel corresponding to the second receiving beam; estimating power of third signals that are expected to be received through the first antenna group and power of fourth signals that are expected to be received through the second antenna group; and selecting a receiving beam pattern for wireless communication.

5. 发明申请

US20200274593A1 WIRELESS COMMUNICATION DEVICE CAPABLE OF FAST BEAM SELECTION AND METHOD OF OPERATION THEREOF 审中-公开
公开(公告)号：US20200274593A1
公开(公告)日：2020-08-27
申请号：US16794753
申请日：2020-02-19
申请人： Samsung Electronics Co., Ltd.
发明人： Joontae Kim , Junho Lee , Sungyoon Cho
IPC分类号： H04B7/06 , H04B7/155 , H04W16/28 , H04B7/0408
摘要： Provided is a method of operating a wireless communication device including a phased array including a first antenna group and a second antenna group to form a beam for transmitting and receiving signals polarized in different directions, which includes receiving first signals polarized in a first direction; receiving second signals polarized in a second direction; measuring power of the first signals and power of the second signals; analyzing a relationship between a channel corresponding to the first receiving beam and a channel corresponding to the second receiving beam; estimating power of third signals that are expected to be received through the first antenna group and power of fourth signals that are expected to be received through the second antenna group; and selecting a receiving beam pattern for wireless communication.

6. 发明申请

US20190121486A1 METHOD AND APPARATUS FOR DETECTING TOUCH EVENTS AND PERFORMING A FUNCTION IN RESPONSE TO THE DETECTING 审中-公开
公开(公告)号：US20190121486A1
公开(公告)日：2019-04-25
申请号：US16222167
申请日：2018-12-17
申请人： Samsung Electronics Co., Ltd.
发明人： Hyesoon Jeong , Kyuchul Kong , Daesik Hwang , Hoondo Heo , Cheonkum You , Junho Lee , Hyunsuk Choi
IPC分类号： G06F3/041 , G06F3/044
摘要： Methods and apparatuses for touch event processing are provided. A touch input is received in a designated region of a touchscreen display of the electronic device. The touch input is stored in a memory of the electronic device without providing the touch input as input to an application of the electronic device, upon reception of the touch input in the designated region. A drag input is received on the touch screen display as a continuation of the touch input. A processor of the electronic device determines the touch input and the drag input as input for the application upon the drag input exceeding a threshold.

7. 发明授权

US09405744B2 Method and apparatus for managing image data in electronic device 有权
标题翻译：用于管理电子设备中的图像数据的方法和装置
公开(公告)号：US09405744B2
公开(公告)日：2016-08-02
申请号：US14318416
申请日：2014-06-27
申请人： Samsung Electronics Co., Ltd.
发明人： Gongwook Lee , Taehwan Son , Junho Lee , Jinhe Jung
IPC分类号： G06K9/46 , G06K9/66 , G06F17/27 , G06K9/62 , G06K9/72 , G06K9/00 , G06K9/22
CPC分类号： G06F17/277 , G06F17/2735 , G06K9/00442 , G06K9/228 , G06K9/4604 , G06K9/6202 , G06K9/723
摘要： A method for recognizing an image and an apparatus using the same. The method includes: receiving image information including a first object and a second object; recognizing position information of the first object indicated by the second information in the received image information; extracting effective information included in the first object of the received image information in response to the recognized position information; and outputting related information corresponding to the recognized effective information.
摘要翻译：用于识别图像的方法和使用其的装置。该方法包括：接收包括第一对象和第二对象的图像信息; 识别由所接收的图像信息中的第二信息指示的第一对象的位置信息; 响应于所识别的位置信息，提取包含在接收到的图像信息的第一对象中的有效信息; 并输出与所识别的有效信息对应的相关信息。

8. 发明授权

US12149991B2 Method and apparatus for providing MEC service 有权
公开(公告)号：US12149991B2
公开(公告)日：2024-11-19
申请号：US17452718
申请日：2021-10-28
申请人： Samsung Electronics Co., Ltd.
发明人： Chihyun Cho , Heejung Kim , Dongyeob Lee , Junho Lee
IPC分类号： H04W4/50 , H04W8/20 , H04W12/06 , H04W28/086 , H04W36/00 , H04W36/22 , H04W56/00 , H04W84/02 , H04W88/14 , H04W92/02 , H04W92/24
CPC分类号： H04W36/0033 , H04W4/50 , H04W8/20 , H04W12/06 , H04W28/086 , H04W36/0061 , H04W36/0072 , H04W36/22 , H04W56/001 , H04W84/02 , H04W88/14 , H04W92/02 , H04W92/24
摘要： Provided is a method, performed by a source edge data network, of providing a service in a wireless communication system includes identifying a target edge data network and a handover terminal handed over to the target edge data network among a plurality of terminals provided with the service from the source edge data network; transmitting information about the identified target edge data network to a server; synchronizing status information of an application for providing the service with the target edge data network; and synchronizing user information for each of the plurality of terminals with the target edge data network.

9. 发明公开

US20240243104A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE 审中-公开
公开(公告)号：US20240243104A1
公开(公告)日：2024-07-18
申请号：US18513863
申请日：2023-11-20
申请人： Samsung Electronics Co., Ltd.
发明人： Seunghoon Yeon , Seungryong Oh , Junho Lee
IPC分类号： H01L25/065 , H01L23/00 , H01L23/31
CPC分类号： H01L25/0657 , H01L23/3107 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L2224/1357 , H01L2224/16148 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2225/06513 , H01L2225/06541 , H01L2924/1431 , H01L2924/1436 , H01L2924/1437 , H01L2924/1438
摘要： A semiconductor package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip includes a plurality of electrode bundles arranged in an array in a first substrate and each having a plurality of through electrodes penetrating the first substrate, a backside insulating layer on a backside surface of the first substrate through which end portions of the through electrodes are exposed, and a plurality of electrode pads respectively provided on the electrode bundles. The backside insulating layer has a first trench formed between the through electrodes of a first electrode bundle. A first electrode pad is disposed on the through electrodes of a first electrode bundle and includes a protruding portion that fills the first trench of the backside insulating layer.

10. 发明公开

US20240105657A1 SEMICONDUCTOR PACKAGE 审中-公开
公开(公告)号：US20240105657A1
公开(公告)日：2024-03-28
申请号：US18240273
申请日：2023-08-30
申请人： Samsung Electronics Co., Ltd.
发明人： Hansung Ryu , Yongsung Park , Jongbeom Park , Junho Lee , Jihyun Lee
IPC分类号： H01L23/00
CPC分类号： H01L24/13 , H01L24/16 , H01L2224/13013 , H01L2224/13014 , H01L2224/13113 , H01L2224/13541 , H01L2224/13583 , H01L2224/16145 , H01L2224/16227 , H01L2924/384
摘要： A semiconductor package includes a first substrate, a first bonding pad on the first substrate, a solder ball on the first bonding pad, and a blocking layer on the solder ball, wherein a thickness of the blocking layer varies in a direction away from the first substrate.

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