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1. 发明授权

US10842057B2 Shield can assembly and electronic device including the same 有权
公开(公告)号：US10842057B2
公开(公告)日：2020-11-17
申请号：US14302387
申请日：2014-06-11
申请人： Samsung Electronics Co., Ltd.
发明人： Ki-Youn Jang , Jeong-Ung Kim , Jung-Je Bang , Sang-Hyun An
IPC分类号： H05K9/00 , H05K1/02
CPC分类号： H05K9/0052 , H05K1/023 , H05K9/0035
摘要： An electronic device includes a printed circuit board (PCB), a first cover disposed to shield a first region of the PCB, and a second cover for shielding a second region which has at least a boundary with the first region. A corresponding boundary portion the first cover and the second cover include at least one protrusion portion and at least one recess portion which are fitted to face each other. Thus, since at least two shielding covers share the single boundary region, the component mounting region of the PCB can be efficiently utilized to thus contribute to slimness of the electronic device.

2. 发明申请

US20170202093A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME 有权
公开(公告)号：US20170202093A1
公开(公告)日：2017-07-13
申请号：US15405256
申请日：2017-01-12
申请人： Samsung Electronics Co., Ltd
发明人： Jung-Je Bang , Yong-Won Lee , Jeong-Ung Kim , Jae-Heung Ye
IPC分类号： H05K5/00 , H05K9/00 , H01R4/02 , H05K1/18
CPC分类号： H05K5/0004 , H01R4/02 , H05K1/18 , H05K5/0086 , H05K9/0007 , H05K9/0028
摘要： According to embodiments, an electronic device includes: a housing including a face facing a first direction; a circuit board including first and second board faces substantially parallel to the face, and a side board face facing a second direction, the circuit board disposed within the housing; a first component disposed in a first region of the first board face; a second component disposed in a second region of the second board face overlapping with the first region; a first shield including a first side wall formed facing the second direction, the first shield covering the first region; a second shield including a second side wall formed facing the second direction, the second shield covering the second region; and a bonding material formed between the first side wall or second side wall and the side board face. The electronic device as described above may be variously implemented according to embodiments.

3. 发明申请

US20150264844A1 SHIELD CAN ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME 审中-公开
标题翻译：屏蔽CAN组装和电子设备，包括它们
公开(公告)号：US20150264844A1
公开(公告)日：2015-09-17
申请号：US14713940
申请日：2015-05-15
申请人： Samsung Electronics Co., Ltd.
发明人： Ki-Youn Jang , Jeong-Ung Kim , Jung-Je Bang , Sang-Hyun An
IPC分类号： H05K9/00
CPC分类号： H05K9/0052 , H05K1/023 , H05K9/0035
摘要： An electronic device includes a printed circuit board (PCB), a first cover disposed to shield a first region of the PCB, and a second cover for shielding a second region which has at least a boundary with the first region. A corresponding boundary portion the first cover and the second cover include at least one protrusion portion and at least one recess portion which are fitted to face each other. Thus, since at least two shielding covers share the single boundary region, the component mounting region of the PCB can be efficiently utilized to thus contribute to slimness of the electronic device.
摘要翻译：电子设备包括印刷电路板（PCB），设置成屏蔽PCB的第一区域的第一盖和用于屏蔽与第一区域至少具有边界的第二区域的第二盖。第一盖和第二盖的相应的边界部分包括至少一个突出部分和至少一个彼此相对配合的凹部。因此，由于至少两个屏蔽罩共享单个边界区域，因此能够有效地利用PCB的部件安装区域，从而有助于电子设备的薄型化。

4. 发明授权

US10470345B2 Electronic device including shield structure 有权
公开(公告)号：US10470345B2
公开(公告)日：2019-11-05
申请号：US15377012
申请日：2016-12-13
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Jae-Heung Ye , Jung-Je Bang , Jeong-Ung Kim , Ki-Youn Jang
IPC分类号： H05K9/00
摘要： Disclosed are various embodiments relating to an electronic device that includes a shield structure. According to an example embodiment, the electronic device may include: a housing that includes a first surface directed in a first direction and a second surface directed in a second direction that is opposite to the first direction; a printed circuit board included in the housing, wherein the printed circuit board includes a first surface directed in the first direction and a second surface directed in the second direction; at least one electronic component disposed on the first surface of the printed circuit board; and at least one shield structure configured to electro-magnetically shield the at least one electronic component, and the shield structure may include: a flexible sheet that includes a first sheet that covers the at least one electronic component and a second sheet that at least partially covers the space between the first sheet and the first surface of the printed circuit board, when viewed from above the first surface of the printed circuit board; and at least one frame structure that supports the first and second sheets.

5. 发明授权

US10064318B2 Shield can assembly and electronic device including the same 有权
公开(公告)号：US10064318B2
公开(公告)日：2018-08-28
申请号：US14713940
申请日：2015-05-15
申请人： Samsung Electronics Co., Ltd.
发明人： Ki-Youn Jang , Jeong-Ung Kim , Jung-Je Bang , Sang-Hyun An
IPC分类号： H05K9/00 , H05K1/02
CPC分类号： H05K9/0052 , H05K1/023 , H05K9/0035
摘要： An electronic device includes a printed circuit board (PCB), a first cover disposed to shield a first region of the PCB, and a second cover for shielding a second region which has at least a boundary with the first region. A corresponding boundary portion the first cover and the second cover include at least one protrusion portion and at least one recess portion which are fitted to face each other. Thus, since at least two shielding covers share the single boundary region, the component mounting region of the PCB can be efficiently utilized to thus contribute to slimness of the electronic device.

6. 发明授权

US09888586B2 Electronic device and manufacturing method of the same 有权
公开(公告)号：US09888586B2
公开(公告)日：2018-02-06
申请号：US15405256
申请日：2017-01-12
申请人： Samsung Electronics Co., Ltd
发明人： Jung-Je Bang , Yong-Won Lee , Jeong-Ung Kim , Jae-Heung Ye
IPC分类号： H05K9/00 , H05K5/00 , H01R4/02 , H05K1/18
CPC分类号： H05K5/0004 , H01R4/02 , H05K1/18 , H05K5/0086 , H05K9/0007 , H05K9/0028
摘要： According to embodiments, an electronic device includes: a housing including a face facing a first direction; a circuit board including first and second board faces substantially parallel to the face, and a side board face facing a second direction, the circuit board disposed within the housing; a first component disposed in a first region of the first board face; a second component disposed in a second region of the second board face overlapping with the first region; a first shield including a first side wall formed facing the second direction, the first shield covering the first region; a second shield including a second side wall formed facing the second direction, the second shield covering the second region; and a bonding material formed between the first side wall or second side wall and the side board face. The electronic device as described above may be variously implemented according to embodiments.

7. 发明申请

US20140362543A1 SHIELD CAN ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME 审中-公开
标题翻译：屏蔽CAN组装和电子设备，包括它们
公开(公告)号：US20140362543A1
公开(公告)日：2014-12-11
申请号：US14302387
申请日：2014-06-11
申请人： Samsung Electronics Co., Ltd.
发明人： Ki-Youn Jang , Jeong-Ung Kim , Jung-Je Bang , Sang-Hyun An
IPC分类号： H05K1/02
CPC分类号： H05K9/0052 , H05K1/023 , H05K9/0035
摘要： An electronic device includes a printed circuit board (PCB), a first cover disposed to shield a first region of the PCB, and a second cover for shielding a second region which has at least a boundary with the first region. A corresponding boundary portion the first cover and the second cover include at least one protrusion portion and at least one recess portion which are fitted to face each other. Thus, since at least two shielding covers share the single boundary region, the component mounting region of the PCB can be efficiently utilized to thus contribute to slimness of the electronic device.
摘要翻译：电子设备包括印刷电路板（PCB），设置成屏蔽PCB的第一区域的第一盖和用于屏蔽与第一区域至少具有边界的第二区域的第二盖。第一盖和第二盖的相应的边界部分包括至少一个突出部分和至少一个彼此相对配合的凹部。因此，由于至少两个屏蔽罩共享单个边界区域，因此能够有效地利用PCB的部件安装区域，从而有助于电子设备的薄型化。

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