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1. 发明申请

US20220165479A1 COIL COMPONENT 有权
公开(公告)号：US20220165479A1
公开(公告)日：2022-05-26
申请号：US17191971
申请日：2021-03-04
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Ji Young PARK , Myoung Soon PARK , Sung Hee KIM , Han Kyeol KIM
IPC分类号： H01F27/28 , H01F27/29 , H01F27/32 , H01F41/12 , H01F41/04
摘要： A coil component includes a body, a support substrate disposed in the body, a coil portion including a first lead-out pattern disposed on a first surface of the support substrate, a first dummy pattern portion disposed to be spaced apart from the first lead-out pattern on the first surface of the support substrate, and a first external electrode disposed on the body to be connected to the first lead-out pattern, wherein the first lead-out pattern and the first dummy pattern portion are exposed to a first surface of the body to be spaced apart from each other, and the first surface of the support substrate, supporting the first lead-out pattern and the first dummy pattern portion, is continuously exposed to the first surface of the body.

2. 发明申请

US20150155097A1 MULTILAYER CERAMIC CAPACITOR, MANUFACTURING METHOD THEREOF, AND BOARD HAVING THE SAME MOUNTED THEREON 有权
标题翻译：多层陶瓷电容器及其制造方法及其安装的板
公开(公告)号：US20150155097A1
公开(公告)日：2015-06-04
申请号：US14186855
申请日：2014-02-21
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Min Hoe KIM , Ji Young PARK
IPC分类号： H01G4/008 , H01G4/30 , H01G13/00 , H01G4/012 , H05K1/18 , H05K1/11 , H01G4/248 , H01G4/12
CPC分类号： H01G4/008 , H01G2/06 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/30 , H01G13/00 , Y10T29/417
摘要： There is provided a multilayer ceramic capacitor including: a ceramic body having a plurality of dielectric layers and having first and second end surfaces opposing each other; a first internal electrode formed on each of the dielectric layers, including a first insulating part exposed to the second end surface, and exposed to the first end surface; a second internal electrode disposed to face the first internal electrode, having the dielectric layer interposed therebetween, and exposed to the first and second end surfaces; and a second insulating part formed on an edge of the second internal electrode exposed to the first end surface.
摘要翻译：提供了一种多层陶瓷电容器，其包括：具有多个电介质层并且具有彼此相对的第一和第二端表面的陶瓷体; 形成在每个电介质层上的第一内部电极，包括暴露于第二端面的第一绝缘部分，并暴露于第一端面; 第二内部电极，其设置成面对所述第一内部电极，所述第二内部电极具有介电层，并且暴露于所述第一和第二端面; 以及形成在暴露于第一端面的第二内部电极的边缘上的第二绝缘部。

3. 发明申请

US20130294008A1 MULTILAYER ELECTRONIC COMPONENTS AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：多层电子元件及其制造方法
公开(公告)号：US20130294008A1
公开(公告)日：2013-11-07
申请号：US13801102
申请日：2013-03-13
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Jong Han KIM , Su Hwan CHO , Doo Young KIM , Ji Young PARK , Jae Yeol CHOI
IPC分类号： H01G4/008
CPC分类号： H01G4/008 , H01G4/0085 , H01G4/30
摘要： The present invention relates to a multilayer electronic component having a structure in which a dielectric layer and an internal electrode layer are alternately laminated, which includes the dielectric layer and the internal electrode layer including metal powder and an inhibitor, wherein the inhibitor includes 0.5 to 20 mol % of a Ca component based on 100 mol % of a barium titanate (BT) base material, and a method for manufacturing the same.According to the present invention, it is possible to provide a multilayer electronic component that can implement excellent electrical characteristics and electrode connectivity by adding a Ca component to an internal electrode layer as a sub-component of the inhibitor to minimize the occurrence of oxygen vacancies on the interface formed when the inhibitor component included in the internal electrode layer moves to the dielectric layer.
摘要翻译：本发明涉及一种具有交替层叠电介质层和内部电极层的结构的多层电子部件，其包括电介质层和包含金属粉末和抑制剂的内部电极层，其中抑制剂包括0.5〜20 基于100摩尔％的钛酸钡（BT）基材的Ca成分的摩尔％及其制造方法。根据本发明，可以提供一种可以通过向作为抑制剂的副成分的内部电极层添加Ca成分来实现优异的电气特性和电极连接性的多层电子部件，以最小化氧空位的发生当包含在内部电极层中的抑制剂组分移动到电介质层时形成的界面。

4. 发明申请

US20220181065A1 COIL COMPONENT 有权
公开(公告)号：US20220181065A1
公开(公告)日：2022-06-09
申请号：US17369164
申请日：2021-07-07
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Jung Hyuk JUNG , Ji Young PARK , Yu Jung PARK
IPC分类号： H01F27/255 , H01F27/02 , H01F27/28 , H01F41/02 , H01F27/29 , H01F17/04
摘要： A coil component includes a body having a first surface and a second surface opposing each other and a plurality of wall surfaces connecting the first surface to the second surface, and including insulating resin and magnetic metal powder particles; an insulating substrate disposed in the body; a coil portion disposed on the insulating substrate and including a lead-out pattern exposed to a first wall surface of the plurality of wall surfaces of the body; and an external electrode disposed on the body and connected to the lead-out pattern. Some of the magnetic metal powder particles are exposed to each of the plurality of wall surfaces of the body. The magnetic metal powder particles exposed to the first wall surface of the body have a cut-out surface. The magnetic metal powder particles exposed to a second wall surface connected to the first wall surface of the plurality of wall surfaces of the body do not have a cut-out surface.

5. 发明申请

US20140020942A1 LAMINATED CHIP ELECTRONIC COMPONENT, BOARD FOR MOUNTING THE SAME, AND PACKING UNIT THEREOF 有权
标题翻译：层压电子元件，用于安装的组件及其包装单元
公开(公告)号：US20140020942A1
公开(公告)日：2014-01-23
申请号：US13714104
申请日：2012-12-13
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Hang Kyu CHO , Young Ghyu AHN , Jae Yeol CHOI , Doo Young KIM , Seok Hyun YOON , Ji Young PARK
IPC分类号： H01G4/30 , H05K1/18
CPC分类号： H01G4/30 , H01G2/065 , H05K1/181 , H05K3/3442 , H05K2201/10015 , H05K2201/2045 , Y02P70/613
摘要： A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes covering end portions of the ceramic body in length direction; an active layer in which the internal electrodes are disposed in opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in thickness direction, the lower cover layer thicker than the upper cover layer.
摘要翻译：层叠芯片电子部件包括：陶瓷体，其包括内部电极和电介质层; 外部电极在长度方向覆盖陶瓷体的端部; 其中内部电极以相对的方式设置，同时具有介于其间的电介质层的有源层以形成电容; 以及在有源层的厚度方向的上部和下部形成的上部和下部覆盖层，下部覆盖层比上部覆盖层更厚。

6. 发明申请

US20220189678A1 COIL COMPONENT 有权
公开(公告)号：US20220189678A1
公开(公告)日：2022-06-16
申请号：US17194656
申请日：2021-03-08
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Ji Su JEON , Ji Young PARK
IPC分类号： H01F27/28 , H01F27/29 , H01F27/24 , H01F27/32 , H01F41/04
摘要： A coil component includes a body having first and second end surfaces opposing each other and first and second side surfaces opposing each other in a first direction; a support substrate disposed in the body; and a coil portion including a first coil pattern disposed on the support substrate, and first and second lead-out patterns respectively exposed to the first and second end surfaces of the body. A distance between the first side surface of the body and the first lead-out pattern in the first direction is smaller than a distance between the second side surface of the body and the first lead-out pattern in the first direction, and a distance between the first side surface of the body and the second lead-out pattern in the first direction is smaller than a distance between the second side surface of the body and the second lead-out pattern in the first direction.

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