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1. 发明申请

US20190097468A1 MOBILE TERMINAL, COMMUNICATIONS MODULE AND CONTROL METHOD OF MOBILE TERMINAL 审中-公开
公开(公告)号：US20190097468A1
公开(公告)日：2019-03-28
申请号：US16014211
申请日：2018-06-21
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Ji Hoon KIM , Tae Seok KO , Dong Yeol LEE , Ju Hyoung PARK , Sang Beom LEE
IPC分类号： H02J50/60 , H02J50/80 , H04W52/02 , G06K7/10
CPC分类号： H02J50/60 , G06K7/10 , G06K7/10128 , H02J50/12 , H02J50/80 , H04W52/0229
摘要： A mobile terminal includes a communication controller configured to detect a wireless tag in a mobile environment and a wireless charging controller configured to receive power wirelessly, and control the communication controller to determine whether the wireless tag is in the mobile environment, in response to receiving a wake-up power signal from a wireless power transfer apparatus.

2. 发明申请

US20180197827A1 FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME 审中-公开
公开(公告)号：US20180197827A1
公开(公告)日：2018-07-12
申请号：US15913270
申请日：2018-03-06
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Ji Hyun LEE , Kyoung Moo HARR , Seung Yeop KOOK , Ji Hoon KIM , Young Gwan KO
IPC分类号： H01L23/00 , H01L21/56 , H01L21/48 , H01L23/538 , H01L23/31
CPC分类号： H01L23/562 , H01L21/4853 , H01L21/4857 , H01L21/486 , H01L21/565 , H01L21/568 , H01L23/3135 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2924/18162 , H01L2924/3025 , H01L2924/3511
摘要： The present disclosure relates to a fan-out semiconductor package including a frame having a through hole, a semiconductor chip disposed in the through hole, a first encapsulant disposed in a space between the frame and the semiconductor chip, a second encapsulant disposed on one sides of the frame and the semiconductor chip, and a redistribution layer disposed on the other sides of the frame and the semiconductor chip, and a method of manufacturing the same. The first encapsulant and the second encapsulant may include different materials.

3. 发明申请

US20160189861A1 POWER TRANSMITTING COIL STRUCTURE AND WIRELESS POWER TRANSMITTING APPARATUS INCLUDING THE SAME 审中-公开
标题翻译：发电线圈结构及无线电力传输装置
公开(公告)号：US20160189861A1
公开(公告)日：2016-06-30
申请号：US14980276
申请日：2015-12-28
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Isaac NAM , Jae Suk SUNG , Chul Gyun PARK , Ji Hoon KIM , Ki Won CHANG
IPC分类号： H01F38/14 , H02J7/02 , H02J5/00
CPC分类号： H02J50/10 , H01F38/14 , H02J7/025 , H02J50/12 , H02J50/50 , H02J50/90
摘要： A power transmitting coil structure and a wireless power transmitting apparatus including the same are provided. The power transmitting coil includes a first coil which is wound to have a circular or polygonal shape and at least one sub coil positioned within the first coil. A magnetic field region formed by the first coil is different from a magnetic field region formed by the at least one sub coil.
摘要翻译：提供了一种发送线圈结构和包括该发送线圈结构的无线电力发送装置。动力传递线圈包括卷绕成具有圆形或多边形形状的第一线圈和位于第一线圈内的至少一个副线圈。由第一线圈形成的磁场区域与由至少一个子线圈形成的磁场区域不同。

4. 发明申请

US20150253896A1 TOUCHSCREEN APPARATUS AND METHOD OF SENSING TOUCH 审中-公开
标题翻译：触摸屏设备和感应触摸方法
公开(公告)号：US20150253896A1
公开(公告)日：2015-09-10
申请号：US14295503
申请日：2014-06-04
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Su Jong KIM , Ji Hoon KIM , Yoon Seok OH , Do Sang KWON , Hyun Suk LEE
IPC分类号： G06F3/044
CPC分类号： G06F3/044 , G06F3/0418
摘要： A touchscreen apparatus may include: a panel unit including a plurality of first electrodes and a plurality of second electrodes intersecting with the plurality of first electrodes, and a calculating unit obtaining a plurality of pieces of digital data generated from capacitance of node capacitors formed in intersections between the plurality of first electrodes and the plurality of second electrodes. The calculating unit calculates a noise reference level of a current frame using a plurality of pieces of digital data of the current frame and a plurality of pieces of digital data of a previous frame.
摘要翻译：触摸屏设备可以包括：面板单元，包括多个第一电极和与多个第一电极相交的多个第二电极，以及计算单元，获得由交叉点形成的节点电容器的电容产生的多个数字数据在所述多个第一电极和所述多个第二电极之间。计算单元使用当前帧的多个数字数据和前一帧的多个数字数据来计算当前帧的噪声参考水平。

5. 发明申请

US20140177559A1 DATA COMMUNICATION METHOD IN NON-BEACON WIRELESS NETWORK AND NON-BEACON WIRELESS NETWORK COMMUNICATION SYSTEM 审中-公开
标题翻译：非网络无线网络和非网络无线网络通信系统中的数据通信方法
公开(公告)号：US20140177559A1
公开(公告)日：2014-06-26
申请号：US14137103
申请日：2013-12-20
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Sung Ho HWANG , Ji Hoon KIM , Bo Yle SEO , Chung Hee LEE
IPC分类号： H04W74/00
CPC分类号： H04W74/002 , H04W74/0816
摘要： The present invention relates to a data communication method in a non-beacon wireless network and a non-beacon wireless network communication system. In accordance with an embodiment of the present invention, a data communication method in a non-beacon wireless network including: checking whether a coordinator uses a channel or not by a first end node; transmitting a first control information message including its ID and data size to the coordinator after checking whether the channel is busy or not by the first end node; broadcasting broadcast_ACK information including the ID and the data size by the coordinator receiving the first control information message; and transmitting first transmit_data to the coordinator by the first end node receiving the broadcast_ACK information, wherein the data size is the size of the first transmit_data is provided. Further, a non-beacon wireless network communication system is provided.
摘要翻译：本发明涉及非信标无线网络和非信标无线网络通信系统中的数据通信方法。根据本发明的实施例，在非信标无线网络中的数据通信方法包括：检查协调器是否由第一端节点使用信道; 在所述第一端节点检查所述信道是否忙之后，向所述协调器发送包括其ID和数据大小的第一控制信息消息; 通过接收第一控制信息消息的协调器广播包括ID和数据大小的broadcast_ACK信息; 以及由所述第一端节点接收所述broadcast_ACK信息，向所述协调器发送第一传输数据，其中，所述数据大小是提供所述第一传输数据的大小。此外，提供非信标无线网络通信系统。

6. 发明申请

US20180342452A1 FAN-OUT SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME 审中-公开
公开(公告)号：US20180342452A1
公开(公告)日：2018-11-29
申请号：US16038956
申请日：2018-07-18
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Sun Ho KIM , Ji Hoon KIM , Ha Young AHN , Shang Hoon SEO , Seung Yeop KOOK , Sung Won JEONG
IPC分类号： H01L23/498 , H01L23/00 , H01L23/31 , H01L23/538 , H01L23/13
CPC分类号： H01L23/49838 , H01L23/13 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/5389 , H01L24/05 , H01L24/19 , H01L24/20 , H01L2224/02331 , H01L2224/02373 , H01L2224/02379 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2924/18162 , H01L2924/3512
摘要： A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.

7. 发明申请

US20150193068A1 METHOD AND APPARATUS FOR SENSING TOUCH PRESSURE OF TOUCH PANEL AND TOUCH SENSING APPARATUS USING THE SAME 审中-公开
标题翻译：用于感应触摸面板和触摸感应装置的感应压力的方法和装置
公开(公告)号：US20150193068A1
公开(公告)日：2015-07-09
申请号：US14581273
申请日：2014-12-23
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Ji Hoon KIM
IPC分类号： G06F3/041
CPC分类号： G06F3/0416
摘要： Disclosed herein is a method for sensing a touch pressure of a touch panel, including: sensing a bending time of a touch panel based on touch sensing signals; and determining a touch pressure based on the touch sensing signals at the bending time and a current touch sensing signal, thereby extracting information on the touch pressure without using a pressure sensor and applying the extracted pressure information to determine a gesture and to be used in various user applications.
摘要翻译：本文公开了一种用于感测触摸面板的触摸压力的方法，包括：基于触摸感测信号感测触摸面板的弯曲时间; 并且基于弯曲时间的触摸感测信号和当前触摸感测信号来确定触摸压力，从而在不使用压力传感器的情况下提取关于触摸压力的信息并且应用所提取的压力信息来确定手势并且以各种方式使用用户应用程序。

8. 发明申请

US20140168112A1 TOUCH SENSING METHOD AND TOUCH SENSING APPARATUS 审中-公开
标题翻译：触摸感应方法和触摸感应装置
公开(公告)号：US20140168112A1
公开(公告)日：2014-06-19
申请号：US13904685
申请日：2013-05-29
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Ji Hoon KIM , Yoon Seok Oh , Sang Hyun Sim , Hyun Suk Lee
IPC分类号： G06F3/041
CPC分类号： G06F3/0418
摘要： There are provided a touch sensing apparatus and a touch sensing method. The touch sensing method includes: obtaining sensed data from a touchscreen and a touch key;determining whether a touch has been applied to the touch key; and when it is determined that a touch has been applied to the touch key, whether to apply one or more noise canceling algorithms is determined based on the sensed data obtained from the touchscreen.
摘要翻译：提供了触摸感测装置和触摸感测方法。触摸感测方法包括：从触摸屏和触摸键获取感测数据; 确定触摸是否已被应用于触摸键; 并且当确定已经对触摸键进行了触摸时，基于从触摸屏获得的感测数据来确定是否应用一个或多个噪声消除算法。

9. 发明申请

US20170271272A1 FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME 审中-公开
公开(公告)号：US20170271272A1
公开(公告)日：2017-09-21
申请号：US15352100
申请日：2016-11-15
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Ji Hyun LEE , Kyoung Moo HARR , Seung Yeop KOOK , Ji Hoon KIM , Young Gwan KO
IPC分类号： H01L23/00 , H01L21/56 , H01L21/48 , H01L23/538 , H01L23/31
CPC分类号： H01L23/562 , H01L21/4853 , H01L21/4857 , H01L21/486 , H01L21/565 , H01L21/568 , H01L23/3135 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2924/18162 , H01L2924/3025 , H01L2924/3511
摘要： The present disclosure relates to a fan-out semiconductor package including a frame having a through hole, a semiconductor chip disposed in the through hole, a first encapsulant disposed in a space between the frame and the semiconductor chip, a second encapsulant disposed on one sides of the frame and the semiconductor chip, and a redistribution layer disposed on the other sides of the frame and the semiconductor chip, and a method of manufacturing the same. The first encapsulant and the second encapsulant may include different materials.

10. 发明申请

US20170133309A1 FAN-OUT SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME 审中-公开
公开(公告)号：US20170133309A1
公开(公告)日：2017-05-11
申请号：US15336288
申请日：2016-10-27
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Sun Ho KIM , Ji Hoon KIM , Ha Young AHN , Shang Hoon SEO , Seung Yeop KOOK , Sung Won JEONG
IPC分类号： H01L23/498 , H01L23/00 , H01L23/31
CPC分类号： H01L23/49838 , H01L23/13 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/5389 , H01L24/05 , H01L24/19 , H01L24/20 , H01L2224/02331 , H01L2224/02373 , H01L2224/02379 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2924/18162 , H01L2924/3512
摘要： A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.

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