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    • 8. 发明申请
    • METHOD FOR CUTTING A LAMINATED ULTRA-THIN GLASS LAYER
    • 切割层压超薄玻璃层的方法
    • US20170066679A1
    • 2017-03-09
    • US15122898
    • 2015-01-14
    • SAINT-GOBAIN GLASS FRANCE
    • Li-Ya YEH
    • C03B33/09C03B33/07
    • C03B33/093B23K2103/42B23K2103/54C03B33/074C03B33/078C03B33/091
    • A method and a device for cutting a laminate including at least one glass layer with a thickness less than or equal to 0.3 mm and including at least one polymeric layer are disclosed. The method includes generating a surface scratch on a first surface of the glass layer, wherein the scratch, starting from a lateral edge, extends along a cutting line. The method further includes moving a first laser beam, starting from the scratch, across the first surface along the cutting line. The method also includes cooling the glass layer along the cutting line, wherein the glass layer breaks along the cutting line The polymeric layer is severed by moving a second laser beam along the cutting line. The device includes means for cutting the laminate according to the disclosed method.
    • 公开了一种用于切割包括至少一个厚度小于或等于0.3mm并且包括至少一个聚合物层的玻璃层的层压体的方法和装置。 该方法包括在玻璃层的第一表面上产生表面划痕,其中从横向边缘开始的划痕沿着切割线延伸。 该方法还包括沿切割线移动第一激光束,从划痕开始穿过第一表面。 该方法还包括沿着切割线冷却玻璃层,其中玻璃层沿着切割线断裂通过沿着切割线移动第二激光束来切断聚合物层。 该装置包括根据所公开的方法切割层压体的装置。