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    • 1. 发明授权
    • Low programming voltage anti-fuse
    • 低编程电压反熔丝
    • US6096580A
    • 2000-08-01
    • US405331
    • 1999-09-24
    • S. Sundar Kumar IyerLiang-Kai HanRobert HannonSubramanian S. IyerMukesh V. Khare
    • S. Sundar Kumar IyerLiang-Kai HanRobert HannonSubramanian S. IyerMukesh V. Khare
    • H01L23/525H01L21/82
    • H01L23/5252H01L2924/0002
    • A low programming voltage anti-fuse formed by a MOSFET (or MOS) or by a deep trench (DT) capacitor structure is described. Lowering the programming voltage is achieved by implanting a dose of heavy ions, such as indium, into the dielectric directly on the substrate or indirectly through a layer of polysilicon. The programming voltage can also be lowered on the MOSFET/MOS capacitor anti-fuse by accentuating the corners of active areas and gate areas of the device with suitable layout masks during processing. Silicon active area corner rounding steps should also be avoided in the fabrication of the anti-fuse to reduce the programming voltage. In the DT capacitor, lowering the programming voltage may be achieved by implanting the node dielectric of the DT anti-fuse with heavy ions either directly or through a conformal layer of polysilicon deposited on it or after the first amorphous silicon recess step during the fabrication of the DT capacitor.
    • 描述了由MOSFET(或MOS)或深沟槽(DT)电容器结构形成的低编程电压反熔丝。 降低编程电压可以通过将一定剂量的重离子(如铟)直接注入到基底上的电介质或间接通过多晶硅层来实现。 通过在处理期间通过适当的布局掩模强调器件的有源区域和栅极区域的角,也可以在MOSFET / MOS电容器反熔丝上降低编程电压。 在制造抗熔丝的同时,也应避免硅有源区四舍五入步骤,以减少编程电压。 在DT电容器中,降低编程电压可以通过直接或通过沉积在其上的多晶硅的保形层或在第一非晶硅凹槽步骤之后的重离子注入DT反熔丝的节点电介质来实现, DT电容器。
    • 6. 发明授权
    • System for programming fuse structure by electromigration of silicide enhanced by creating temperature gradient
    • 通过产生温度梯度增强硅化物电迁移来编程熔丝结构的系统
    • US06624499B2
    • 2003-09-23
    • US10247415
    • 2002-09-19
    • Chandrasekharan KothandaramanS. Sundar Kumar IyerSubramanian IyerChandrasekhar Narayan
    • Chandrasekharan KothandaramanS. Sundar Kumar IyerSubramanian IyerChandrasekhar Narayan
    • H01L2900
    • H01L23/5256H01L2924/0002H01L2924/00
    • The present invention provides a system, apparatus and method of programming via electromigration. A semiconductor fuse which includes a cathode and an anode coupled by a fuse link having an electrically conductive component, such as silicide, is coupled to a power supply. A potential is applied across the conductive fuse link via the cathode and anode in which the potential is of a magnitude to initiate electromigration of silicide from a region of the semiconductor fuse reducing the conductivity of the fuse link. The electromigration is enhanced by effectuating a temperature gradient between the fuse link and one of the cathode and anode responsive to the applied potential. Portions of the semiconductor fuse are selectively cooled in a heat transfer relationship to increase the temperature gradient. In one embodiment, a heat sink is applied to the cathode. The heat sink can be a layer of metal coupled in close proximity to the cathode while insulated from the fuse link. In another embodiment, the temperature gradient is increased by selectively varying the thickness of the underlying oxide layer such that the cathode is disposed on a thinner layer of oxide than the fuse link.
    • 本发明提供一种通过电迁移编程的系统,装置和方法。 包括阴极和由具有诸如硅化物之类的导电部件的熔丝连接的阳极的半导体熔丝被耦合到电源。 电势通过阴极和阳极施加在导电熔丝连接上,其中电位为大小以引发硅化物从半导体熔丝的区域的电迁移,从而降低熔丝链的导电性。 响应于所施加的电位,通过实现熔丝链和阴极和阳极中的一个之间的温度梯度来增强电迁移。 半导体保险丝的一部分以热传递关系被选择性地冷却以增加温度梯度。 在一个实施例中,将散热器施加到阴极。 散热器可以是在与熔丝连接绝缘的情况下紧邻阴极耦合的金属层。 在另一个实施方案中,通过选择性地改变下面的氧化物层的厚度使得阴极设置在比熔丝链更薄的氧化物层上来增加温度梯度。