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    • 6. 发明授权
    • Composite plating apparatus and apparatus for dispersing air bubbles
within a composite plating solution
    • 复合电镀装置和用于在复合电镀液中分散气泡的装置
    • US5620575A
    • 1997-04-15
    • US364320
    • 1994-12-27
    • Hitoshi KarasawaHiroyuki NomuraHisayuki Sakurai
    • Hitoshi KarasawaHiroyuki NomuraHisayuki Sakurai
    • C25D7/04C25D15/02
    • C25D15/02C25D7/04
    • A composite plating apparatus is disclosed in which an insertion electrode is loosely inserted into a hollow cylinder having a space, air bubbles are mixed into a composite plating solution fed from a liquid feeding pipe toward the space in the cylinder, and the hollow cylinder is connected to a base electrode so as to perform a composite plating on the inner surface of the hollow cylinder. An air bubble dispersing member having at least one passage hole with a diameter the same as or larger than a length of a gap defined between the insertion electrode and the inner surface of the cylinder is arranged upstream of a plating solution inlet portion of the hollow cylinder as an apparatus for dispersing air bubbles within the composite plating solution. The air bubble dispersing member can also be used as an electrode engaging member for engaging a tip end portion of the electrode inserted into the hollow cylinder.
    • 公开了一种复合电镀装置,其中插入电极松动地插入具有空间的中空圆柱体中,将气泡混合到从液体供给管朝向气缸中的空间供给的复合电镀溶液中,并且连接中空圆筒 到基极,以在中空圆筒的内表面上进行复合电镀。 具有直径等于或大于插入电极和气缸内表面之间的间隙的长度的至少一个通孔的气泡分散构件设置在中空圆筒的电镀液入口部分的上游 作为在复合镀液中分散气泡的装置。 气泡分散部件也可以用作与插入中空圆筒的电极的前端部接合的电极接合部件。