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    • 1. 发明授权
    • Light-emitting display
    • 发光显示
    • US07903055B2
    • 2011-03-08
    • US11579215
    • 2005-04-27
    • Ryuji NishikawaTetsuji Omura
    • Ryuji NishikawaTetsuji Omura
    • G09G3/30
    • H01L51/5262H01L27/3213H01L27/322H01L27/3258H01L51/5209H01L51/5265H01L2251/558H05B33/22
    • Disclosed is a light-emitting display having a plurality of pixels wherein each pixel comprises a light-emitting device (100) having a light-emitting element layer which is formed between a first electrode and a second electrode and contains at least a light-emitting layer. An insulating layer (30) is formed between the light-emitting device (100) and a surface of a first or second substrate on the viewing side of the display, and the insulating layer (30) is provided with recesses and projections in at least one or more pixel regions, thereby forming an optical path length adjusting portion (32). By forming such an optical path length adjusting portion (32) in a pixel region, there is an increase in the interference conditions for the light emitted from the light-emitting device (100) to the outside, thereby averaging the interference.
    • 公开了一种具有多个像素的发光显示器,其中每个像素包括具有发光元件层的发光器件(100),发光元件层形成在第一电极和第二电极之间,并且至少包含发光 层。 在发光装置(100)和显示器的观看侧的第一或第二基板的表面之间形成绝缘层(30),绝缘层(30)至少设置有凹部和凸部 一个或多个像素区域,从而形成光路长度调节部分(32)。 通过在像素区域中形成这样的光路长度调整部(32),从发光装置(100)发射到外部的光的干涉条件增加,从而平均干涉。
    • 4. 发明授权
    • Display panel manufacturing method and display panel
    • 显示面板制造方法和显示面板
    • US07572162B2
    • 2009-08-11
    • US10586821
    • 2005-06-13
    • Tetsuji OmuraRyuji Nishikawa
    • Tetsuji OmuraRyuji Nishikawa
    • H01J9/00
    • H01L51/5246
    • A frame-shaped groove is formed on a panel adhering part of a sealing board, a paste including low melting point glass powder is buried in the groove, and a frame-shaped glass paste layer is formed. A solvent included in the glass paste layer is volatilized for solidification, and a low melting point glass frame is provided. Then, the low melting point glass frame protruded on the surface of the sealing board is removed, and the surface of a plane including the surface of the adhering part of the sealing board is flattened. A low heat resistant layer is formed on the flattened adhering plane of the sealing board. The sealing board is arranged to face an element board at a prescribed interval, laser beams are applied on the low melting point glass frame through the element board, and the area is heated. Thus, the low melting point glass rises, and the sealing board is welded with the element board.
    • 在密封板的面板粘接部上形成框状的槽,将含有低熔点玻璃粉末的糊料埋入槽内,形成框状的玻璃浆料层。 包含在玻璃浆料层中的溶剂挥发以固化,并且提供低熔点玻璃框架。 然后,去除在密封板表面上突出的低熔点玻璃框架,使包含密封板的粘合部分的表面的平面的表面变平。 在密封板的平坦化粘合面上形成低耐热层。 密封板配置成以规定的间隔与元件板对置,激光束通过元件板施加在低熔点玻璃框架上,并且该区域被加热。 因此,低熔点玻璃升高,密封板与元件板焊接。