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    • 2. 发明授权
    • Panel assembling method
    • 面板组装方式
    • US4293363A
    • 1981-10-06
    • US45437
    • 1979-06-04
    • Makoto WakabayashiHaruyoshi Takagishi
    • Makoto WakabayashiHaruyoshi Takagishi
    • C09J5/06F16B11/00
    • F16B11/006C09J5/06Y10T29/49826Y10T29/49885Y10T29/49892
    • A panel assembling method is disclosed which comprises the steps of coating a thermosetting adhesive on the connection area of a first panel to be fixed to the connection area of a second panel, mating the connection areas of the first and second panels, heating a portion of the connection area of the first or second panel to set the adhesive on the portion, by passing a current, possibly a high-frequency current, through the portion between electrodes which are contacted to it, thereby temporarily assembling the first and second panels, and subsequently heating all of the connection area of the first or second panel to set the adhesive entirely on the connection area. An apparatus for partially setting the thermosetting adhesive is also disclosed.
    • 公开了一种面板组装方法,其包括以下步骤:在第一面板的连接区域上涂覆热固性粘合剂以固定到第二面板的连接区域,配合第一和第二面板的连接区域,加热部分 通过使电流(可能的高频电流)通过与其接触的电极之间的部分,从而临时组装第一和第二面板,使第一或第二面板的连接区域设置在该部分上的粘合剂,以及 随后加热第一或第二面板的所有连接区域,以将粘合剂完全设置在连接区域上。 还公开了一种用于部分固化热固性粘合剂的设备。