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    • 9. 发明申请
    • Substrate for electronic device and method of manufacturing the same
    • 电子器件用基板及其制造方法
    • US20060219607A1
    • 2006-10-05
    • US11366733
    • 2006-03-02
    • Mitsuru SatoRyo Matsushita
    • Mitsuru SatoRyo Matsushita
    • B03C1/00
    • H01L27/3248B82Y10/00B82Y30/00G02F1/136227H01L27/124
    • A substrate for an electronic device according to the present invention includes a base substrate and a switching device formed on the base substrate. The switching device has a terminal. The substrate also includes an interlayer dielectric formed so as to cover the switching device. The interlayer dielectric has a contact hole extending therethrough so as to communicate with the terminal of the switching device. The substrate has a pixel electrode formed on the interlayer dielectric and an electrically connecting portion connected to the pixel electrode. The electrically connecting portion includes a conductive film formed on an inner surface of the contact hole and a surface of the terminal by a vapor phase process. The electrically connecting portion also includes a filler material filled in a space inside of the conductive film within the contact hole.
    • 根据本发明的电子器件用基板包括基底基板和形成于基底基板上的开关元件。 开关装置具有端子。 衬底还包括形成为覆盖开关器件的层间电介质。 层间电介质具有贯穿其中的接触孔,以与开关器件的端子连通。 衬底具有形成在层间电介质上的像素电极和连接到像素电极的电连接部分。 电气连接部分包括形成在接触孔的内表面上的导电膜和通过气相工艺的端子表面。 电连接部分还包括填充在接触孔内的导电膜内的空间中的填充材料。