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1. 发明授权

US06195266B1 Electromechanical emissions grounding device for ultra high speed processors 失效
标题翻译：用于超高速处理器的机电放电接地装置
公开(公告)号：US06195266B1
公开(公告)日：2001-02-27
申请号：US09282838
申请日：1999-03-31
申请人： Russell S. Padgett , William D. Owsley , Rudolf E. Rehquate , Daniel J. Hunt , Edward N. Dials , A. Lamond Hodges
发明人： Russell S. Padgett , William D. Owsley , Rudolf E. Rehquate , Daniel J. Hunt , Edward N. Dials , A. Lamond Hodges
IPC分类号： H05R900
CPC分类号： H05K7/1431 , H05K9/0016
摘要： A slot-type processor and one or more cache modules are incorporated into a vertically oriented, multiple chip module (CM) that is mounted to a printed circuit board. The MCM operates at ultra high frequencies and very high temperatures. Each component of the MCM has a heatsink, a thermal plate, and a series of mounting clips and screws which combine to dissipate heat. The heatsinks and thermal plates generate most of the electromagnetic interference (EMI) since they are not attached or grounded to the board. A series of alignment posts extend from the board and are used to individually and slidably mount each of the components to the board. Each thermal plate is grounded to the posts with grounding clips. The clips maintain contact with the thermal plate through wiping elements. Additional pressure is applied to the wiping elements through a post retaining bracket. The components are fully seated and retained in position with retaining cams.
摘要翻译：插槽式处理器和一个或多个缓存模块被并入安装到印刷电路板的垂直取向的多芯片模块（CM）中。 MCM在超高频和非常高的温度下工作。 MCM的每个组件都有一个散热片，一个热板，以及一系列安装夹和螺丝，结合在一起散发热量。散热片和散热板产生大部分电磁干扰（EMI），因为它们没有连接或接地到电路板上。一系列对准柱从板延伸，并用于单独和可滑动地将每个部件安装到板上。每个热敏板通过接地夹接地到支柱上。夹子通过擦拭元件与保护板保持接触。额外的压力通过柱固定支架施加到擦拭元件上。组件完全就位并保持在保持凸轮的位置。

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