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    • 1. 发明授权
    • Module with low leakage driver circuits and method of operation
    • 具有低泄漏驱动电路的模块和操作方法
    • US06268748B1
    • 2001-07-31
    • US09073517
    • 1998-05-06
    • Claude L. BertinJohn A. FifieldRussell J. HoughtonChristopher P. MillerWilliam R. Tonti
    • Claude L. BertinJohn A. FifieldRussell J. HoughtonChristopher P. MillerWilliam R. Tonti
    • G03K19094
    • G11C7/1069G11C7/1051H03K19/0016H03K19/09429
    • An electronic semiconductor module, either memory or logic, having a driver circuit which includes a multiplicity of driver transistors, together with circuitry for simultaneously applying a first positive bias to a first select number of driver transistors to activate them to an operational state, a second positive bias to a second select number of driver transistors to place them in readiness for activation, and a negative bias to the remaining driver transistors to place them in a fully inactive state thereby reducing noise in the driver circuit. The first positive bias is greater than the transistor threshold voltage, preferably greater than two volts, the second positive bias is less than the threshold voltage, preferably less than one volt, and the negative bias is in the order of minus 0.3 volt. A method of reducing noise in the electronic semiconductor module is also described and includes the applying of a positive bias to a first select number of the transistors to activate them while simultaneously applying a second positive bias to a second select number of the transistors to ready them for activation, and a negative voltage to the remaining transistors to place each in a inactive condition.
    • 一种电子半导体模块,无论是存储器还是逻辑,具有包括多个驱动器晶体管的驱动器电路,以及用于同时向第一选择数量的驱动器晶体管施加第一正偏置以将其激活到操作状态的电路,第二 对第二选择数量的驱动器晶体管施加正偏置以使它们准备激活,以及对其余驱动器晶体管的负偏置以将它们置于完全无效状态,从而降低驱动器电路中的噪声。 第一正偏压大于晶体管阈值电压,优选大于2伏,第二正偏压小于阈值电压,优选小于1伏特,负偏压为零下0.3伏。 还描述了降低电子半导体模块中的噪声的方法,并且包括将正偏压施加到第一选择数量的晶体管以激活它们,同时向第二选择数量的晶体管施加第二正偏置以准备它们 用于激活,并且向剩余晶体管施加负电压以使其处于非活动状态。
    • 6. 发明授权
    • Methods and apparatus for blowing and sensing antifuses
    • 用于吹制和检测反熔丝的方法和装置
    • US06346846B1
    • 2002-02-12
    • US09466479
    • 1999-12-17
    • Claude L. BertinJohn A. FifieldRussell J. HoughtonWilliam R. TontiNicholas M. Van Heel
    • Claude L. BertinJohn A. FifieldRussell J. HoughtonWilliam R. TontiNicholas M. Van Heel
    • H01H3776
    • G11C5/145G11C17/18
    • Methods and apparatus for blowing and sensing antifuses are provided. Specifically, in a first aspect, a method is provided for changing the state of one of a plurality of antifuses by selecting one of the bank of antifuses and applying a high voltage to change the state of the selected antifuse. In second and third aspects, apparatus are provided for performing the method of the first aspect. In a fourth aspect, a method is provided for boosting a voltage that includes the steps of generating a first voltage within a first stage storage mechanism of a first stage voltage booster circuit, generating a second voltage equaling about twice the first voltage within a first and a second, second stage storage mechanism of a second stage voltage booster circuit, and generating about thrice the first voltage based on the second voltage of the second stage voltage booster circuit. In a fifth aspect, apparatus are provided for performing the method of the fourth aspect.
    • 提供了用于吹制和检测反熔丝的方法和装置。 具体地,在第一方面中,提供一种通过选择一组反熔丝中的一个并且施加高电压来改变所选择的反熔丝的状态来改变多个反熔丝之一的状态的方法。 在第二和第三方面中,提供了用于执行第一方面的方法的装置。 在第四方面,提供了一种用于升压电压的方法,包括以下步骤:在第一级升压电路的第一级存储机构内产生第一电压,产生等于第一级升压电路中第一电压的大约两倍的第二电压, 第二级升压电路的第二级第二级存储机构,并且基于第二级升压电路的第二电压产生约三倍的第一电压。 在第五方面中,提供了用于执行第四方面的方法的装置。
    • 8. 发明授权
    • Electrically programmable antifuses and methods for forming the same
    • 电子可编程反熔丝及其形成方法
    • US06388305B1
    • 2002-05-14
    • US09466495
    • 1999-12-17
    • Claude L. BertinErik L. HedbergRussell J. HoughtonMax G. LevyRick L. MohlerWilliam R. TontiWayne M. Trickle
    • Claude L. BertinErik L. HedbergRussell J. HoughtonMax G. LevyRick L. MohlerWilliam R. TontiWayne M. Trickle
    • H01L2900
    • H01L21/763H01L23/5252H01L27/10861H01L27/10894H01L2924/0002H01L2924/00
    • A first one time, voltage programmable logic element is provided in a semiconductor substrate of first conductivity type that comprises a first layer beneath a surface of the substrate, the first layer having a second conductivity type; and a trench formed through the surface and passing through the first layer. The trench comprises an interior surface, a dielectric material lining the interior surface and a conductive material filling the lined trench. The first logic element is configured so that a predetermined voltage or higher applied between the conductive material and the first layer causes a breakdown within a region of the trench. A second one time, voltage programmable logic element is provided in a semiconductor substrate of first conductivity type that comprises a first layer formed in a surface of the substrate, the first layer having a second conductivity type; and a trench formed through the surface and passing through the first layer. The trench comprises an interior surface, a first dielectric material lining the interior surface and a second dielectric material filling the lined trench. The second logic element further comprises a dielectric layer formed over a portion of the first layer and contacting the first dielectric material lining the trench at a merge location; and an electrode extending over a portion of both the dielectric layer and the filled trench. The second logic element is configured so that a predetermined voltage or higher applied between the electrode and the first layer causes a breakdown near the merge location.
    • 首先,电压可编程逻辑元件设置在第一导电类型的半导体衬底中,该第一导电类型的半导体衬底包括在衬底的表面下面的第一层,第一层具有第二导电类型; 以及通过表面形成并穿过第一层的沟槽。 沟槽包括内表面,衬在内表面的电介质材料和填充衬里沟槽的导电材料。 第一逻辑元件被配置为使得施加在导电材料和第一层之间的预定电压或更高的电压导致沟槽区域内的击穿。 第二次,电压可编程逻辑元件设置在第一导电类型的半导体衬底中,该半导体衬底包括形成在衬底的表面中的第一层,第一层具有第二导电类型; 以及通过表面形成并穿过第一层的沟槽。 沟槽包括内表面,衬在内表面的第一电介质材料和填充衬里沟槽的第二电介质材料。 第二逻辑元件还包括形成在第一层的一部分上并且在合并位置处接触衬套在沟槽上的第一介电材料的电介质层; 以及在电介质层和填充沟槽的一部分上延伸的电极。 第二逻辑元件被配置为使得施加在电极和第一层之间的预定电压或更高的电压导致合并位置附近的击穿。