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    • 8. 发明授权
    • Solvent-free, low-monomer or monomer-free polymerizable hot melt coating
process
    • 无溶剂,低单体或不含单体的聚合热熔涂层工艺
    • US4990364A
    • 1991-02-05
    • US129110
    • 1987-12-04
    • Georg BolteRudolf Hinterwaldner
    • Georg BolteRudolf Hinterwaldner
    • C08F290/08C08F299/04C09D5/46C09D157/10C09D167/00
    • C09D157/10C08F290/08C08F299/04C09D167/00
    • There are described solvent-free, low monomer or monomer-free polymerizable melt compositions suitable for the corrosion and abrasion resistant coatings of substrates and formed bodies of metal, plastic, cellulose materials and/or inorganic materials and/or the creation of a protective film with barrier properties and methods of making them. The melt compositions are particularly useful especially for use in packaging, and comprise: (a) at least one polymerizable, hydroxyl-containing polymer having an average molecular weight (Mw) of between 1,000 and 500,000 and a glass transition temperature (Tg) of .gtoreq.+20.degree. C., and/or (b) at least one polymerizable, linear unbranched and/or branched polyester and/or its copolymer having an average molecular weight (Mw) of between 800 and 50,000 and a glass transition temperature (Tg) of .gtoreq.-50.degree. C., and/or (c) a polymerizable oligomer carrying an ethylenically unsaturated group, of the following group consisting of acrylic, methacrylic, ether, ester, urethane, amide, imide, epoxide, siloxane, phenol, novolak and/or mercapto compounds having an average molecular weight (Mw) of between 400 and 10,000, and (d) if required, conventional additives. Further described are processes for preparing these melt compositions and methods of further processing these melt compositions and finishing planar substrates and/or shaped bodies with these melt compositions. Moreover, the present invention relates to a process for polymerization or curing of the melt composition.
    • 描述了适用于金属,塑料,纤维素材料和/或无机材料的基材和成型体的耐腐蚀和耐磨涂层和/或形成保护膜的无溶剂,低单体或不含单体的可聚合熔融组合物 具有阻隔性和制造它们的方法。 熔体组合物特别适用于包装,并且包含:(a)至少一种可聚合的含羟基的聚合物,其平均分子量(& Upbar&M w)为1,000至500,000,玻璃化转变温度(Tg)为 > / = + 20℃,和/或(b)至少一种可聚合的线性无支链和/或支链聚酯和/或其共聚物,其平均分子量(& Upbar&M w)为800至50,000,玻璃化转变 温度(Tg)≥5℃,和/或(c)由丙烯酸,甲基丙烯酸,醚,酯,氨基甲酸酯,酰胺,酰亚胺,环氧化物组成的下列组成的携带烯键式不饱和基团的可聚合低聚物 ,平均分子量(&Upbar&Mw)为400至10,000的硅氧烷,苯酚,酚醛清漆和/或巯基化合物,和(d)如果需要,常规的添加剂。 进一步描述了制备这些熔融组合物的方法以及使用这些熔融组合物进一步处理这些熔融组合物和整理平面基材和/或成形体的方法。 此外,本发明涉及熔融组合物的聚合或固化方法。