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1. 发明申请

US20190154729A1 APPARATUS AND METHOD FOR PACKAGING, HANDLING OR TESTING OF SENSORS 审中-公开
公开(公告)号：US20190154729A1
公开(公告)日：2019-05-23
申请号：US16251421
申请日：2019-01-18
申请人： Rosemount Aerospace Inc.
发明人： Jim Golden , David P. Potasek , Marcus Allen Childress
IPC分类号： G01R1/04 , B81C99/00
摘要： A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.

2. 发明授权

US09754914B1 Method to provide die attach stress relief using gold stud bumps 有权
公开(公告)号：US09754914B1
公开(公告)日：2017-09-05
申请号：US15151160
申请日：2016-05-10
申请人： Rosemount Aerospace Inc.
发明人： Jim Golden , David Barwig
IPC分类号： H01L21/56 , H01L23/00 , H01L21/48 , H01L23/498
CPC分类号： H01L23/49811 , H01L21/4853 , H01L23/562 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/48465 , H01L2224/73265 , H01L2224/8314 , H01L2224/83192 , H01L2224/83194 , H01L2224/83385 , H01L2224/83855 , H01L2224/83862 , H01L2924/00014 , H01L2924/1433 , H01L2924/3511 , H01L2224/45099 , H01L2924/0715 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/20105 , H01L2224/05599
摘要： An integrated circuit is attached to a substrate with a controlled stand-off height, by mounting a plurality of stud bumps of the controlled stand-off height to the substrate at predetermined locations, placing adhesive dots over the stud bumps, placing the integrated circuit on the substrate over the adhesive dots, and applying downward pressure on the integrated circuit until the integrated circuit is in mechanical contact with the stud bumps.

3. 发明授权

US10935569B2 Apparatus and method for packaging, handling or testing of sensors 有权
公开(公告)号：US10935569B2
公开(公告)日：2021-03-02
申请号：US16251421
申请日：2019-01-18
申请人： Rosemount Aerospace Inc.
发明人： Jim Golden , David P. Potasek , Marcus Allen Childress
IPC分类号： G01R31/00 , G01L1/00 , G01R1/04 , B81C99/00 , G01R31/28
摘要： A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.

4. 发明授权

US10782315B2 Apparatus and method for packaging, handling or testing of sensors 有权
公开(公告)号：US10782315B2
公开(公告)日：2020-09-22
申请号：US15489166
申请日：2017-04-17
申请人： Rosemount Aerospace Inc.
发明人： Jim Golden , David P. Potasek , Marcus Allen Childress
IPC分类号： G01R31/00 , G01L1/00 , G01R1/04 , B81C99/00 , G01R31/28
摘要： A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.

5. 发明申请

US20180299482A1 APPARATUS AND METHOD FOR PACKAGING, HANDLING OR TESTING OF SENSORS 审中-公开
公开(公告)号：US20180299482A1
公开(公告)日：2018-10-18
申请号：US15489166
申请日：2017-04-17
申请人： Rosemount Aerospace Inc.
发明人： Jim Golden , David P. Potasek , Marcus Allen Childress
IPC分类号： G01R1/04 , B81C99/00 , B81B7/00
摘要： A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.

6. 发明授权

US10065853B2 Optimized epoxy die attach geometry for MEMS die 有权
公开(公告)号：US10065853B2
公开(公告)日：2018-09-04
申请号：US15161724
申请日：2016-05-23
申请人： Rosemount Aerospace Inc.
发明人： Jim Golden , Robert Stuelke
IPC分类号： B81B7/00 , G01L19/14 , G01L9/00 , B81C1/00
摘要： A differential pressure sensor is a body with first and second interior channels connected to process fluid inlets and separated by a barrier. Each side of a MEMS pressure sensing diaphragm in the barrier is fluidly connected to a process fluid inlet. The diaphragm is mounted on a hollow pedestal such that one side of the diaphragm is fluidly connected to a process fluid inlet through an interior channel in the pedestal that is adhesively attached to an annular bottom of a cylindrical cavity inside the body. The other side of the diaphragm is fluidly connected to the other process fluid inlet and is fluidly isolated from the first fluid inlet by the adhesive at the bottom of the pedestal. Deformation of the diaphragm due to a pressure difference between the process fluid inlets detected by sensors on the diaphragm indicates a differential pressure.

7. 发明申请

US20170334713A1 OPTIMIZED EPOXY DIE ATTACH GEOMETRY FOR MEMS DIE 审中-公开
公开(公告)号：US20170334713A1
公开(公告)日：2017-11-23
申请号：US15161724
申请日：2016-05-23
申请人： Rosemount Aerospace Inc.
发明人： Jim Golden , Robert Stuelke
IPC分类号： B81B7/00 , B81C1/00 , G01L9/00
CPC分类号： B81B7/0061 , B81B2201/0264 , B81B2203/0127 , B81C1/00309 , B81C2203/019 , G01L9/0042 , G01L19/147
摘要： A differential pressure sensor may include a body with a first end, second end and wall wherein the first and second ends comprise isolator diaphragms connected to first and second process fluid inlets. A MEMS pressure sensor including a pressure sensing diaphragm with first and second sides may be mounted on a hollow pedestal adhesively attached to an annular bottom of a cylindrical cavity wherein the first side of the sensor is coupled to the first isolator diaphragm by a first fill fluid and the second side of the sensor is coupled to the second isolator diaphragm through the interior of the hollow pedestal by a second fill fluid volume wherein the first and second fill fluid volumes are separated by an adhesive seal between the bottom of the cylindrical cavity and the bottom of the hollow pedestal wherein the cylindrical cavity comprises a first cylindrical wall with a first diameter in contact with the annular bottom, a frustroconical portion in contact with the first cylindrical wall and in contact with a second cylindrical wall with a second diameter larger than the first diameter such that the increased distance between the pedestal and the cylindrical wall prevents adhesive moving up the space between the pedestal and cavity wall from the bottom of the cavity when the pressure sensor and hollow pedestal are mounted in the cavity. The sensor further includes sensor elements on the MEMS diaphragm that provide an indication of pressure differences between the first and second process fluids.

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