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1. 发明申请

US20100245790A1 METHOD AND SYSTEM FOR DETECTING PARTICLE CONTAMINATION IN AN IMMERSION LITHOGRAPHY TOOL 有权
标题翻译：用于检测浸入式光刻工具中颗粒污染的方法和系统
公开(公告)号：US20100245790A1
公开(公告)日：2010-09-30
申请号：US12732751
申请日：2010-03-26
申请人： Rolf Seltmann , Rene Wirtz
发明人： Rolf Seltmann , Rene Wirtz
IPC分类号： G03B27/52
CPC分类号： G03F7/70916 , G03F7/70341 , G03F7/7085
摘要： In an immersion lithography tool, the status of the immersion hood surface may be estimated on the basis of an inline detection system that generates optical measurement data. For example, a digital imaging system may be implemented in order to obtain optical measurement data without requiring exposure of the interior of the lithography tool to ambient air. In other cases, other optical measurement techniques, such as FTIR and the like, may be applied.
摘要翻译：在浸没光刻工具中，可以基于产生光学测量数据的在线检测系统来估计浸没罩表面的状态。例如，可以实现数字成像系统以获得光学测量数据，而不需要将光刻工具的内部暴露于环境空气。在其他情况下，可以应用其它光学测量技术，例如FTIR等。

2. 发明授权

US08605250B2 Method and system for detecting particle contamination in an immersion lithography tool 有权
标题翻译：浸没式光刻工具中检测颗粒污染的方法和系统
公开(公告)号：US08605250B2
公开(公告)日：2013-12-10
申请号：US12732751
申请日：2010-03-26
申请人： Rolf Seltmann , Rene Wirtz
发明人： Rolf Seltmann , Rene Wirtz
IPC分类号： G03B27/42
CPC分类号： G03F7/70916 , G03F7/70341 , G03F7/7085
摘要： In an immersion lithography tool, the status of the immersion hood surface may be estimated on the basis of an inline detection system that generates optical measurement data. For example, a digital imaging system may be implemented in order to obtain optical measurement data without requiring exposure of the interior of the lithography tool to ambient air. In other cases, other optical measurement techniques, such as FTIR and the like, may be applied.
摘要翻译：在浸没光刻工具中，可以基于产生光学测量数据的在线检测系统来估计浸没罩表面的状态。例如，可以实现数字成像系统以获得光学测量数据，而不需要将光刻工具的内部暴露于环境空气。在其他情况下，可以应用其它光学测量技术，例如FTIR等。

3. 发明申请

US20050120328A1 Method and system for increasing product yield by controlling lithography on the basis of electrical speed data 有权
标题翻译：基于电速数据控制光刻提高产品产量的方法和系统
公开(公告)号：US20050120328A1
公开(公告)日：2005-06-02
申请号：US10987427
申请日：2004-11-12
申请人： Rolf Seltmann , Heiko Wagner , Rolf Stephan
发明人： Rolf Seltmann , Heiko Wagner , Rolf Stephan
IPC分类号： G03F7/00 , G03F7/20 , G06F17/50 , H01L21/66
CPC分类号： G03F7/70658 , G03F7/70558
摘要： The electrical performance of sub-devices is detected and the corresponding measurement data is used to control a lithography process so as to compensate for any type of process variations during a manufacturing sequence.
摘要翻译：检测到子器件的电气性能，并且使用相应的测量数据来控制光刻工艺，以补偿制造顺序期间的任何类型的工艺变化。

4. 发明授权

US5496669A System for detecting a latent image using an alignment apparatus 失效
标题翻译：使用对准装置检测潜像的系统
公开(公告)号：US5496669A
公开(公告)日：1996-03-05
申请号：US204137
申请日：1994-06-27
申请人： Rainer Pforr , Steve Wittekoek , Rolf Seltmann
发明人： Rainer Pforr , Steve Wittekoek , Rolf Seltmann
IPC分类号： G03F1/08 , G03F7/20 , G03F7/207 , G03F9/00 , H01L21/027
CPC分类号： G03F7/70641 , G03F7/70675
摘要： The system comprises a latent image detection device comprising an alignment device which uses non-actinic radiation (10) and which is intended for aligning the mask pattern with respect to the substrate (3) and is designed for detecting the measure of coincidence of a mask alignment feature and a substrate alignment feature (8). The alignment device is provided with a radiation-sensitive detection system (6) which is connected to an electronic signal circuit in which the amplitude of the radiation incident on the detection system is determined, which originates from a latent image, formed in the photosensitive layer, of a mask feature, in which a spatial frequency occurs which is approximately equal to the useful resolving power of the projection lens system and considerably greater than the resolving power of the alignment device.
摘要翻译： PCT No.PCT / BE93 / 00046 Sec。 371日期1994年6月27日第 102（e）日期1994年6月27日PCT提交1993年7月1日PCT公布。出版物WO94 / 01808 日期1994年1月20日。该系统包括潜像检测装置，其包括使用非光化辐射（10）并且旨在使掩模图案相对于基板（3）对准的对准装置，并且被设计用于检测掩模对准特征和衬底对准特征（8）的重合度。对准装置设置有辐射敏感检测系统（6），其连接到电子信号电路，其中确定了入射在检测系统上的辐射的振幅，其来自形成在感光层中的潜像的掩模特征，其中发生空间频率，其大致等于投影透镜系统的有用分辨能力并且远大于对准装置的分辨率。

5. 发明授权

US08332783B2 Control of critical dimensions in optical imaging processes for semiconductor production by extracting imaging imperfections on the basis of imaging tool specific intensity measurements and simulations 有权
标题翻译：通过在成像工具特异性强度测量和模拟的基础上提取成像缺陷来控制半导体生产的光学成像过程中的关键尺寸
公开(公告)号：US08332783B2
公开(公告)日：2012-12-11
申请号：US12965488
申请日：2010-12-10
申请人： Rolf Seltmann , Stefan Roling , Francois Weisbuch
发明人： Rolf Seltmann , Stefan Roling , Francois Weisbuch
IPC分类号： G06F17/50 , G06K9/00 , G03F1/00
CPC分类号： G03F1/70 , G03F1/84 , G03F7/705 , G03F7/70616
摘要： Variations in critical dimensions of circuit features of sophisticated semiconductor devices may be reduced by efficiently extracting mask and/or imaging tool specific non-uniformities with high spatial resolution by using measured intensity values and simulated intensity values. For example, a tool internal radiation sensor may be used for measuring the intensity of an image of a lithography mask, while a simulated intensity enables eliminating the mask pattern specific intensity contributions. In this manner, high spatial resolution of the corresponding correction map may be obtained without undue effort in terms of man power and measurement tool resources.
摘要翻译：通过使用测量的强度值和模拟的强度值，有效地提取具有高空间分辨率的掩模和/或成像工具特定的不均匀性，可以降低复杂半导体器件的电路特征的关键尺寸的变化。例如，可以使用工具内部辐射传感器来测量光刻掩模的图像的强度，而模拟强度可以消除掩模图案特定强度贡献。以这种方式，可以获得相应校正图的高空间分辨率，而无需在人力和测量工具资源方面的不必要的努力。

6. 发明申请

US20120005634A1 Control of Critical Dimensions in Optical Imaging Processes for Semiconductor Production by Extracting Imaging Imperfections on the Basis of Imaging Tool Specific Intensity Measurements and Simulations 有权
标题翻译：根据成像工具特异性强度测量和模拟，通过提取成像缺陷来控制半导体生产的光学成像过程中的临界尺寸
公开(公告)号：US20120005634A1
公开(公告)日：2012-01-05
申请号：US12965488
申请日：2010-12-10
申请人： Rolf Seltmann , Stefan Roling , Francois Weisbuch
发明人： Rolf Seltmann , Stefan Roling , Francois Weisbuch
IPC分类号： G06F17/50
CPC分类号： G03F1/70 , G03F1/84 , G03F7/705 , G03F7/70616
摘要： Variations in critical dimensions of circuit features of sophisticated semiconductor devices may be reduced by efficiently extracting mask and/or imaging tool specific non-uniformities with high spatial resolution by using measured intensity values and simulated intensity values. For example, a tool internal radiation sensor may be used for measuring the intensity of an image of a lithography mask, while a simulated intensity enables eliminating the mask pattern specific intensity contributions. In this manner, high spatial resolution of the corresponding correction map may be obtained without undue effort in terms of man power and measurement tool resources.
摘要翻译：通过使用测量的强度值和模拟的强度值，有效地提取具有高空间分辨率的掩模和/或成像工具特定的不均匀性，可以降低复杂半导体器件的电路特征的关键尺寸的变化。例如，可以使用工具内部辐射传感器来测量光刻掩模的图像的强度，而模拟强度可以消除掩模图案特定强度贡献。以这种方式，可以获得相应校正图的高空间分辨率，而无需在人力和测量工具资源方面的不必要的努力。

7. 发明申请

US20100028790A1 METHOD AND SYSTEM FOR REDUCING OVERLAY ERRORS IN SEMICONDUCTOR VOLUME PRODUCTION USING A MIXED TOOL SCENARIO 有权
标题翻译：使用混合工具场景降低半导体体积生成中的覆盖误差的方法和系统
公开(公告)号：US20100028790A1
公开(公告)日：2010-02-04
申请号：US12476578
申请日：2009-06-02
申请人： Rolf Seltmann , Jens Busch , Uwe Schulze
发明人： Rolf Seltmann , Jens Busch , Uwe Schulze
IPC分类号： G03F7/20 , G03B27/42
CPC分类号： G03F9/7046 , G03F7/70525 , G03F7/70633 , G03F9/7088
摘要： By taking into consideration the combination of the substrate holders in various lithography tools used during the imaging to two subsequent device layers, enhanced alignment accuracy may be accomplished. Furthermore, restrictive tool dedications for critical lithography processes may be significantly relaxed by providing specific overlay correction data for each possible process flow, wherein, in some illustrative embodiments, a restriction of the number of possible process flows may be accomplished by implementing a rule for selecting a predefined substrate holder when starting the processing of an associated group of substrates.
摘要翻译：通过考虑到在成像期间使用的各种光刻工具中的衬底保持器与两个后续器件层的组合，可以实现增强的对准精度。此外，通过为每个可能的处理流程提供特定的覆盖校正数据，可以显着地减轻关键光刻工艺的限制性工具，其中在一些说明性实施例中，可以通过实施用于选择的规则来实现对可能的工艺流程的限制当开始相关联的基片组的处理时，预定义的衬底保持器。

8. 发明授权

US08155770B2 Method and apparatus for dispatching workpieces to tools based on processing and performance history 有权
标题翻译：基于加工和性能历史将工件调度到工具的方法和装置
公开(公告)号：US08155770B2
公开(公告)日：2012-04-10
申请号：US12415258
申请日：2009-03-31
申请人： Robert Barlovic , Uwe Schulze , Jan Raebiger , Joerg Weigang , Jens Busch , Rolf Seltmann
发明人： Robert Barlovic , Uwe Schulze , Jan Raebiger , Joerg Weigang , Jens Busch , Rolf Seltmann
IPC分类号： B26D5/00 , G06F19/00 , B31B1/00 , B31B1/28 , B26D7/06
CPC分类号： G05B19/41865 , G05B2219/31459 , G05B2219/32269 , Y02P90/20 , Y10T83/0457 , Y10T83/155 , Y10T483/1712
摘要： Metrology data associated with a plurality of workpieces processed at a selected operation in the process flow including a plurality of operations is retrieved. A processing context associated with each of the workpieces is determined. The processing context identifies at least one previous tool used to perform an operation on the associated workpiece prior to the selected operation. A plurality of performance metrics is determined for a plurality of tools capable of performing the selected operation based on the metrology data. Each performance metric is associated with a particular tool and a particular processing context. A set of the performance metrics is identified for the plurality of tools having a processing context matching a processing context of a selected workpiece awaiting performance of the selected operation. The selected workpiece is dispatched for processing in a selected one of the plurality of tools based on the set of performance metrics.
摘要翻译：检索与在包括多个操作的处理流程中的所选操作处理的多个工件相关联的计量数据。确定与每个工件相关联的处理上下文。处理上下文在所选择的操作之前识别用于对相关联的工件执行操作的至少一个先前的工具。针对能够基于测量数据执行所选择的操作的多个工具确定多个性能度量。每个性能度量与特定工具和特定的处理环境相关联。针对具有与所选择的工件等待执行所选择的操作的所选择的工件的处理环境匹配的处理环境的多个工具识别出一组性能度量。基于所述一组性能度量，在所述多个工具中选择的一个工具中调度所选择的工件以进行处理。

9. 发明授权

US07618755B2 Method and system for automatically detecting exposed substrates having a high probability for defocused exposure fields 有权
标题翻译：用于自动检测散焦曝光场的可能性高的曝光基板的方法和系统
公开(公告)号：US07618755B2
公开(公告)日：2009-11-17
申请号：US11419852
申请日：2006-05-23
申请人： Uwe Schulze , Jens Krause , Rolf Seltmann
发明人： Uwe Schulze , Jens Krause , Rolf Seltmann
IPC分类号： G03F9/00 , G03C5/00 , G03B27/54 , G03B27/42 , G03B27/72
CPC分类号： G03F7/70641 , G03F7/70525 , G03F7/70533
摘要： By automatically estimating the focus status of individual substrates or lots on the basis of focus-specific tool information obtained from the exposure tool, such as tilt angle ranges used during the automatic focusing procedures, possible hot spot errors may be detected highly efficiently prior to releasing the substrates to a subsequent etch process. Consequently, yield losses may be reduced. Moreover, possible error sources for hot spot errors may be identified.
摘要翻译：通过基于从曝光工具获得的聚焦专用工具信息（例如在自动对焦过程中使用的倾斜角度范围）自动估计各个基板或批次的聚焦状态，可能在释放之前高效地检测可能的热点误差衬底到随后的蚀刻工艺。因此，产量损失可能会降低。此外，可能会识别热点错误的可能的错误源。

10. 发明授权

US07325224B2 Method and system for increasing product yield by controlling lithography on the basis of electrical speed data 有权
标题翻译：基于电速数据控制光刻提高产品产量的方法和系统
公开(公告)号：US07325224B2
公开(公告)日：2008-01-29
申请号：US10987427
申请日：2004-11-12
申请人： Rolf Seltmann , Heiko Wagner , Rolf Stephan
发明人： Rolf Seltmann , Heiko Wagner , Rolf Stephan
IPC分类号： G06F17/50
CPC分类号： G03F7/70658 , G03F7/70558
摘要： The electrical performance of sub-devices is detected and the corresponding measurement data is used to control a lithography process so as to compensate for any type of process variations during a manufacturing sequence.
摘要翻译：检测到子器件的电气性能，并且使用相应的测量数据来控制光刻工艺，以补偿制造顺序期间的任何类型的工艺变化。

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