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1. 发明授权

US07851334B2 Apparatus and method for producing semiconductor modules 有权
标题翻译：用于制造半导体模块的装置和方法
公开(公告)号：US07851334B2
公开(公告)日：2010-12-14
申请号：US11780779
申请日：2007-07-20
申请人： Roland Speckels , Karsten Guth , Hans Hartung
发明人： Roland Speckels , Karsten Guth , Hans Hartung
IPC分类号： H01L21/00
CPC分类号： H01L24/83 , H01L21/6835 , H01L24/75 , H01L24/97 , H01L2221/68354 , H01L2224/29339 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/83005 , H01L2224/83203 , H01L2224/8384 , H01L2224/8385 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/1301 , H01L2924/13033 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2224/83 , H01L2924/00
摘要： An apparatus and method for producing semiconductor modules is disclosed. One embodiment provides for bonding at least one semiconductor die onto a carrier including a support film strip, the support film having applied an adhesive layer to one of its surfaces to attach the semiconductor die, and a pressure tool to press the semiconductor die and the support film strip onto the carrier to permanently contact the at least one semiconductor die to the carrier.
摘要翻译：公开了一种用于制造半导体模块的装置和方法。一个实施例提供了将至少一个半导体管芯粘合到包括支撑膜条的载体上，该支撑膜已将粘合剂层施加到其表面之一以附接半导体管芯，以及压力工具以将半导体管芯和支撑件薄膜条带到载体上以使至少一个半导体管芯永久地接触载体。

2. 发明申请

US20090023250A1 APPARATUS AND METHOD FOR PRODUCING SEMICONDUCTOR MODULES 有权
标题翻译：用于生产半导体模块的装置和方法
公开(公告)号：US20090023250A1
公开(公告)日：2009-01-22
申请号：US11780779
申请日：2007-07-20
申请人： Roland Speckels , Karsten Guth , Hans Hartung
发明人： Roland Speckels , Karsten Guth , Hans Hartung
IPC分类号： H01L21/58 , B29C65/00
CPC分类号： H01L24/83 , H01L21/6835 , H01L24/75 , H01L24/97 , H01L2221/68354 , H01L2224/29339 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/83005 , H01L2224/83203 , H01L2224/8384 , H01L2224/8385 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/1301 , H01L2924/13033 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2224/83 , H01L2924/00
摘要： An apparatus and method for producing semiconductor modules is disclosed. One embodiment provides for bonding at least one semiconductor die onto a carrier including a support film strip, the support film having applied an adhesive layer to one of its surfaces to attach the semiconductor die, and a pressure tool to press the semiconductor die and the support film strip onto the carrier to permanently contact the at least one semiconductor die to the carrier.
摘要翻译：公开了一种用于制造半导体模块的装置和方法。一个实施例提供了将至少一个半导体管芯粘合到包括支撑膜条的载体上，该支撑膜已将粘合剂层施加到其表面之一以附接半导体管芯，以及压力工具以将半导体管芯和支撑件薄膜条带到载体上以使至少一个半导体管芯永久地接触载体。

3. 发明申请

US20110017803A1 Method for Connecting a Component With a Substrate 有权
标题翻译：将元件与基板连接的方法
公开(公告)号：US20110017803A1
公开(公告)日：2011-01-27
申请号：US12844170
申请日：2010-07-27
申请人： Karsten Guth , Alfred Kemper , Roland Speckels
发明人： Karsten Guth , Alfred Kemper , Roland Speckels
IPC分类号： B23K37/04
CPC分类号： B23K1/0016 , B23K2101/36 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , Y10T428/12493 , H01L2924/00014 , H01L2924/00
摘要： An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber, wherein the component and the substrate to be connected are displaceable separate from one another in the chamber, and the chamber comprises a combined transfer and pressing unit being displaceable between a current position of the component and a current position of the substrate, for placing and pressing the component on the substrate, and the combined transfer and pressing unit comprises a rotatable element, which, in response to the placing and pressing of the component on the substrate, assumes an angle between the normal of a lower side of the component to be connected and a pressing direction of the component, the angle corresponding to an angle between the normal of a surface area of the substrate to be connected and the pressing direction of the component.
摘要翻译：一种用于在封闭的抽真空室中通过扩散焊接将部件与基板连接的装置，其中待连接的部件和基板可在腔室中彼此分离，并且该腔室包括组合传送和压制单元，在组件的当前位置和基板的当前位置之间可移位，用于将部件放置和按压在基板上，组合的转移和加压单元包括可旋转元件，其响应于部件的放置和按压在基板上呈现要连接的部件的下侧的法线与部件的按压方向之间的角度，该角度对应于要连接的基板的表面区域的法线与压接件之间的角度组件的方向。

4. 发明授权

US08209858B2 Method for mounting electronic components on a support 有权
标题翻译：将电子部件安装在支架上的方法
公开(公告)号：US08209858B2
公开(公告)日：2012-07-03
申请号：US11627719
申请日：2007-01-26
申请人： Roland Speckels , Karsten Guth
发明人： Roland Speckels , Karsten Guth
IPC分类号： H05K13/04
CPC分类号： H01L21/67144 , H01L24/75 , H01L2224/75 , H01L2224/75314 , H01L2224/758 , H01L2224/81005 , H01L2924/01005 , H01L2924/01023 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/1305 , H01L2924/13055 , Y10T29/4913 , Y10T29/49133 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , H01L2924/00
摘要： An arrangement for mounting a multiplicity of components (9, 10), particularly with irregular surface topography, on a support (7) using an assembly tool which has a tool substructure (5) and a tool superstructure (6), where the tool substructure (5) is designed to receive the support and the components which are to be mounted thereon, and the tool superstructure (6) has, in addition to an arrangement (11, 12) for transmitting assembly forces, an arrangement for compensating for tilts between the components and the support and/or an arrangement for compensating for irregular surface topologies.
摘要翻译：一种用于使用具有工具子结构（5）和工具上部结构（6）的组装工具将多个部件（9,10）特别是具有不规则表面形貌的部件安装在支撑件（7）上的装置，其中所述工具子结构（5）被设计成接收支撑件和要安装在其上的部件，并且除了用于传递组装力的装置（11,12）之外，工具上部结构（6）还具有用于补偿部件和支撑件和/或用于补偿不规则表面拓扑结构的装置。

5. 发明授权

US08104667B2 Method for connecting a component with a substrate 有权
标题翻译：将部件与基板连接的方法
公开(公告)号：US08104667B2
公开(公告)日：2012-01-31
申请号：US12844170
申请日：2010-07-27
申请人： Karsten Guth , Aldred Kemper , Roland Speckels
发明人： Karsten Guth , Aldred Kemper , Roland Speckels
IPC分类号： B23K20/00
CPC分类号： B23K1/0016 , B23K2101/36 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , Y10T428/12493 , H01L2924/00014 , H01L2924/00
摘要： An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber, wherein the component and the substrate to be connected are displaceable separate from one another in the chamber, and the chamber comprises a combined transfer and pressing unit being displaceable between a current position of the component and a current position of the substrate, for placing and pressing the component on the substrate, and the combined transfer and pressing unit comprises a rotatable element, which, in response to the placing and pressing of the component on the substrate, assumes an angle between the normal of a lower side of the component to be connected and a pressing direction of the component, the angle corresponding to an angle between the normal of a surface area of the substrate to be connected and the pressing direction of the component.
摘要翻译：一种用于在封闭的抽真空室中通过扩散焊接将部件与基板连接的装置，其中待连接的部件和基板可在腔室中彼此分离，并且该腔室包括组合传送和压制单元，在组件的当前位置和基板的当前位置之间可移位，用于将部件放置和按压在基板上，组合的转移和加压单元包括可旋转元件，其响应于部件的放置和按压在基板上呈现要连接的部件的下侧的法线与部件的按压方向之间的角度，该角度对应于要连接的基板的表面区域的法线与压接件之间的角度组件的方向。

6. 发明申请

US20080230589A1 APPARATUS AND METHOD FOR CONNECTING A COMPONENT WITH A SUBSTRATE 有权
标题翻译：将元件与基板连接的装置和方法
公开(公告)号：US20080230589A1
公开(公告)日：2008-09-25
申请号：US11688039
申请日：2007-03-19
申请人： Karsten Guth , Alfred Kemper , Roland Speckels
发明人： Karsten Guth , Alfred Kemper , Roland Speckels
IPC分类号： B23K20/00
CPC分类号： B23K1/0016 , B23K2101/36 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , Y10T428/12493 , H01L2924/00014 , H01L2924/00
摘要： An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber is disclosed. The component and the substrate to be connected are displaceable separate from one another in the chamber, and the chamber comprises a combined transfer and pressing unit being displaceable between the current position of the component and the current position of the substrate, for placing and pressing the component on the substrate. The combined transfer and pressing unit comprises a rotatable element, which, in response to the placing and pressing of the component on the substrate, assumes an angle between the normal of the lower side of the component to be connected and the pressing direction of the component, the angle corresponding to the angle between the normal of the substrate surface area to be connected and the pressing direction of the component.
摘要翻译：公开了一种用于通过扩散焊接将组件与衬底连接在封闭的真空室中的装置。待连接的部件和基板可以在腔室中彼此分开移位，并且腔室包括组合的传送和压制单元，其可以在部件的当前位置和基板的当前位置之间移动，以便放置和按压基底上的成分。组合传送和按压单元包括可旋转元件，该可旋转元件响应于元件在基板上的放置和挤压而呈现在待连接部件的下侧法线与部件的按压方向之间的角度对应于要连接的基板表面区域的法线与部件的按压方向之间的角度的角度。

7. 发明授权

US07793819B2 Apparatus and method for connecting a component with a substrate 有权
标题翻译：用于将部件与基板连接的装置和方法
公开(公告)号：US07793819B2
公开(公告)日：2010-09-14
申请号：US11688039
申请日：2007-03-19
申请人： Karsten Guth , Alfred Kemper , Roland Speckels
发明人： Karsten Guth , Alfred Kemper , Roland Speckels
IPC分类号： B23K20/00
CPC分类号： B23K1/0016 , B23K2101/36 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , Y10T428/12493 , H01L2924/00014 , H01L2924/00
摘要： An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber is disclosed. The component and the substrate to be connected are displaceable separate from one another in the chamber, and the chamber comprises a combined transfer and pressing unit being displaceable between the current position of the component and the current position of the substrate, for placing and pressing the component on the substrate. The combined transfer and pressing unit comprises a rotatable element, which, in response to the placing and pressing of the component on the substrate, assumes an angle between the normal of the lower side of the component to be connected and the pressing direction of the component, the angle corresponding to the angle between the normal of the substrate surface area to be connected and the pressing direction of the component.
摘要翻译：公开了一种用于通过扩散焊接将组件与衬底连接在封闭的真空室中的装置。待连接的部件和基板可以在腔室中彼此分开移位，并且腔室包括组合的传送和压制单元，其可以在部件的当前位置和基板的当前位置之间移动，以便放置和按压基底上的成分。组合传送和按压单元包括可旋转元件，该可旋转元件响应于元件在基板上的放置和挤压而呈现在待连接部件的下侧法线与部件的按压方向之间的角度对应于要连接的基板表面区域的法线与部件的按压方向之间的角度的角度。

8. 发明授权

US08439249B2 Device and method for making a semiconductor device including bonding two bonding partners 失效
标题翻译：用于制造半导体器件的器件和方法，包括接合两个接合伙伴
公开(公告)号：US08439249B2
公开(公告)日：2013-05-14
申请号：US12567434
申请日：2009-09-25
申请人： Roland Speckels , Thomas Licht , Karsten Guth
发明人： Roland Speckels , Thomas Licht , Karsten Guth
IPC分类号： B23K20/08 , H01L21/00
CPC分类号： H01L21/67092 , H01L21/6835 , H01L23/3735 , H01L24/32 , H01L24/75 , H01L24/83 , H01L24/93 , H01L25/072 , H01L25/50 , H01L2221/68354 , H01L2224/2919 , H01L2224/29339 , H01L2224/32225 , H01L2224/48227 , H01L2224/75251 , H01L2224/75252 , H01L2224/75301 , H01L2224/78743 , H01L2224/83192 , H01L2224/83201 , H01L2224/83801 , H01L2224/8384 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/15787 , H01L2924/3511 , H01L2924/00 , H01L2924/01028
摘要： A device and a method for making a semiconductor device including bonding a first bonding partner to a second bonding partner. The device comprises a lower tool and an upper tool, the upper tool including a plunger having a bottom side facing the lower tool at which bottom side a vacuum is creatable, so that the first bonding partner can be picked up by vacuum from the upper tool and positioned on the second bonding partner.
摘要翻译：一种用于制造半导体器件的器件和方法，包括将第一结合伙伴接合到第二接合伙伴。所述装置包括下部工具和上部工具，所述上部工具包括柱塞，所述柱塞具有面向所述下部工具的底侧，在所述下部工具的下侧可创建真空，从而可以从所述上部工具通过真空拾取所述第一焊接对象并且位于第二粘合伙伴上。

9. 发明授权

US07555832B2 Semiconductor chip attachment 有权
标题翻译：半导体芯片附件
公开(公告)号：US07555832B2
公开(公告)日：2009-07-07
申请号：US11688057
申请日：2007-03-19
申请人： Karsten Guth , Roland Speckels , Alfred Kemper
发明人： Karsten Guth , Roland Speckels , Alfred Kemper
IPC分类号： B23P19/00
CPC分类号： H01L21/6838 , H01L21/67005 , H01L24/75 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183
摘要： A chip carrier member comprises a rotatable chip-receiving element. The rotatable chip-receiving element is rotatable essentially about a point.
摘要翻译：芯片承载构件包括可旋转的芯片接收元件。可旋转的芯片接收元件可以基本上围绕点旋转。

10. 发明申请

US20080229575A1 Semiconductor Chip Attachment 有权
标题翻译：半导体芯片附件
公开(公告)号：US20080229575A1
公开(公告)日：2008-09-25
申请号：US11688057
申请日：2007-03-19
申请人： Karsten Guth , Roland Speckels , Alfred Kemper
发明人： Karsten Guth , Roland Speckels , Alfred Kemper
IPC分类号： H05K3/30 , B23P19/00
CPC分类号： H01L21/6838 , H01L21/67005 , H01L24/75 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183
摘要： A chip carrier member comprises a rotatable chip-receiving element. The rotatable chip-receiving element is rotatable essentially about a point.
摘要翻译：芯片承载构件包括可旋转的芯片接收元件。可旋转的芯片接收元件可以基本上围绕点旋转。

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