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1. 发明授权

US11097554B2 Thermal printhead and method of manufacturing the same 有权
公开(公告)号：US11097554B2
公开(公告)日：2021-08-24
申请号：US16911293
申请日：2020-06-24
申请人： Rohm Co., Ltd.
发明人： Goro Nakatani , Akira Fujita , Kazuya Nakakubo , Yasuhiro Fuwa
IPC分类号： B41J2/335 , B41J2/34
摘要： A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.

2. 发明授权

US10632760B2 Thermal printhead 有权
公开(公告)号：US10632760B2
公开(公告)日：2020-04-28
申请号：US16280791
申请日：2019-02-20
申请人： Rohm Co., Ltd.
发明人： Toshihiro Kimura , Akira Fujita , Kazuya Nakakubo , Satoshi Kimoto , Yasuhiro Yoshikawa , Tadashi Yamamoto
IPC分类号： B41J2/335 , B41J2/34 , B41J2/345
CPC分类号： B41J2/33515 , B41J2/3351 , B41J2/3353 , B41J2/3355 , B41J2/33535 , B41J2/34 , B41J2/345
摘要： A thermal printhead includes a substrate, a resistor layer with heat generation portions supported by the substrate and aligned in a primary scanning direction, a wiring layer supported by the substrate to form a conductive path to the heat generation portions, an insulating layer interposed between the substrate and the resistor layer, and a reflection layer located opposite to the heat generation portions with respect to the insulating layer. The reflection layer overlaps with the heat generation portions as viewed in a thickness direction of the heat generation portions and has a greater heat reflectivity than the insulating layer.

3. 发明授权

US11633959B2 Thermal print head 有权
公开(公告)号：US11633959B2
公开(公告)日：2023-04-25
申请号：US17470957
申请日：2021-09-09
申请人： ROHM CO., LTD.
发明人： Goro Nakatani , Akira Fujita
IPC分类号： B41J2/335
摘要： The present disclosure provides a thermal print head for achieving fine printing. A thermal print head of the disclosure includes: a substrate, having a substrate main surface and a substrate back surface facing opposite sides in a z direction; a resistor layer, disposed on a side of the substrate main surface and including a plurality of heat generating portions arranged in a main scan direction to generate heat by energization; a wiring layer, disposed on the side of the substrate main surface and including a conduction path for electrically conducting the plurality of heat generating portions; a metal layer, interposed between the substrate and the wiring layer with the resistor layer; and an insulating layer, interposed between the metal layer and the wiring layer with the resistor layer. The conduction path includes the metal layer. The metal layer includes tantalum (Ta).

4. 发明申请

US20190263141A1 THERMAL PRINTHEAD 审中-公开
公开(公告)号：US20190263141A1
公开(公告)日：2019-08-29
申请号：US16280791
申请日：2019-02-20
申请人： Rohm Co., Ltd.
发明人： Toshihiro Kimura , Akira Fujita , Kazuya Nakakubo , Satoshi Kimoto , Yasuhiro Yoshikawa , Tadashi Yamamoto
IPC分类号： B41J2/335 , B41J2/34 , B41J2/345
摘要： A thermal printhead includes a substrate, a resistor layer with heat generation portions supported by the substrate and aligned in a primary scanning direction, a wiring layer supported by the substrate to form a conductive path to the heat generation portions, an insulating layer interposed between the substrate and the resistor layer, and a reflection layer located opposite to the heat generation portions with respect to the insulating layer. The reflection layer overlaps with the heat generation portions as viewed in a thickness direction of the heat generation portions and has a greater heat reflectivity than the insulating layer.

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