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1. 发明授权

US09060419B2 Substrate formed on carrier having retaining features and resultant electronic device 有权
标题翻译：衬底形成在具有保持特征和结果的电子器件的载体上
公开(公告)号：US09060419B2
公开(公告)日：2015-06-16
申请号：US12394518
申请日：2009-02-27
申请人： Timothy J. Tredwell , Roger S. Kerr
发明人： Timothy J. Tredwell , Roger S. Kerr
IPC分类号： H05K3/30 , H05K3/00 , H05K1/03 , H05K1/05
CPC分类号： H05K3/007 , H05K1/0393 , H05K1/05 , H05K3/0052 , H05K3/303 , H05K2201/10166 , H05K2201/10598 , H05K2203/016 , H05K2203/0228 , Y10T29/4913
摘要： A method for forming an electronic device on a flexible substrate conditions at least one surface of a carrier to form at least one retaining feature on the surface for retaining a flexible substrate. The flexible substrate is provided by deposition or lamination f one or more layers of substrate material onto the carrier. A portion of the substrate is processed to form the electronic device on the processed portion of the substrate. At least the processed portion of the substrate is released from the carrier to provide the flexible substrate having electronic device formed thereon. An electronic device is formed on a flexible substrate in accordance with the method.
摘要翻译：在柔性基板上形成电子器件的方法条件是载体的至少一个表面在表面上形成用于保持柔性基底的至少一个保持特征。通过将一层或多层衬底材料沉积或层压到载体上来提供柔性基底。处理衬底的一部分以在衬底的经处理部分上形成电子器件。至少将基板的处理部分从载体上释放，以提供其上形成有电子器件的柔性基板。根据该方法在柔性基板上形成电子器件。

2. 发明授权

US08132318B2 Metal substrate having electronic devices formed thereon 失效
标题翻译：金属基板，其上形成有电子器件
公开(公告)号：US08132318B2
公开(公告)日：2012-03-13
申请号：US12694471
申请日：2010-01-27
申请人： Roger S. Kerr , Timothy J. Tredwell , Mark A. Harland
发明人： Roger S. Kerr , Timothy J. Tredwell , Mark A. Harland
IPC分类号： H05K3/30 , H05K3/36 , H05K3/02 , H05K3/10 , H01L21/30 , H01L21/46
CPC分类号： H01L27/1266 , H01L27/1214 , H01L29/78603 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155
摘要： A method of forming an electronic device on a metal substrate deposits a first seed layer of a first metal on at least one master surface with a roughness less than 400 nm. A supporting metal layer is bonded to the first seed layer to form the metal substrate 10. The metal substrate is removed from the master surface, and at least one electronic device is formed on the seed layer of the metal substrate.
摘要翻译：在金属基底上形成电子器件的方法在第一金属的第一晶种层上沉积至少一个粗糙度小于400nm的母体表面。将支撑金属层接合到第一种子层以形成金属基板10.金属基板从主表面移除，并且在金属基板的籽晶层上形成至少一个电子器件。

3. 发明授权

US08035482B2 System for updating a content bearing medium 有权
标题翻译：用于更新内容承载媒体的系统
公开(公告)号：US08035482B2
公开(公告)日：2011-10-11
申请号：US10935137
申请日：2004-09-07
申请人： Roger S. Kerr , Timothy J. Tredwell
发明人： Roger S. Kerr , Timothy J. Tredwell
IPC分类号： H04Q5/22
CPC分类号： G06K19/04 , G06K19/045 , G06Q20/206
摘要： The invention is directed to content bearing mediums having a capacity to receive additional content and systems and methods for updating and presenting content recorded on a content bearing medium, e.g., video cassette tape, CD or DVD, digital memory, game cartridges. In one aspect of the invention, a content bearing medium is provided. The content bearing medium has a content bearing signal stored thereon and a communication circuit. The communication circuit is adapted to exchange wireless signals with a remote programming device and to store an additional content bearing signal in a memory based upon the signals exchanged. The communication circuit is further adapted to transmit the additional content signals upon request by a player of the content bearing medium so that the player can receive the additional content signals and present an output that is based, at least in part, upon the stored signals.
摘要翻译：本发明涉及具有接收附加内容的能力的内容承载媒体以及用于更新和呈现记录在内容承载介质（例如，盒式录像带，CD或DVD，数字存储器，游戏盒）上的内容的系统和方法。在本发明的一个方面，提供一种承载载体的介质。内容承载媒体具有存储在其上的内容承载信号和通信电路。通信电路适于与远程编程设备交换无线信号，并且基于交换的信号将附加的内容承载信号存储在存储器中。该通信电路还适于根据内容承载介质的玩家的请求来发送附加内容信号，使得玩家可以接收附加的内容信号并且呈现至少部分地基于所存储的信号的输出。

4. 发明授权

US07772042B2 Solvent softening to allow die placement 有权
标题翻译：溶剂软化以允许模具放置
公开(公告)号：US07772042B2
公开(公告)日：2010-08-10
申请号：US12236848
申请日：2008-09-24
申请人： Roger S. Kerr , Timothy J. Tredwell , Seung-Ho Baek
发明人： Roger S. Kerr , Timothy J. Tredwell , Seung-Ho Baek
IPC分类号： H01L21/00
CPC分类号： H01L24/82 , H01L21/56 , H01L24/19 , H01L24/96 , H01L24/97 , H01L2221/68363 , H01L2223/6677 , H01L2224/04105 , H01L2224/18 , H01L2224/76155 , H01L2224/82102 , H01L2224/97 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/09701 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/82
摘要： Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, by selectively and seating IC elements onto/into a receiving substrate, such as a chip substrate. Specifically, the assembly of IC chips can include embedding IC elements onto the receiving substrate upon softening the receiving substrate. Such softening can be performed by using a softening agent and/or an activatable thermal barrier material. In an exemplary embodiment, pockets can be formed in the receiving substrate using the activatable thermal barrier material for the IC assembly.
摘要翻译：示例性实施例提供了通过选择性地将IC元件放置到接收基板（例如芯片基板）上来组装诸如集成电路（IC）芯片的电子器件的方法和系统。具体来说，IC芯片的组装可以包括在接收基板软化时将IC元件嵌入到接收基板上。这种软化可以通过使用软化剂和/或可激活的热障材料来进行。在示例性实施例中，可以使用用于IC组件的可激活热障材料在接收衬底中形成袋。

5. 发明申请

US20100136777A1 FLEXIBLE SUBSTRATE WITH ELECTRONIC DEVICES FORMED THEREON 有权
标题翻译：柔性基板与其形成的电子器件
公开(公告)号：US20100136777A1
公开(公告)日：2010-06-03
申请号：US12697522
申请日：2010-02-01
申请人： Timothy J. Tredwell , Roger S. Kerr
发明人： Timothy J. Tredwell , Roger S. Kerr
IPC分类号： H01L21/283 , H01L21/31 , H01L21/3105
CPC分类号： H01L29/78603 , H01L27/1218 , H01L27/1262 , H01L51/0097 , Y02E10/549 , Y02P70/521
摘要： A method of manufacturing an electronic device (10) provides a substrate (20) that has a plastic material. A particulate material (16) is embedded in at least one surface of the substrate. A layer of thin-film semiconductor material is deposited onto the substrate (20).
摘要翻译：制造电子器件（10）的方法提供了具有塑料材料的基底（20）。颗粒材料（16）嵌入在基底的至少一个表面中。将一层薄膜半导体材料沉积在衬底（20）上。

6. 发明授权

US07233498B2 Medium having data storage and communication capabilities and method for forming same 有权
标题翻译：具有数据存储和通信能力的介质及其形成方法
公开(公告)号：US07233498B2
公开(公告)日：2007-06-19
申请号：US10256769
申请日：2002-09-27
申请人： Roger S. Kerr , Timothy J. Tredwell
发明人： Roger S. Kerr , Timothy J. Tredwell
IPC分类号： H05K1/14
CPC分类号： G06K19/07745 , G06K19/07718 , G06K19/07722 , G06K19/07739 , G06K19/07743 , G06K19/07749 , G06K19/0775 , H01L2924/0002 , Y10T29/49128 , H01L2924/00
摘要： A method for forming a medium is provided. In accordance with the method a base layer is provided. A material layer is formed on the base layer. The material layer has void. A transponder having a memory is positioned in the void. A medium is also provided. The medium has a base layer and a material layer having a void. A transponder having a memory is positioned in the void.
摘要翻译：提供了形成介质的方法。根据该方法，提供基层。在基层上形成材料层。材料层无效。具有存储器的转发器位于空隙中。还提供一种介质。介质具有基层和具有空隙的材料层。具有存储器的转发器位于空隙中。

7. 发明授权

US09075150B2 Radiographic detector formed on scintillator 有权
标题翻译：在闪烁体上形成射线检测器
公开(公告)号：US09075150B2
公开(公告)日：2015-07-07
申请号：US12512437
申请日：2009-07-30
申请人： Timothy J. Tredwell , Roger S. Kerr , Robert W. Kulpinski
发明人： Timothy J. Tredwell , Roger S. Kerr , Robert W. Kulpinski
IPC分类号： G01T1/20 , G01T1/202
CPC分类号： G01T1/2018 , G01T1/20 , G01T1/202 , G01T1/247 , H01L27/14663 , H01L27/14683
摘要： A projection radiographic imaging apparatus includes a scintillator and an imaging array. The imaging array includes a plurality of pixels formed directly on a side of the scintillator. Each of the pixels includes at least one photosensor and at least one readout element.
摘要翻译：投影射线照相成像装置包括闪烁体和成像阵列。成像阵列包括直接形成在闪烁体一侧的多个像素。每个像素包括至少一个光传感器和至少一个读出元件。

8. 发明授权

US08800138B2 Method for conditioning a substrate surface for forming an electronic device thereon and resultant device 有权
标题翻译：用于调节用于在其上形成电子器件的衬底表面和所得器件的方法
公开(公告)号：US08800138B2
公开(公告)日：2014-08-12
申请号：US12394575
申请日：2009-02-27
申请人： Timothy J. Tredwell , Roger S. Kerr
发明人： Timothy J. Tredwell , Roger S. Kerr
IPC分类号： H05K3/30
CPC分类号： H01L27/1266 , H01L27/1218 , H01L29/78603 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49826 , Y10T156/1039 , Y10T428/24802
摘要： A method for forming an electronic device on a flexible substrate conditions a surface of the flexible substrate to increase its malleability and to provide a conditioned substrate surface. A master surface is impressed against the conditioned substrate surface. The master surface is then released from the conditioned substrate surface, thereby forming a circuit-side surface on the substrate. The electronic device is then formed on the circuit-side surface. The substrate may be supported on a carrier during the method.
摘要翻译：用于在柔性基板上形成电子器件的方法调节柔性基板的表面以增加其柔韧性并提供经调理的基底表面。主表面被压在经调理的基底表面上。然后，主表面从经调理的基板表面释放，从而在基板上形成电路侧表面。然后在电路侧表面上形成电子器件。在该方法中，衬底可以被支撑在载体上。

9. 发明授权

US08035609B2 Imaging element 有权
标题翻译：成像元素
公开(公告)号：US08035609B2
公开(公告)日：2011-10-11
申请号：US12165679
申请日：2008-07-01
申请人： Roger S. Kerr , Timothy J. Tredwell
发明人： Roger S. Kerr , Timothy J. Tredwell
IPC分类号： G09G3/36
CPC分类号： H04N5/32 , G02B26/026 , H04N5/2354
摘要： Imaging elements are provided. An imaging element has a wireless communication circuit adapted to detect a wireless communication signal and to generate a control signal; an illumination circuit having an illumination element, the illumination circuit being adapted so that the illumination element generates light at an intensity that is based upon the control signal and a body containing the wireless communication circuit and the light source, wherein the body occupies a space that is less than about five cubic millimeters. The imaging element can also incorporate radiation sensors and can provide wireless signals indicative of sampled radiation.
摘要翻译：提供成像元素。成像元件具有适于检测无线通信信号并产生控制信号的无线通信电路; 具有照明元件的照明电路，所述照明电路适于使得所述照明元件以基于所述控制信号的强度产生光，以及包含所述无线通信电路和所述光源的主体，其中，所述主体占据空间，小于约5立方毫米。成像元件还可以包括辐射传感器并且可以提供指示采样辐射的无线信号。

10. 发明授权

US08034663B2 Low cost die release wafer 有权
标题翻译：低成本脱模晶片
公开(公告)号：US08034663B2
公开(公告)日：2011-10-11
申请号：US12237127
申请日：2008-09-24
申请人： Roger S. Kerr , Timothy J. Tredwell , Seung-Ho Baek
发明人： Roger S. Kerr , Timothy J. Tredwell , Seung-Ho Baek
IPC分类号： H01L21/78
CPC分类号： H01L24/81 , H01L21/32055 , H01L21/56 , H01L24/75 , H01L2221/68322 , H01L2221/6835 , H01L2221/68354 , H01L2221/68368 , H01L2221/68372 , H01L2224/16225 , H01L2224/7565 , H01L2224/812 , H01L2224/81201 , H01L2224/81801 , H01L2224/83192 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01057 , H01L2924/01077 , H01L2924/01079 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10T29/49124 , H01L2224/0401
摘要： Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, using a release member having a phase change material. Specifically, IC elements/components can be selectively received, stored, inspected, repaired, and/or released in a scalable manner during the assembly of IC chips by inducing phase change of the phase change material. The release member can be glass with the IC elements grown on the glass. In some embodiments, the release member can be used for a low cost placement of the IC elements in combination with an intermediate transfer layer.
摘要翻译：示例性实施例提供了使用具有相变材料的释放构件来组装诸如集成电路（IC）芯片的电子设备的方法和系统。具体地说，可以通过引入相变材料的相变来在IC芯片的组装过程中以可缩放的方式选择性地接收，存储，检查，检查和/或释放IC元件/部件。释放构件可以是具有在玻璃上生长的IC元件的玻璃。在一些实施例中，释放构件可用于与中间转印层组合的IC元件的低成本放置。

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