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    • 1. 发明授权
    • Polysilicon resistor and E-fuse for integration with metal gate and high-k dielectric
    • 用于与金属栅极和高k电介质集成的多晶硅电阻器和电熔丝
    • US08481397B2
    • 2013-07-09
    • US12719289
    • 2010-03-08
    • Roger A. Booth, Jr.Kangguo ChengRainer LoesingChengwen PeiXiaojun Yu
    • Roger A. Booth, Jr.Kangguo ChengRainer LoesingChengwen PeiXiaojun Yu
    • H01L21/20
    • H01L21/02H01L21/768H01L23/525H01L29/12H01L29/86H01L2924/0002H01L2924/00
    • A method is provided for making a resistive polycrystalline semiconductor device, e.g., a poly resistor of a microelectronic element such as a semiconductor integrated circuit. The method can include: (a) forming a layered stack including a dielectric layer contacting a surface of a monocrystalline semiconductor region of a substrate, a metal gate layer overlying the dielectric layer, a first polycrystalline semiconductor region adjacent the metal gate layer having a predominant dopant type of either n or p, and a second polycrystalline semiconductor region spaced from the metal gate layer by the first polycrystalline semiconductor region and adjoining the first polycrystalline semiconductor region; and (b) forming first and second contacts in conductive communication with the second polycrystalline semiconductor region, the first and second contacts being spaced apart so as to achieve a desired resistance. In a variation thereof, an electrical fuse is formed which includes a continuous silicide region through which a current can be passed to blow the fuse. Some of the steps of fabricating the poly resistor or the electrical fuse can be employed simultaneously in fabricating metal gate field effect transistors (FETs) on the same substrate.
    • 提供了一种用于制造电阻性多晶半导体器件的方法,例如诸如半导体集成电路的微电子元件的多晶硅电阻器。 该方法可以包括:(a)形成层叠堆叠,其包括与衬底的单晶半导体区域的表面接触的电介质层,覆盖在电介质层上的金属栅极层,与金属栅极层相邻的第一多晶半导体区域, 掺杂剂类型的n或p,以及第二多晶半导体区域,其与所述第一多晶半导体区域与所述金属栅极层隔开并邻接所述第一多晶半导体区域; 和(b)形成与所述第二多晶半导体区域导电连通的第一和第二触点,所述第一和第二触点间隔开以达到期望的电阻。 在其变型中,形成电熔丝,其包括连续的硅化物区域,电流可以通过该硅化物区域通过以熔断熔丝。 在同一衬底上制造金属栅极场效应晶体管(FET)的同时可以同时采用制造多晶硅电阻器或电熔丝的步骤。
    • 2. 发明申请
    • POLYSILICON RESISTOR AND E-FUSE FOR INTEGRATION WITH METAL GATE AND HIGH-K DIELECTRIC
    • 用于与金属栅和高K电介质集成的多晶硅电阻器和电子熔断器
    • US20110215321A1
    • 2011-09-08
    • US12719289
    • 2010-03-08
    • Roger A. Booth, JR.Kangguo ChengRainer LoesingChengwen PeiXiaojun Yu
    • Roger A. Booth, JR.Kangguo ChengRainer LoesingChengwen PeiXiaojun Yu
    • H01L29/12H01L21/02H01L21/768H01L29/86H01L23/525
    • H01L21/02H01L21/768H01L23/525H01L29/12H01L29/86H01L2924/0002H01L2924/00
    • A method is provided for making a resistive polycrystalline semiconductor device, e.g., a poly resistor of a microelectronic element such as a semiconductor integrated circuit. The method can include: (a) forming a layered stack including a dielectric layer contacting a surface of a monocrystalline semiconductor region of a substrate, a metal gate layer overlying the dielectric layer, a first polycrystalline semiconductor region adjacent the metal gate layer having a predominant dopant type of either n or p, and a second polycrystalline semiconductor region spaced from the metal gate layer by the first polycrystalline semiconductor region and adjoining the first polycrystalline semiconductor region; and (b) forming first and second contacts in conductive communication with the second polycrystalline semiconductor region, the first and second contacts being spaced apart so as to achieve a desired resistance. In a variation thereof, an electrical fuse is formed which includes a continuous silicide region through which a current can be passed to blow the fuse. Some of the steps of fabricating the poly resistor or the electrical fuse can be employed simultaneously in fabricating metal gate field effect transistors (FETs) on the same substrate.
    • 提供了一种用于制造电阻性多晶半导体器件的方法,例如诸如半导体集成电路的微电子元件的多晶硅电阻器。 该方法可以包括:(a)形成层叠堆叠,其包括与衬底的单晶半导体区域的表面接触的电介质层,覆盖在电介质层上的金属栅极层,与金属栅极层相邻的第一多晶半导体区域, 掺杂剂类型的n或p,以及第二多晶半导体区域,其与所述第一多晶半导体区域与所述金属栅极层隔开并邻接所述第一多晶半导体区域; 和(b)形成与所述第二多晶半导体区域导电连通的第一和第二触点,所述第一和第二触点间隔开以达到期望的电阻。 在其变型中,形成电熔丝,其包括连续的硅化物区域,电流可以通过该硅化物区域通过以熔断熔丝。 在同一衬底上制造金属栅极场效应晶体管(FET)的同时可以同时采用制造多晶硅电阻器或电熔丝的步骤。
    • 8. 发明授权
    • Structure and method to fabricate pFETS with superior GIDL by localizing workfunction
    • 通过定位功能来制造具有优异GIDL的pFETS的结构和方法
    • US08299530B2
    • 2012-10-30
    • US12717375
    • 2010-03-04
    • Chengwen PeiRoger A. Booth, Jr.Kangguo ChengJoseph ErvinRavi M. TodiGeng Wang
    • Chengwen PeiRoger A. Booth, Jr.Kangguo ChengJoseph ErvinRavi M. TodiGeng Wang
    • H01L27/12H01L21/8238
    • H01L21/22H01L21/8238H01L27/092
    • A semiconductor structure and a method of forming the same are provided in which the gate induced drain leakage is controlled by introducing a workfunction tuning species within selected portions of a pFET such that the gate/SD (source/drain) overlap area of the pFET is tailored towards flatband, yet not affecting the workfunction at the device channel region. The structure includes a semiconductor substrate having at least one patterned gate stack located within a pFET device region of the semiconductor substrate. The structure further includes extension regions located within the semiconductor substrate at a footprint of the at least one patterned gate stack. A channel region is also present and is located within the semiconductor substrate beneath the at least one patterned gate stack. The structure further includes a localized workfunction tuning area located within a portion of at least one of the extension regions that is positioned adjacent the channel region as well as within at least a sidewall portion of the at least one gate stack. The localized workfunction tuning area can be formed by ion implantation or annealing.
    • 提供了一种半导体结构及其形成方法,其中通过在pFET的选定部分内引入功函数调谐物质来控制栅极感应漏极泄漏,使得pFET的栅极/ SD(源极/漏极)重叠区域为 适应平带,但不影响设备通道区域的功能。 该结构包括具有位于半导体衬底的pFET器件区域内的至少一个图案化栅叠层的半导体衬底。 所述结构还包括位于所述半导体衬底内的所述至少一个图案化栅叠层的覆盖区的扩展区。 沟道区域也存在并且位于至少一个图案化栅叠层下方的半导体衬底内。 该结构进一步包括位于至少一个延伸区域的一部分内的局部功能调谐区域,其位于邻近通道区域以及至少一个栅极叠层的至少一个侧壁部分内。 通过离子注入或退火可形成局部功能调谐区域。
    • 10. 发明申请
    • SHALLOW TRENCH CAPACITOR COMPATIBLE WITH HIGH-K / METAL GATE
    • 与高K /金属闸门兼容的低压电容器
    • US20090242953A1
    • 2009-10-01
    • US12059174
    • 2008-03-31
    • Roger A. Booth, JR.MaryJane BrodskyKangguo ChengChengwen Pei
    • Roger A. Booth, JR.MaryJane BrodskyKangguo ChengChengwen Pei
    • H01L27/108H01L21/8242G06F17/50
    • H01L27/0629
    • Forming a shallow trench capacitor in conjunction with an FET by forming a plurality of STI trenches; for the FET, implanting a first cell well having a first polarity between a first and a second of the STI trenches; for the capacitor, implanting a second cell well having a second polarity in an area of a third of the STI trenches; removing dielectric material from the third STI trench; forming a gate stack having a first portion located between the first and the second of the STI trenches and a second portion located over and extending into the third trench; and performing a source/drain implant of the same polarity as the second cell well, thereby forming a FET in the first cell well, and a capacitor in the second cell well. The second polarity may be opposite from the first polarity. An additional implant may reduce ESR in the second cell well.
    • 通过形成多个STI沟槽与FET结合形成浅沟槽电容器; 对于FET,在第一和第二STI沟槽之间注入具有第一极性的第一单元阱; 对于电容器,在第三个STI沟槽的区域中注入具有第二极性的第二单元阱; 从第三STI沟槽去除电介质材料; 形成具有位于所述STI沟槽的所述第一和第二STI沟槽之间的第一部分和位于所述第三沟槽中并延伸到所述第三沟槽中的第二部分的栅极堆叠; 并且执行与第二单元阱相同极性的源极/漏极注入,从而在第一单元阱中形成FET,以及在第二单元阱中形成电容器。 第二极性可以与第一极性相反。 额外的植入物可以减少第二细胞中的ESR。