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    • 8. 发明授权
    • Integrated circuit cooling device having internal cooling conduit
    • 具有内部冷却导管的集成电路冷却装置
    • US5529115A
    • 1996-06-25
    • US274947
    • 1994-07-14
    • Robert W. Paterson
    • Robert W. Paterson
    • F28D15/02H01L23/427F28D15/00
    • H01L23/427F28D15/02H01L2924/0002H01L2924/3011
    • An apparatus for cooling an integrated circuit device includes a container defining a chamber that is partially filled with a coolant which forms a coolant pool in the chamber, wherein heat generated by the integrated circuit device causes boiling of the coolant in the coolant pool so that vaporized coolant rises upwardly from the coolant pool and condenses on a ceiling of the chamber forming coolant droplets thereon. The apparatus further includes a cooling conduit positioned within the chamber and at least partially out of the coolant pool, the cooling conduit further being positioned (1) in a first path traveled by the vaporized coolant as it rises upwardly from the coolant pool towards the ceiling, and (2) in a second path traveled by the coolant droplets falling from the ceiling due to gravity.
    • 用于冷却集成电路装置的装置包括限定腔室的容器,所述腔室部分地填充有在腔室中形成冷却剂池的冷却剂,其中由集成电路装置产生的热量导致冷却剂池中的冷却剂沸腾,使得汽化 冷却剂从冷却剂池向上升起,并在其上形成冷却剂液滴的室的天花板上冷凝。 该装置还包括一个位于腔室内并且至少部分地位于冷却剂池内的冷却导管,该冷却导管进一步定位在由蒸发的冷却剂沿着从冷却剂池向上朝向顶板向上升起的第一路径中 ,和(2)在由重力从天花板落下的冷却剂液滴行进的第二路径中。