专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070238399A1 CHEMICAL MECHANICAL POLISHING SYSTEM HAVING MULTIPLE POLISHING STATIONS AND PROVIDING RELATIVE LINEAR POLISHING MOTION 失效
标题翻译：具有多个抛光站和提供相对线性抛光运动的化学机械抛光系统
公开(公告)号：US20070238399A1
公开(公告)日：2007-10-11
申请号：US11759770
申请日：2007-06-07
申请人： Robert Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Lee
发明人： Robert Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Lee
IPC分类号： B24B7/04 , B24B41/06 , B24B9/00 , B24B7/00
CPC分类号： H01L21/67057 , B08B1/007 , B24B27/0023 , B24B37/30 , B24B37/345 , B24B41/005 , B24B53/017 , B24B57/02 , H01L21/30625 , H01L21/67051
摘要： A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis.
摘要翻译：一种化学机械抛光装置，包括台面，安装在桌面上的转印站，安装在桌面上的多个抛光站，多个洗涤站以及由可围绕一个轴。每个洗涤站位于第一抛光站和第二抛光站或转移站之间，并且传送站和多个抛光站围绕轴线以大致相等的角度间隔布置。

2. 发明申请

US20060194525A1 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion 有权
标题翻译：化学机械抛光系统具有多个抛光台并提供相对的线性抛光运动
公开(公告)号：US20060194525A1
公开(公告)日：2006-08-31
申请号：US11329648
申请日：2006-01-10
申请人： Robert Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Lee
发明人： Robert Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Lee
IPC分类号： B24B9/00
CPC分类号： H01L21/67057 , B08B1/007 , B24B27/0023 , B24B37/30 , B24B37/345 , B24B41/005 , B24B53/017 , B24B57/02 , H01L21/30625 , H01L21/67051
摘要： A polishing method usable in an apparatus including a rotatable member rotatable about a first axis, at least one substrate head assembly supported on said rotatable member, and at least two polishing surfaces arranged below said rotatable member at respective angular positions about said first axis is described. In one implementation, a substrate can be mounted onto a first one of said at least one substrate head assembly. The rotatable member can be rotated to a position so that the substrate overlies a selected one of the polishing surfaces. The substrate can be engaged with said selected polishing surface and relative linear movement imparted between the selected polishing surface and the first substrate head assembly, while the substrate is engaged with the selected polishing surface.
摘要翻译：描述了可用于包括可围绕第一轴可旋转的可旋转构件，支撑在所述可旋转构件上的至少一个基板头组件和在围绕所述第一轴线的各个角位置处布置在所述可旋转构件下方的至少两个抛光表面的设备的抛光方法，。在一个实施方案中，可以将衬底安装在所述至少一个衬底头组件中的第一个上。可旋转构件可以旋转到一个位置，使得衬底覆盖所选择的一个抛光表面。衬底可以与所选择的抛光表面接合并且在所选择的抛光表面和第一衬底头组件之间施加的相对线性运动，同时衬底与所选择的抛光表面接合。

3. 发明申请

US20050048880A1 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion 失效
标题翻译：化学机械抛光系统具有多个抛光台并提供相对的线性抛光运动
公开(公告)号：US20050048880A1
公开(公告)日：2005-03-03
申请号：US10965202
申请日：2004-10-13
申请人： Robert Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Lee
发明人： Robert Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Lee
IPC分类号： B24B27/00 , B24B37/04 , B24B41/00 , B24B41/06 , B24B53/007 , B24B53/12 , B24B57/02 , H01L21/00 , H01L21/306 , B24B49/00 , B24B7/00
CPC分类号： H01L21/67057 , B08B1/007 , B24B27/0023 , B24B37/30 , B24B37/345 , B24B41/005 , B24B53/017 , B24B57/02 , H01L21/30625 , H01L21/67051
摘要： An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes polishing surfaces located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a rotatable support, which provides circumferential positioning of the heads relative to the polishing surfaces, and the wafer heads move linearly with respect to the polishing surface, thus providing relative linear motion between the wafer and the polishing station. A load/unload station may be located at a position symmetric with the polishing surfaces. The rotatable support can simultaneously position one of the heads over the load/unload station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers can be performed concurrently with wafer polishing. The multiple polishing stations can be used to sequentially polish a wafer held in a wafer head in a step of multiple steps. The steps may be equivalent, may provide polishes of different finish, or may be directed to polishing different levels. Alternately, more than one wafer may equivalently be polished at multiple polishing stations.
摘要翻译：一种用于抛光半导体晶片和其它工件的装置和相关方法，其包括位于多个抛光站处的抛光表面。多个晶片头，优选地至少比抛光站的数量多一个，可以加载单独的晶片。晶片头从可旋转的支撑件悬挂，其提供头部相对于抛光表面的周向定位，并且晶片头相对于抛光表面线性移动，从而在晶片和抛光台之间提供相对的线性运动。装载/卸载站可以位于与抛光表面对称的位置。可旋转支撑件可以将其中一个头部同时放置在装载/卸载台上，而其余的头部位于用于晶片抛光的抛光站之上，从而可以与晶片抛光同时进行晶片的加载和卸载。多个抛光站可以用于在多个步骤的步骤中顺序抛光保持在晶片头中的晶片。这些步骤可以是等效的，可以提供不同涂饰的抛光剂，或者可以指向抛光不同的水平。或者，可以在多个抛光站等效地抛光多于一个晶片。

4. 发明授权

US07255632B2 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion 有权
标题翻译：化学机械抛光系统具有多个抛光台并提供相对的线性抛光运动
公开(公告)号：US07255632B2
公开(公告)日：2007-08-14
申请号：US11329648
申请日：2006-01-10
申请人： Robert D. Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Q. Lee
发明人： Robert D. Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Q. Lee
IPC分类号： B24B1/00
CPC分类号： H01L21/67057 , B08B1/007 , B24B27/0023 , B24B37/30 , B24B37/345 , B24B41/005 , B24B53/017 , B24B57/02 , H01L21/30625 , H01L21/67051
摘要： A polishing method usable in an apparatus including a rotatable member rotatable about a first axis, at least one substrate head assembly supported on said rotatable member, and at least two polishing surfaces arranged below said rotatable member at respective angular positions about said first axis is described. In one implementation, a substrate can be mounted onto a first one of said at least one substrate head assembly. The rotatable member can be rotated to a position so that the substrate overlies a selected one of the polishing surfaces. The substrate can be engaged with said selected polishing surface and relative linear movement imparted between the selected polishing surface and the first substrate head assembly, while the substrate is engaged with the selected polishing surface.
摘要翻译：描述了可用于包括可围绕第一轴可旋转的可旋转构件，支撑在所述可旋转构件上的至少一个基板头组件和在围绕所述第一轴线的各个角位置处布置在所述可旋转构件下方的至少两个抛光表面的设备的抛光方法，。在一个实施方案中，可以将衬底安装在所述至少一个衬底头组件中的第一个上。可旋转构件可以旋转到一个位置，使得衬底覆盖所选择的一个抛光表面。衬底可以与所选择的抛光表面接合并且在所选择的抛光表面和第一衬底头组件之间施加的相对线性运动，同时衬底与所选择的抛光表面接合。

5. 发明授权

US07238090B2 Polishing apparatus having a trough 失效
标题翻译：抛光装置具有槽
公开(公告)号：US07238090B2
公开(公告)日：2007-07-03
申请号：US10965202
申请日：2004-10-13
申请人： Robert D. Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Q. Lee
发明人： Robert D. Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Q. Lee
IPC分类号： B24B9/00
CPC分类号： H01L21/67057 , B08B1/007 , B24B27/0023 , B24B37/30 , B24B37/345 , B24B41/005 , B24B53/017 , B24B57/02 , H01L21/30625 , H01L21/67051
摘要： Methods and apparatus for chemical mechanical polishing are described. In one embodiment, an apparatus includes a table top and a transfer station and multiple polishing stations are mounted on the table top. The apparatus further includes multiple washing stations, where each washing station is located between either two polishing stations or between a polishing station and a transfer station. Multiple carrier heads are supported by a support member that is rotatable about an axis. The transfer station and the multiple polishing stations are arranged at approximately equal angular intervals about the axis.
摘要翻译：描述了用于化学机械抛光的方法和装置。在一个实施例中，一种装置包括台面和传送站，并且多个抛光站安装在桌面上。该设备还包括多个洗涤站，其中每个洗涤站位于两个抛光站之间，或者位于抛光站和转移站之间。多个承载头由可围绕轴线旋转的支撑构件支撑。转运站和多个抛光站围绕轴以大致相等的角度间隔布置。

6. 发明授权

US6080046A Underwater wafer storage and wafer picking for chemical mechanical polishing 失效
标题翻译：水下晶圆储存和晶圆采摘化学机械抛光
公开(公告)号：US6080046A
公开(公告)日：2000-06-27
申请号：US58945
申请日：1998-04-10
申请人： Norm Shendon , Ilya Perlov , Eugene Gantvarg , Harry Q. Lee , Robert D. Tolles , Sasson Somekh
发明人： Norm Shendon , Ilya Perlov , Eugene Gantvarg , Harry Q. Lee , Robert D. Tolles , Sasson Somekh
IPC分类号： B24B27/00 , B24B37/30 , B24B37/34 , B24B41/00 , B24B53/007 , B24B53/017 , B24B53/12 , B24B57/02 , H01L21/00 , H01L21/304 , H01L21/306 , B24B1/00
CPC分类号： H01L21/67057 , B08B1/007 , B24B27/0023 , B24B37/30 , B24B37/345 , B24B41/005 , B24B53/017 , B24B53/12 , B24B57/02 , H01L21/67051 , H01L21/30625
摘要： A wafer storage and wafer transfer system adjunct to a multi-station chemical mechanical polishing system. Multiple wafers are brought to the system stored in a cassette. A claw member attached to an overhead arm picks up the cassette and deposits it in a water-filled tub next to the polishing system, thereby submerging the wafers in the water with a generally vertical orientation. A blade member attached to the same arm has a recess formed in its surface connected to a vacuum generator powered by positive fluid pressure to thereby selectively apply a vacuum to the recess to vacuum chuck a wafer. The blade member vacuum chucks a wafer under the water, picks it out of the water, and deposits it on a pedestal in polishing system. One of several wafer heads on a rotating carousel picks up the wafer from the pedestal and carries it to one or more of the polishing stations for polishing. After completion of polishing, the wafer head redeposits the wafer on the pedestal. The blade member vacuum chucks the wafer and moves it from the pedestal back to the same cassette or another cassette in the water-filled tub.
摘要翻译：晶圆储存和晶片转移系统，附加于多工位化学机械抛光系统。多个晶片被带到存储在盒中的系统。附接到顶架的爪构件拾取盒并将其沉积在靠近抛光系统的充满水的桶中，从而以大致垂直的方向将晶片浸没在水中。附接到同一个臂上的叶片构件在其表面上形成有一个与由正的流体压力驱动的真空发生器连接的表面，从而选择性地向凹槽施加真空以真空吸附晶片。叶片构件真空吸附水下的晶片，将其从水中取出，并将其沉积在抛光系统的基座上。旋转圆盘传送带上的几个晶片头中的一个从基座拾取晶片并将其运送到一个或多个抛光站用于抛光。抛光完成后，晶片头将晶片重新沉积在基座上。刀片构件真空吸盘并将其从基座移回到充满水的桶中的同一盒或另一盒。

7. 发明授权

US07097544B1 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion 有权
标题翻译：化学机械抛光系统具有多个抛光台并提供相对的线性抛光运动
公开(公告)号：US07097544B1
公开(公告)日：2006-08-29
申请号：US09507172
申请日：2000-02-18
申请人： Robert D. Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Q. Lee
发明人： Robert D. Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Q. Lee
IPC分类号： B24B7/22
CPC分类号： H01L21/67057 , B08B1/007 , B24B27/0023 , B24B37/30 , B24B37/345 , B24B41/005 , B24B53/017 , B24B57/02 , H01L21/30625 , H01L21/67051
摘要： An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes polishing surfaces located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a rotatable support, which provides circumferential positioning of the heads relative to the polishing surfaces, and the wafer heads move linearly with respect to the polishing surface, thus providing relative linear motion between the wafer and the polishing station. A load/unload station may be located at a position symmetric with the polishing surfaces. The rotatable support can simultaneously position one of the heads over the load/unload station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers can be performed concurrently with wafer polishing. The multiple polishing stations can be used to sequentially polish a wafer held in a wafer head in a step of multiple steps. The steps may be equivalent, may provide polishes of different finish, or may be directed to polishing different levels. Alternately, more than one wafer may equivalently be polished at multiple polishing stations.
摘要翻译：一种用于抛光半导体晶片和其它工件的装置和相关方法，其包括位于多个抛光站处的抛光表面。多个晶片头，优选地至少比抛光站的数量多一个，可以加载单独的晶片。晶片头从可旋转的支撑件悬挂，其提供头部相对于抛光表面的周向定位，并且晶片头相对于抛光表面线性移动，从而在晶片和抛光台之间提供相对的线性运动。装载/卸载站可以位于与抛光表面对称的位置。可旋转支撑件可以将其中一个头部同时放置在装载/卸载台上，而其余的头部位于用于晶片抛光的抛光站之上，从而可以与晶片抛光同时进行晶片的加载和卸载。多个抛光站可以用于在多个步骤的步骤中顺序抛光保持在晶片头中的晶片。这些步骤可以是等效的，可以提供不同涂饰的抛光剂，或者可以指向抛光不同的水平。或者，可以在多个抛光站等效地抛光多于一个晶片。

8. 发明授权

US6126517A System for chemical mechanical polishing having multiple polishing stations 失效
标题翻译：具有多个抛光台的化学机械抛光系统
公开(公告)号：US6126517A
公开(公告)日：2000-10-03
申请号：US42204
申请日：1998-03-13
申请人： Robert D. Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Q. Lee
发明人： Robert D. Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Q. Lee
IPC分类号： B24B27/00 , B24B37/30 , B24B37/34 , B24B41/00 , B24B53/007 , B24B53/017 , B24B53/12 , B24B57/02 , H01L21/00 , H01L21/304 , H01L21/306 , B24B5/00
CPC分类号： H01L21/67057 , B08B1/007 , B24B27/0023 , B24B37/30 , B24B37/345 , B24B41/005 , B24B53/017 , B24B53/12 , B24B57/02 , H01L21/67051 , H01L21/30625
摘要： An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes a polishing surfaces, such as pads mounted on respective platens, located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a rotatable support, which provides circumferential positioning of the heads relative to the polishing surfaces, and the wafer heads move linearly with respect to the polishing surface, for example oscillate radially within the rotatable support. A load/unload station may be located at a position symmetric with the polishing surfaces. The rotatable support can simultaneously position one of the heads over the load/unload station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers can be performed concurrently with wafer polishing. The multiple polishing stations can be used to sequentially polish a wafer held in a wafer head in a step of multiple steps. The steps may be equivalent, may provide polishes of different finish, or may be directed to polishing different levels. Alternately, more than one wafer may equivalently be polished at multiple polishing stations.
摘要翻译：一种用于抛光半导体晶片和其它工件的装置和相关方法，其包括抛光表面，诸如安装在相应压板上的焊盘，位于多个抛光站。多个晶片头，优选地至少比抛光站的数量多一个，可以加载单独的晶片。晶片头从可旋转支撑件悬挂，其提供头部相对于抛光表面的周向定位，并且晶片头相对于抛光表面线性移动，例如径向地在可旋转支撑件内摆动。装载/卸载站可以位于与抛光表面对称的位置。可旋转支撑件可以将其中一个头部同时放置在装载/卸载台上，而其余的头部位于用于晶片抛光的抛光站之上，从而可以与晶片抛光同时进行晶片的加载和卸载。多个抛光站可以用于在多个步骤的步骤中顺序抛光保持在晶片头中的晶片。这些步骤可以是等效的，可以提供不同涂饰的抛光剂，或者可以指向抛光不同的水平。或者，可以在多个抛光站等效地抛光多于一个晶片。

9. 发明授权

US5738574A Continuous processing system for chemical mechanical polishing 失效
标题翻译：化学机械抛光连续加工系统
公开(公告)号：US5738574A
公开(公告)日：1998-04-14
申请号：US549336
申请日：1995-10-27
申请人： Robert D. Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Q. Lee
发明人： Robert D. Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Q. Lee
IPC分类号： B24B27/00 , B24B37/30 , B24B37/34 , B24B41/00 , B24B53/007 , B24B53/017 , B24B53/12 , B24B57/02 , H01L21/00 , H01L21/304 , H01L21/306 , B24B5/00
CPC分类号： H01L21/67057 , B08B1/007 , B24B27/0023 , B24B37/30 , B24B37/345 , B24B41/005 , B24B53/017 , B24B53/12 , B24B57/02 , H01L21/67051 , H01L21/30625
摘要： An apparatus for polishing semiconductor wafers and other workpieces that includes polishing pads mounted on respective platens at multiple polishing stations. Multiple wafer heads, at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a carousel, which provides circumferential positioning of the heads relative to the polishing pads, and the wafer heads oscillate radially as supported by the carousel to sweep linearly across the respective pads in radial directions with respect to the rotatable carousel. Each polishing station includes a pad conditioner to recondition the polishing pad so that it retains a high polishing rate. Washing stations may be disposed between polishing stations and between the polishing stations and a transfer and washing station to wash the wafer as the carousel moves. A transfer and washing station is disposed similarly to the polishing pads. The carousel simultaneously positions one of the heads over the transfer and washing station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers and washing of wafers and wafer heads can be performed concurrently with wafer polishing. A robot positioned to the side of the polishing apparatus automatically moves cassettes filled with wafers into a holding tub, and transfers individual wafers vertically held in the cassettes between the holding tub and the transfer and washing station. The multiple polishing pads can be used to sequentially polish a wafer held in a wafer head in a step of multiple steps. The steps may be equivalent, may provide polishes of different finish, or may be directed to polishing different levels.
摘要翻译：一种用于抛光半导体晶片和其它工件的装置，其包括安装在多个抛光站的相应压板上的抛光垫。与抛光台的数量相比，至少一个数量的多个晶片头可以装载单独的晶片。晶片头从旋转盘悬挂，其提供头相对于抛光垫的圆周定位，并且晶片头在圆盘传送带支撑下径向摆动，以相对于可旋转圆盘传送器在径向上线性地扫过相应的垫。每个抛光台包括用于修整抛光垫的垫调节器，使得其保持高抛光速率。洗涤站可以设置在抛光站之间和抛光站之间，以及传送和洗涤站，以便随着传送带移动而洗涤晶片。传送和洗涤站的布置类似于抛光垫。圆盘传送带同时将其中一个头放置在传送和洗涤台上，而其余的头位于用于晶片抛光的抛光站之上，从而可以与晶片抛光同时进行晶片的加载和卸载以及晶片和晶片头的清洗。位于抛光装置一侧的机器人将自动地将装载有晶片的盒子移动到保持桶中，并且将保持在保持桶和转移和洗涤站之间的盒中的垂直保持的各个晶片传送。多个抛光垫可以用于在多个步骤的步骤中顺序抛光保持在晶片头中的晶片。这些步骤可以是等效的，可以提供不同涂饰的抛光剂，或者可以指向抛光不同的水平。

10. 发明授权

US08079894B2 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion 有权
标题翻译：化学机械抛光系统具有多个抛光台并提供相对的线性抛光运动
公开(公告)号：US08079894B2
公开(公告)日：2011-12-20
申请号：US12581049
申请日：2009-10-16
申请人： Robert D. Tolles , Norman Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Q. Lee
发明人： Robert D. Tolles , Norman Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Q. Lee
IPC分类号： B24B7/22
CPC分类号： H01L21/67057 , B08B1/007 , B24B27/0023 , B24B37/30 , B24B37/345 , B24B41/005 , B24B53/017 , B24B57/02 , H01L21/30625 , H01L21/67051
摘要： A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis.
摘要翻译：一种化学机械抛光装置，包括台面，安装在桌面上的转印站，安装在桌面上的多个抛光站，多个洗涤站以及由可围绕一个轴。每个洗涤站位于第一抛光站和第二抛光站或转移站之间，并且传送站和多个抛光站围绕轴线以大致相等的角度间隔布置。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式