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    • 4. 发明授权
    • Deposition of layers on substrates
    • 在基材上沉积层
    • US07678409B2
    • 2010-03-16
    • US10544889
    • 2004-02-05
    • Finlay Doogan MorrisonJames Floyd Scott
    • Finlay Doogan MorrisonJames Floyd Scott
    • B05D5/12
    • C30B7/00C30B29/30C30B29/60C30B33/00Y10T428/249967Y10T428/249969Y10T428/24997
    • A process for filling or lining the pores of a porous silicon, silica or alumina substrate with a material which exhibits voltage-dependent index of refraction n is provided comprising providing precursors for the deposited material as a precursor solution, forming a fine mist of droplets of precursor solution and applying the droplets to the porous substrate. The invention provides for the first time porous silicon, silica and alumina substrates having a fill fraction of at least 60%. Fill fractions of close to l00% can be achieved. When provided with top and bottom electrodes, filled porous silicon, silica and alumina wafers can be used as voltage-dependent photonic devices. The same process can be used for lining trenches in the surface of a silicon substrate, for instance for use in production of microelectronic devices such as random access memories.
    • 提供了用显示电压依赖折射率n的材料填充或衬垫多孔硅,二氧化硅或氧化铝基底的孔的方法,包括提供沉积材料的前体作为前体溶液,形成细小的雾滴 前体溶液并将液滴施加到多孔基材上。 本发明首次提供填充率为至少60%的多孔硅,二氧化硅和氧化铝基底。 可以达到接近100%的分数。 当设置有顶部和底部电极时,填充的多孔硅,二氧化硅和氧化铝晶片可以用作依赖于电压的光子器件。 相同的工艺可以用于在硅衬底的表面中衬衬沟槽,例如用于生产诸如随机存取存储器的微电子器件。