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    • 9. 发明授权
    • Method for making a semiconductor device including shallow trench isolation (STI) regions with maskless superlattice deposition following STI formation and related structures
    • 制造半导体器件的方法,其包括在STI形成和相关结构之后具有无掩模超晶格沉积的浅沟槽隔离(STI)区域
    • US07812339B2
    • 2010-10-12
    • US12102305
    • 2008-04-14
    • Robert J. MearsKalipatnam Vivek Rao
    • Robert J. MearsKalipatnam Vivek Rao
    • H01L29/06
    • H01L29/1054H01L21/76237H01L29/1033H01L29/15
    • A semiconductor device may include a semiconductor substrate having a surface, a shallow trench isolation (STI) region in the semiconductor substrate and extending above the surface thereof, and a superlattice layer adjacent the surface of the semiconductor substrate and comprising a plurality of stacked groups of layers. More particularly, each group of layers of the superlattice layer may include a plurality of stacked base semiconductor monolayers defining a base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions. Moreover, at least some atoms from opposing base semiconductor portions may be chemically bound together with the chemical bonds traversing the at least one intervening non-semiconductor monolayer. The semiconductor device may further include a lateral spacer between the superlattice layer and the STI region and which may include a lower non-monocrystalline semiconductor superlattice portion and an upper dielectric portion.
    • 半导体器件可以包括在半导体衬底中具有表面,浅沟槽隔离(STI)区域并在其表面之上延伸的半导体衬底和邻近半导体衬底的表面的超晶格层,并且包括多个层叠的 层。 更具体地,超晶格层的每组层可以包括限定基极半导体部分的多个堆叠的基底半导体单层和限制在相邻的基极半导体部分的晶格内的至少一个非半导体单层。 此外,来自相对的基底半导体部分的至少一些原子可以与穿过至少一个介入的非半导体单层的化学键化学地结合在一起。 半导体器件还可以包括在超晶格层和STI区之间的横向间隔物,并且其可以包括下部非单晶半导体超晶格部分和上部电介质部分。