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    • 4. 发明授权
    • Method for achieving uniform expansion of dielectric plate
    • 电介质板均匀膨胀的方法
    • US06135791A
    • 2000-10-24
    • US317492
    • 1999-05-24
    • Jwo-Min WangShih-Wei Hsiao
    • Jwo-Min WangShih-Wei Hsiao
    • H01R12/04H05K1/02H05K3/34H05K7/10H01R12/00
    • H05K7/1076H05K1/0271H05K3/3436
    • A method for achieving uniform expansion of a dielectric plate made by injection molding includes the steps of forming core pins having a rhombic cross section at predetermined positions inside a mold for injection-molding the plate, injecting a plasticized dielectric material into the mold wherein the core pins guide the plasticized material flow for properly orienting molecules of the dielectric material, and curing and forming the dielectric plate in which rhombic holes corresponding to the core pins are formed. The properly oriented molecules of the dielectric material and the rhombic holes reduce the difference between thermal expansion coefficients in longitudinal and lateral directions of the plate thereby achieving uniform expansion thereof.
    • 用于实现通过注射成型制成的电介质板的均匀膨胀的方法包括以下步骤:在用于注射成型该板的模具内的预定位置处形成具有菱形横截面的芯销,将增塑的电介质材料注入到模具中,其中芯 引脚引导塑化材料流动,以使电介质材料的分子适当地定向,并且固化和形成其中形成与芯销对应的菱形孔的电介质板。 介电材料和菱形孔的正确定向分子减小了板的纵向和横向热膨胀系数之间的差异,从而实现了其均匀膨胀。
    • 8. 发明授权
    • IC socket having improved latch devices
    • IC插座具有改进的闩锁装置
    • US07867005B2
    • 2011-01-11
    • US12481600
    • 2009-06-10
    • Shih-Wei HsiaoWen-Yi Hsieh
    • Shih-Wei HsiaoWen-Yi Hsieh
    • H01R13/62
    • G01R1/0466
    • An IC socket (100) for receiving an IC package includes a socket body for carrying the IC package, a plurality of contacts (3) received in the socket body for electrical connection with the IC package, a driving member (5) mounted upon the socket body, and at least one latch device (19) driven by the driving member (5) to shift between a closed position and an opened position. The driving member (5) is able to be operated between an upper position and a lower position. The latch device (19) has a movable pressing member (194) engaging with a spring member (1943) and pressing the IC package toward the socket body. The position of pressing member (194) is adjusted in a vertical direction by abutting against the IC package.
    • 一种用于接收IC封装的IC插座(100),包括用于承载IC封装的插座主体,容纳在插座主体中用于与IC封装电连接的多个触点(3),安装在IC封装上的驱动构件 以及由所述驱动构件(5)驱动以在关闭位置和打开位置之间移动的至少一个闩锁装置(19)。 驱动构件(5)能够在上部位置和下部位置之间操作。 闩锁装置(19)具有与弹簧构件(1943)接合并将IC封装朝向插座主体按压的可动按压构件(194)。 按压构件(194)的位置通过与IC封装抵靠而在垂直方向上调节。
    • 9. 发明授权
    • Electrical contact with overlapping structure
    • 电接触重叠结构
    • US07789671B2
    • 2010-09-07
    • US12485066
    • 2009-06-16
    • Wen-Yi HsiehShih-Wei Hsiao
    • Wen-Yi HsiehShih-Wei Hsiao
    • H01R12/00
    • G01R1/06722H01R13/2421H01R2201/20
    • An electrical contact includes a first contact pin, a second contact pin and an elastic member surrounding the first contact pin and the second contact pin. Both of the first contact pin and the second contact pin include contacting portions. The first contact pin has a guiding portion including two lead-in arms and a stop portion between the two leading arms. The second contact has a main body and a protrusion on a top end of the main body. The leading arms define a guiding groove therebetween for the main body of the second contact pin moving up and down. The protrusion abuts against the stop portion of the first contact pin to prevent the second contact from sliding out of the guiding groove.
    • 电接触包括第一接触销,第二接触销和环绕第一接触销和第二接触销的弹性构件。 第一接触销和第二接触销都包括接触部分。 第一接触销具有包括两个引入臂的引导部分和两个引导臂之间的止动部分。 第二触点在主体的顶端具有主体和突起。 引导臂在其间限定了用于第二接触销的主体上下移动的引导槽。 突起抵靠第一接触销的止动部分以防止第二接触从引导槽滑出。