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    • 8. 发明授权
    • Embossing toughened silicone resin substrates
    • 压花增韧硅树脂基材
    • US07682545B2
    • 2010-03-23
    • US10577377
    • 2004-10-22
    • Dimitris KatsoulisBizhong Zhu
    • Dimitris KatsoulisBizhong Zhu
    • B28B3/00
    • B29C59/022B29C2059/023B29K2083/00B29K2105/24Y10T428/24479Y10T428/265
    • This invention relates to a method of embossing a cured silicone resin thermoset substrate to imprint patterns onto the substrate from a master mold comprising (i) stacking a master mold with a cured silicone resin thermoset substrate such that the surface of the master mold containing a feature is facing the silicone resin substrate; (ii) applying pressure to the product of (i) in a press at a temperature slightly higher than the Tg of the silicone resin but lower than the softening point of the master mold; (iii) cooling the product of (ii) and maintaining the pressure on the mold; and (iv) releasing the substrate whereby the feature is imprinted on the silicone resin substrate. Cured silicone resin thermoset substrates offer advantages over the organic thermoplastics in terms of hot embossing lithography by offering a very smooth surface which promotes high fidelity of replication in the micrometer and manometer domain, and requiring no release agent for demolding.
    • 本发明涉及一种将固化的硅氧烷树脂热固性基材压花的方法,以从母模将压印图案压印到基材上,该方法包括:(i)用固化的硅氧烷树脂热固性基材堆叠母模,使得主模具的表面含有特征 面向硅树脂基板; (ii)在稍高于有机硅树脂的Tg但低于母模的软化点的温度的压力机中对(i)的产物施加压力; (iii)冷却(ii)的产品并保持模具上的压力; 和(iv)释放基板,由此将特征压印在硅树脂基板上。 固化有机硅树脂热固性基材通过提供非常光滑的表面,在热压花纹光刻方面提供优于有机热塑性塑料的优点,这促进了在千分尺和压力计领域中的复制的高保真度,并且不需要脱模剂用于脱模。
    • 10. 发明申请
    • Embossing toughened silicone resin substrates
    • 压花增韧硅树脂基材
    • US20070098958A1
    • 2007-05-03
    • US10577377
    • 2004-10-22
    • Dimitris KatsoulisBizhong Zhu
    • Dimitris KatsoulisBizhong Zhu
    • B32B3/00G11B5/64
    • B29C59/022B29C2059/023B29K2083/00B29K2105/24Y10T428/24479Y10T428/265
    • This invention relates to a method of embossing a cured silicone resin thermoset substrate to imprint patterns onto the substrate from a master mold comprising (i) stacking a master mold with a cured silicone resin thermoset substrate such that the surface of the master mold containing a feature is facing the silicone resin substrate; (ii) applying pressure to the product of (i) in a press at a temperature slightly higher than the Tg of the silicone resin but lower than the softening point of the master mold; (iii) cooling the product of (ii) and maintaining the pressure on the mold; and (iv) releasing the substrate whereby the feature is imprinted on the silicone resin substrate. Cured silicone resin thermoset substrates offer advantages over the organic thermoplastics in terms of hot embossing lithography by offering a very smooth surface which promotes high fidelity of replication in the micrometer and manometer domain, and requiring no release agent for demolding.
    • 本发明涉及一种将固化的硅氧烷树脂热固性基材压花的方法,以从母模将压印图案压印到基材上,该方法包括:(i)用固化的硅氧烷树脂热固性基材堆叠母模,使得主模具的表面含有特征 面向硅树脂基板; (ii)在稍高于有机硅树脂的Tg但低于母模的软化点的温度下在压力机中对(i)的产物施加压力; (iii)冷却(ii)的产品并保持模具上的压力; 和(iv)释放基板,由此将特征压印在硅树脂基板上。 固化有机硅树脂热固性基材通过提供非常光滑的表面,在热压花纹光刻方面提供优于有机热塑性塑料的优点,这促进了在千分尺和压力计领域中的复制的高保真度,并且不需要脱模剂用于脱模。