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1. 发明授权

US5976391A Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same 失效
标题翻译：连续柔性化学研磨电路组件，具有多个导体层及其制造方法
公开(公告)号：US5976391A
公开(公告)日：1999-11-02
申请号：US6213
申请日：1998-01-13
申请人： Robert Edward Belke, Jr. , Edward P. McLeskey , John Trublowski , Alice Dawn Zitzmann
发明人： Robert Edward Belke, Jr. , Edward P. McLeskey , John Trublowski , Alice Dawn Zitzmann
IPC分类号： H05K1/00 , H05K1/05 , H05K3/00 , H05K3/02 , H05K3/34 , H05K3/38 , H05K3/40 , H05K3/44 , H05K3/46 , B44C1/22
CPC分类号： H05K3/4046 , H05K3/022 , H05K3/4084 , H05K3/445 , H05K3/4623 , H05K3/4635 , H05K3/4685 , H05K1/0393 , H05K1/056 , H05K2201/0129 , H05K2201/0361 , H05K2201/0397 , H05K2201/10303 , H05K3/0058 , H05K3/3447 , H05K3/386 , H05K3/403 , H05K3/4092 , H05K3/4614 , H05K3/4632 , Y10T29/49126 , Y10T29/49156
摘要： A method of manufacturing an improved multi-layer printed circuit assembly having at least two conductor patterns. The method includes providing a first layer having a first metal surface a second layer having a second metal surface. A thin flexible carrier is placed between the first and second layers. The first and second layers are attached to opposite surfaces of the carrier. The first and second metal surfaces are etched to form first and second conductor patterns. The conductor patterns form the electrical traces interconnecting components on an electronic circuit assembly. The first and second conductor patterns are electrically connected to form an electronic circuit assembly that includes electronic traces on both sides of the circuit board.
摘要翻译：一种制造具有至少两个导体图案的改进的多层印刷电路组件的方法。该方法包括提供具有第一金属表面的第一层，第二层具有第二金属表面。薄的柔性载体放置在第一和第二层之间。第一层和第二层附着在载体的相对表面上。蚀刻第一和第二金属表面以形成第一和第二导体图案。导体图案形成将电子电路组件上的组件互连的电迹线。第一和第二导体图案电连接以形成包括在电路板两侧的电子迹线的电子电路组件。

2. 发明授权

US5337219A Electronic package 失效
标题翻译：电子包装
公开(公告)号：US5337219A
公开(公告)日：1994-08-09
申请号：US719425
申请日：1991-06-24
申请人： Dennis C. Carr , Edward P. McLeskey , Frank H. Sarnacki
发明人： Dennis C. Carr , Edward P. McLeskey , Frank H. Sarnacki
IPC分类号： H01L23/538 , H05K3/00 , H05K3/22 , H05K3/42 , H05K1/11
CPC分类号： H01L23/5385 , H05K3/225 , H01L2224/16225 , H01L2924/10253 , H01L2924/15312 , H01L2924/19107 , H05K2201/09572 , H05K2201/10287 , H05K2201/10704 , H05K2201/10734 , H05K2203/0455 , H05K2203/175 , H05K3/0047 , H05K3/42
摘要： A method for altering an electrical connection in an electronic package including one or more semiconductor chips overlying, i.e., mounted directly onto, or mounted onto one or more modules which are mounted onto, a substrate such as a printed circuit card or printed circuit board, as well as the resulting electronic package, is disclosed. In accordance with a preferred embodiment of the inventive method, at least one plated, solder-filled hole in the substrate is drilled out to eliminate an unwanted electrical connection. A solder region, e.g., a solder ball, is inserted into the drilled out hole into contact with an electrically conductive member, e.g., an electrically conductive pin, extending from, for example, a module into the hole. A cylinder, including a central core of electrically conductive material, encircled by an annulus of electrically insulating material, is inserted into the hole. The solder region is then reflowed to form an electrical and metallurgical bond between the module member and the central core. A new electrical connection is completed by extending a wire bond from the bottom of the central core to the bottom of the central core in another such hole or to the bottom of a solder-filled hole.
摘要翻译：一种用于改变包括一个或多个半导体芯片的电子连接的方法，所述半导体芯片重叠，即直接安装在或安装在安装到诸如印刷电路板或印刷电路板的基板上的一个或多个模块上，以及所得到的电子封装。根据本发明方法的优选实施例，钻出衬底中的至少一个电镀的焊料填充孔以消除不期望的电连接。焊料区域例如焊球被插入到钻孔中，与例如导电销（例如，模块）延伸到孔中的导电构件接触。包括导电材料的中心芯的圆筒，被电绝缘材料的环形区域包围，插入孔中。焊料区域然后回流以在模块构件和中心芯之间形成电和冶金结合。通过将引线接合从中心芯的底部延伸到另一个这样的孔中的中心芯的底部或焊料填充的孔的底部来完成新的电连接。

3. 发明授权

US06845661B2 Lead frame for automotive electronics 失效
标题翻译：汽车电子引线框架
公开(公告)号：US06845661B2
公开(公告)日：2005-01-25
申请号：US10269232
申请日：2002-10-11
申请人： Leon Bogdanov , Ralph J. Ross , Richard W. Caron , Edward P. McLeskey , Eric C. Myers
发明人： Leon Bogdanov , Ralph J. Ross , Richard W. Caron , Edward P. McLeskey , Eric C. Myers
IPC分类号： F02D35/00 , G01F1/684 , H01L23/50 , G01F1/68
CPC分类号： G01F1/6842 , H01L2924/0002 , H01L2924/00
摘要： A device for detecting a mass of a flowing fluid is disclosed. The device includes a housing having a fluid sampling portion and a circuit cavity portion. The fluid sampling portion is positionable within a fluid carrying duct and includes a flow passage. A nozzle is in fluid communication with the flow passage, wherein the nozzle has a nozzle exit. An electrical element is disposed in the flow passage proximate to the nozzle exit. Further, a circuit module is in communication with the electrical element and disposed in the circuit cavity portion for detecting a change in an electrical property of the electrical element, wherein the detected change in the electrical property is used to determine the mass of the flowing fluid. Finally, a homogenous lead frame having a connector pin portion and an electrical attachment portion for providing an electrical path from the electrical element and circuit module to the connector pin portion is provided.
摘要翻译：公开了一种用于检测流动流体的质量的装置。该装置包括具有流体采样部分和电路腔部分的壳体。流体取样部分可定位在流体输送管道内并且包括流动通道。喷嘴与流动通道流体连通，其中喷嘴具有喷嘴出口。电气元件设置在靠近喷嘴出口的流动通道中。此外，电路模块与电气元件连通并且设置在电路空腔部分中，用于检测电气元件的电性能的变化，其中检测到的电气特性的变化用于确定流动流体的质量。最后，提供了具有连接器针脚部分和用于提供从电气元件和电路模块到连接器针脚部分的电气路径的电气连接部分的均质引线框架。

4. 发明授权

US06752015B2 Fluid flow device having reduced fluid ingress 失效
标题翻译：具有减少的流体入口的流体流动装置
公开(公告)号：US06752015B2
公开(公告)日：2004-06-22
申请号：US10253190
申请日：2002-09-24
申请人： David J. Thompson , Robert E. Belke, Jr. , Edward P. McLeskey
发明人： David J. Thompson , Robert E. Belke, Jr. , Edward P. McLeskey
IPC分类号： G01F168
CPC分类号： F02D41/18 , F02D41/3005 , F02D2400/18 , G01F1/6845
摘要： The present invention involves a device for detecting a condition of a flowing fluid within a vehicle having reduced sulfur ingress. The device includes a base plate having a receiving surface and a circumferential edge and a printed circuit board disposed on the receiving surface of the base plate. The device further includes a housing having peripheral side walls attaching to the receiving surface adjacent the circumferential edge to define a peripheral interface enclosing the printed circuit board within the housing. The device further includes an adhesive material disposed at the interface to adhere the housing to the base plate. The adhesive material has a predetermined thermal expansion coefficient and a predetermined elastic modulus to reduce fluid ingress through the interface and to accommodate thermal expansions of the base plate and the housing.
摘要翻译：本发明涉及一种用于检测具有降低的硫进入的车辆内的流动流体的状况的装置。该装置包括具有接收表面和周缘的基板和设置在基板的接收表面上的印刷电路板。该装置还包括壳体，该壳体具有附接到邻近周缘的接收表面的外围侧壁，以限定围绕该外壳内的印刷电路板的周边接口。该装置还包括设置在界面处以将壳体附接到基板的粘合材料。粘合剂材料具有预定的热膨胀系数和预定的弹性模量，以减少通过界面的流体进入并适应底板和壳体的热膨胀。

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