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    • 8. 发明申请
    • Milled particle compositions and related methods and structures
    • 研磨颗粒组合物及相关方法和结构
    • US20070178306A1
    • 2007-08-02
    • US11634520
    • 2006-12-06
    • Archit LalRobert Dobbs
    • Archit LalRobert Dobbs
    • B32B1/00
    • C09K11/565C09K11/643C09K11/7734H01L21/0254H01L21/02557H01L21/02628Y10T428/2982
    • Small particle compositions including nanoparticle compositions are provided. The particle compositions, in some cases, are characterized by having an extremely small average particle size (e.g., 150 nanometers or less). The small particles may comprise a semiconductor material and/or a light-emitting material. In some embodiments, the particles may be in the form a preferred shape including platelets, amongst others. The small particle compositions may be produced in a milling process. In some embodiments, the milling process uses preferred types of grinding media to form milled particles having desired characteristics (e.g., particle size, shape). The small (or nano) particle compositions may be used in a variety of different applications including light-emitting applications. In certain applications, it may be desirable to form thin films from the small particle compositions.
    • 提供了包括纳米颗粒组合物的小颗粒组合物。 在某些情况下,颗粒组合物的特征在于具有非常小的平均粒径(例如150纳米或更小)。 小颗粒可以包括半导体材料和/或发光材料。 在一些实施方案中,颗粒可以是包括血小板在内的优选形状。 小颗粒组合物可以在研磨过程中制备。 在一些实施方案中,研磨方法使用优选类型的研磨介质来形成具有所需特征(例如,粒度,形状)的研磨颗粒。 小(或纳米)颗粒组合物可用于各种不同的应用,包括发光应用。 在某些应用中,可能期望从小颗粒组合物形成薄膜。