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1. 发明授权

US08735184B2 Equalization in proximity communication 有权
标题翻译：邻近通信中的均衡
公开(公告)号：US08735184B2
公开(公告)日：2014-05-27
申请号：US13341175
申请日：2011-12-30
申请人： Ronald Ho , Robert D. Hopkins , William S. Coates , Robert J. Drost
发明人： Ronald Ho , Robert D. Hopkins , William S. Coates , Robert J. Drost
IPC分类号： G01R31/26 , H01L21/66
CPC分类号： H01L23/48 , H01L2924/0002 , H01L2924/00
摘要： A device includes a semiconductor die having a surface, a plurality of proximity connectors proximate to the surface, and a circuit coupled to at least one of the plurality of proximity connectors. The semiconductor die is configured to communicate voltage-mode signals through capacitive coupling using one or more of the plurality of proximity connectors. The circuit also includes a filter with a capacitive-summing junction to equalize the signals.
摘要翻译：一种器件包括具有表面的半导体管芯，靠近表面的多个接近连接器，以及耦合到多个接近连接器中的至少一个的电路。半导体管芯被配置为通过使用多个接近连接器中的一个或多个的电容耦合来传送电压模式信号。电路还包括具有电容求和结的滤波器以均衡信号。

2. 发明申请

US20070268125A1 Equalization in proximity communication 有权
标题翻译：邻近通信中的均衡
公开(公告)号：US20070268125A1
公开(公告)日：2007-11-22
申请号：US11437457
申请日：2006-05-18
申请人： Ronald Ho , Robert D. Hopkins , William S. Coates , Robert J. Drost
发明人： Ronald Ho , Robert D. Hopkins , William S. Coates , Robert J. Drost
IPC分类号： G08B1/08
CPC分类号： H01L23/48 , H01L2924/0002 , H01L2924/00
摘要： A device includes a semiconductor die having a surface, a plurality of proximity connectors proximate to the surface, and a circuit coupled to at least one of the plurality of proximity connectors. The semiconductor die is configured to communicate voltage-mode signals through capacitive coupling using one or more of the plurality of proximity connectors. The circuit also includes a filter with a capacitive-summing junction to equalize the signals.
摘要翻译：一种器件包括具有表面的半导体管芯，靠近表面的多个接近连接器，以及耦合到多个接近连接器中的至少一个的电路。半导体管芯被配置为通过使用多个接近连接器中的一个或多个的电容耦合来传送电压模式信号。电路还包括具有电容求和结的滤波器以均衡信号。

3. 发明授权

US08130821B2 Equalization in capacitively coupled communication links 有权
标题翻译：电容耦合通信链路的均衡
公开(公告)号：US08130821B2
公开(公告)日：2012-03-06
申请号：US11437287
申请日：2006-05-18
申请人： Robert D. Hopkins , Ronald Ho , William S. Coates , Robert J. Drost
发明人： Robert D. Hopkins , Ronald Ho , William S. Coates , Robert J. Drost
IPC分类号： H04B3/46
CPC分类号： H04L25/03878 , H01L2224/48137 , H01L2224/49175 , H01L2924/00014 , H01L2924/13091 , H01L2924/30107 , H04L25/0266 , H01L2924/00 , H01L2224/45099
摘要： An integrated circuit containing a communication channel is described. This communication channel includes a transmit circuit configured to transmit signals using a voltage-mode driver, a receive circuit, and a capacitive link that couples the transmit circuit to the receive circuit. The communication channel includes a filter with a capacitive-summing junction to equalize signals communicated between the transmit circuit and the receive circuit.
摘要翻译：描述包含通信信道的集成电路。该通信信道包括被配置为使用将发送电路耦合到接收电路的电压模式驱动器，接收电路和电容链路来发送信号的发送电路。通信信道包括具有电容求和结点的滤波器，以平衡发送电路和接收电路之间传送的信号。

4. 发明申请

US20070268047A1 Equalization in capacitively coupled communication links 有权
标题翻译：电容耦合通信链路的均衡
公开(公告)号：US20070268047A1
公开(公告)日：2007-11-22
申请号：US11437287
申请日：2006-05-18
申请人： Robert D. Hopkins , Ronald Ho , William S. Coates , Robert J. Drost
发明人： Robert D. Hopkins , Ronald Ho , William S. Coates , Robert J. Drost
IPC分类号： H03K3/00
CPC分类号： H04L25/03878 , H01L2224/48137 , H01L2224/49175 , H01L2924/00014 , H01L2924/13091 , H01L2924/30107 , H04L25/0266 , H01L2924/00 , H01L2224/45099
摘要： An integrated circuit containing a communication channel is described. This communication channel includes a transmit circuit configured to transmit signals using a voltage-mode driver, a receive circuit, and a capacitive link that couples the transmit circuit to the receive circuit. The communication channel includes a filter with a capacitive-summing junction to equalize signals communicated between the transmit circuit and the receive circuit.
摘要翻译：描述包含通信信道的集成电路。该通信信道包括被配置为使用将发送电路耦合到接收电路的电压模式驱动器，接收电路和电容链路来发送信号的发送电路。通信信道包括具有电容求和结点的滤波器，以平衡发送电路和接收电路之间传送的信号。

5. 发明申请

US20120114032A1 EQUALIZATION IN PROXIMITY COMMUNICATION 有权
标题翻译：近似通信的平等化
公开(公告)号：US20120114032A1
公开(公告)日：2012-05-10
申请号：US13341175
申请日：2011-12-30
申请人： Ronald Ho , Robert D. Hopkins , William S. Coates , Robert J. Drost
发明人： Ronald Ho , Robert D. Hopkins , William S. Coates , Robert J. Drost
IPC分类号： H04L27/01
CPC分类号： H01L23/48 , H01L2924/0002 , H01L2924/00
摘要： A device includes a semiconductor die having a surface, a plurality of proximity connectors proximate to the surface, and a circuit coupled to at least one of the plurality of proximity connectors. The semiconductor die is configured to communicate voltage-mode signals through capacitive coupling using one or more of the plurality of proximity connectors. The circuit also includes a filter with a capacitive-summing junction to equalize the signals.
摘要翻译：一种器件包括具有表面的半导体管芯，靠近表面的多个接近连接器，以及耦合到多个接近连接器中的至少一个的电路。半导体管芯被配置为通过使用多个接近连接器中的一个或多个的电容耦合来传送电压模式信号。电路还包括具有电容求和结的滤波器以均衡信号。

6. 发明授权

US08102020B2 Equalization in proximity communication 有权
标题翻译：邻近通信中的均衡
公开(公告)号：US08102020B2
公开(公告)日：2012-01-24
申请号：US11437457
申请日：2006-05-18
申请人： Ronald Ho , Robert D. Hopkins , William S. Coates , Robert J. Drost
发明人： Ronald Ho , Robert D. Hopkins , William S. Coates , Robert J. Drost
IPC分类号： H01L21/02
CPC分类号： H01L23/48 , H01L2924/0002 , H01L2924/00
摘要： A device includes a semiconductor die having a surface, a plurality of proximity connectors proximate to the surface, and a circuit coupled to at least one of the plurality of proximity connectors. The semiconductor die is configured to communicate voltage-mode signals through capacitive coupling using one or more of the plurality of proximity connectors. The circuit also includes a filter with a capacitive-summing junction to equalize the signals.
摘要翻译：一种器件包括具有表面的半导体管芯，靠近表面的多个接近连接器，以及耦合到多个接近连接器中的至少一个的电路。半导体管芯被配置为通过使用多个接近连接器中的一个或多个的电容耦合来传送电压模式信号。电路还包括具有电容求和结的滤波器以均衡信号。

7. 发明授权

US07369726B2 Optical communication between face-to-face semiconductor chips 有权
标题翻译：面对面半导体芯片之间的光通信
公开(公告)号：US07369726B2
公开(公告)日：2008-05-06
申请号：US10816762
申请日：2004-04-02
申请人： Robert J. Drost , William S. Coates
发明人： Robert J. Drost , William S. Coates
IPC分类号： G02B6/26 , H04B10/08 , H04B10/12
CPC分类号： G02B6/43 , G02B6/4204 , H01L23/48 , H01L25/0652 , H01L25/0657 , H01L2225/06527 , H01L2225/06575 , H01L2924/0002 , H01L2924/00
摘要： One embodiment of the present invention provides a system that communicates between a first semiconductor die and a second semiconductor die through optical signaling. During operation, the system converts an electrical signal into an optical signal using an electrical-to-optical transducer located on a face of the first semiconductor die, wherein the first semiconductor die and the second semiconductor die are oriented face-to-face so that the optical signal generated on the first semiconductor die shines on the second semiconductor die. Upon receiving the optical signal on a face of the second semiconductor die, the system converts the optical signal into a corresponding electrical signal using an optical-to-electrical transducer located on the face of the second semiconductor die.
摘要翻译：本发明的一个实施例提供一种通过光信令在第一半导体管芯和第二半导体管芯之间进行连通的系统。在操作期间，系统使用位于第一半导体管芯的表面上的电 - 光换能器将电信号转换为光信号，其中第一半导体管芯和第二半导体管芯面对面地定向，使得在第一半导体管芯上产生的光信号在第二半导体管芯上发光。当在第二半导体管芯的表面上接收到光信号时，系统使用位于第二半导体管芯的表面上的光电换能器将光信号转换成相应的电信号。

8. 发明授权

US07384804B2 Method and apparatus for electronically aligning capacitively coupled mini-bars 有权
标题翻译：用于电容对齐电容耦合迷你条的方法和装置
公开(公告)号：US07384804B2
公开(公告)日：2008-06-10
申请号：US11125792
申请日：2005-05-09
申请人： Robert J. Drost , Ivan E. Sutherland , William S. Coates
发明人： Robert J. Drost , Ivan E. Sutherland , William S. Coates
IPC分类号： H01L21/66
CPC分类号： H01L25/0657 , H01L23/48 , H01L25/50 , H01L2224/16 , H01L2225/06513 , H01L2225/06531 , H01L2225/06593 , H01L2924/00011 , H01L2924/00014 , H01L2924/01067 , H01L2224/0401
摘要： One embodiment of the present invention provides a system that electronically aligns mini-bars on different semiconductor chips which are situated face-to-face to facilitate communication between the semiconductor chips through capacitive coupling. During operation, the system measures an alignment between a first chip and a second chip. The system then selects a group of transmitter mini-bars on the first chip to form a transmitter bit position based on the measured alignment. In this way, the system allows a data signal to be distributed to and transmitted by the mini-bars that form the transmitter bit position. The system also selects a group of receiver mini-bars on the second chip to form a receiver bit position based on the measured alignment. Next, the system associates transmitter bit positions on the first chip with proximate receiver bit positions on the second chip based on the measured alignment. In this way, the system allows data signals transmitted by the mini-bars within a transmitter bit position on the first chip to be collectively received by the mini-bars within an associated receiver bit position on the second chip.
摘要翻译：本发明的一个实施例提供了一种系统，其电子地对准位于面对面的不同半导体芯片上的迷你条，以促进半导体芯片之间通过电容耦合的通信。在操作期间，系统测量第一芯片和第二芯片之间的对准。然后，系统在第一芯片上选择一组发射器迷你条，以基于测量的对准来形成发射机位置。以这种方式，该系统允许将数据信号分配到形成发送器位位置的迷你条并发送。该系统还在第二芯片上选择一组接收器迷你条，以形成基于测量对准的接收器位位置。接下来，系统基于测量的对准将第一芯片上的发射机位位置与第二芯片上的接收器位置相关联。以这种方式，系统允许由第一芯片上的发送器位置内的迷你条发送的数据信号由第二芯片上相关联的接收器位位置内的迷你条集中接收。

9. 发明授权

US07256628B2 Speed-matching control method and circuit 有权
标题翻译：速度匹配控制方法和电路
公开(公告)号：US07256628B2
公开(公告)日：2007-08-14
申请号：US10671641
申请日：2003-09-26
申请人： Robert J. Drost , William S. Coates , Josephus C. Ebergen
发明人： Robert J. Drost , William S. Coates , Josephus C. Ebergen
IPC分类号： H03L7/06
CPC分类号： G06F1/12
摘要： One embodiment of the present invention provides a system that matches speeds of asynchronous operation between a local chip and a neighboring chip. The system derives an internal frequency signal from an internal oscillator on the local chip, and receives an external frequency signal from a neighboring chip. The system then compares the internal frequency signal with the external frequency signal to generate a control signal, which is applied to the local chip to adjust the operating speed of the local chip, and applied to the internal oscillator to adjust the frequency of the internal oscillator.
摘要翻译：本发明的一个实施例提供了一种匹配本地芯片和相邻芯片之间的异步操作速度的系统。该系统从本地芯片上的内部振荡器得到内部频率信号，并从相邻芯片接收外部频率信号。然后系统将内部频率信号与外部频率信号进行比较，以产生一个控制信号，该控制信号被施加到本地芯片上以调整本地芯片的工作速度，并施加到内部振荡器以调整内部振荡器的频率。

10. 发明申请

US20120128037A1 ASYNCHRONOUS FIFO CIRCUIT FOR LONG-DISTANCE ON-CHIP COMMUNICATION 有权
标题翻译：用于长距离片上通信的异步FIFO电路
公开(公告)号：US20120128037A1
公开(公告)日：2012-05-24
申请号：US12954474
申请日：2010-11-24
申请人： William S. Coates , Robert J. Drost , Josephus C. Ebergen
发明人： William S. Coates , Robert J. Drost , Josephus C. Ebergen
IPC分类号： H04B3/36 , G06F3/00
CPC分类号： H04B3/36
摘要： The disclosed embodiments provide a first-in, first-out (FIFO) circuit that operates asynchronously. The FIFO circuit includes a data path that contains data latches sequentially connected through data-wire segments. The FIFO circuit also includes a control circuit that generates control signals for the data latches so that the data path behaves like a FIFO. The control circuit includes control components sequentially connected to each other through control-wire segments and repeaters located within the control-wire segments. The control components are configured to asynchronously generate the control signals for the data latches, and the repeaters are configured to repeat asynchronous signals communicated between the asynchronous control components.
摘要翻译：所公开的实施例提供异步操作的先入先出（FIFO）电路。 FIFO电路包括包含通过数据线段顺序连接的数据锁存器的数据路径。 FIFO电路还包括一个控制电路，该控制电路为数据锁存器产生控制信号，使得数据通路的行为类似于FIFO。控制电路包括通过控制线段和位于控制线段内的中继器而相互连接的控制组件。控制组件被配置为异步地生成用于数据锁存器的控制信号，并且中继器被配置为重复异步控制组件之间传送的异步信号。

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