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    • 1. 发明申请
    • PLASMA PROCESSING APPARATUS WITH REDUCED EFFECTS OF PROCESS CHAMBER ASYMMETRY
    • 具有减少过程室不对称效应的等离子体处理装置
    • US20120103524A1
    • 2012-05-03
    • US13240451
    • 2011-09-22
    • Robert CHEBIAlan CHESHIREStanley DETMARGabriel ROUPILLARD
    • Robert CHEBIAlan CHESHIREStanley DETMARGabriel ROUPILLARD
    • C23F1/08
    • H01J37/321H01J37/3211
    • Plasma processing apparatus that provide an asymmetric plasma distribution within the processing apparatus are provided herein. In some embodiments, a plasma processing apparatus may include a process chamber having a processing volume with a substrate support disposed therein; and a first RF coil disposed above the substrate support to couple RF energy into the processing volume, wherein an electric field generated by RF energy moving along the first RF coil is asymmetric about a central axis of the substrate support. In some embodiments, a pump port is disposed asymmetrically with respect to the processing volume to remove one or more gases from the processing volume. In some embodiments, the first RF coil is asymmetrically disposed about the central axis of the substrate support.
    • 本文提供了在处理装置内提供不对称等离子体分布的等离子体处理装置。 在一些实施例中,等离子体处理装置可以包括具有处理容积的处理室,其中设置有衬底支撑件; 以及设置在所述衬底支撑件上方以将RF能量耦合到所述处理容积中的第一RF线圈,其中由所述第一RF线圈移动的RF能量产生的电场围绕所述衬底支撑件的中心轴线是不对称的。 在一些实施例中,泵端口相对于处理容积非对称地设置,以从处理容积去除一个或多个气体。 在一些实施例中,第一RF线圈围绕衬底支撑件的中心轴线不对称地设置。