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    • 3. 发明申请
    • MULTI-LEVEL POWER AMPLIFICATION SYSTEM
    • 多级功率放大系统
    • US20090231055A1
    • 2009-09-17
    • US12403292
    • 2009-03-12
    • Noel LopezCharles WoodsRob ZienkewiczJon Filreis
    • Noel LopezCharles WoodsRob ZienkewiczJon Filreis
    • H01P5/00
    • H01P5/024H01P5/182H03F3/602
    • In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.
    • 通常,根据本发明的示例性方面,提供了一种配置为使用诸如来自单片微波集成电路或MMIC的微波信号的组合的功率的电气系统。 在一个示例性实施例中,本发明的系统还包括电路直接连接到的低损耗接口。 在另一个示例性实施例中,电路连接到连接到低损耗接口的引脚。 在本发明的另一个示例性实施例中,提供了一种多层功率放大器,其包括两个或多个根据本发明的阻抗匹配接口的底板和电路。 该多层功率放大器被配置为放大能量信号并且与现有功率组合器相比具有显着减小的体积。
    • 4. 发明授权
    • Multi-level power amplification system
    • 多级功率放大系统
    • US08598966B2
    • 2013-12-03
    • US13472231
    • 2012-05-15
    • Noel LopezCharles WoodsRob ZienkewiczJon Filreis
    • Noel LopezCharles WoodsRob ZienkewiczJon Filreis
    • H01P5/12
    • H01P5/024H01P5/182H03F3/602
    • In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.
    • 通常,根据本发明的示例性方面,提供了一种配置为使用诸如来自单片微波集成电路或MMIC的微波信号的组合的功率的电气系统。 在一个示例性实施例中,本发明的系统还包括电路直接连接到的低损耗接口。 在另一个示例性实施例中,电路连接到连接到低损耗接口的引脚。 在本发明的另一个示例性实施例中,提供了一种多层功率放大器,其包括两个或多个根据本发明的阻抗匹配接口的底板和电路。 该多层功率放大器被配置为放大能量信号并且与现有功率组合器相比具有显着减小的体积。
    • 5. 发明申请
    • MULTI-LEVEL POWER AMPLIFICATION SYSTEM
    • 多级功率放大系统
    • US20120229219A1
    • 2012-09-13
    • US13472231
    • 2012-05-15
    • Noel LopezCharles WoodsRob ZienkewiczJon Filreis
    • Noel LopezCharles WoodsRob ZienkewiczJon Filreis
    • H03F3/14
    • H01P5/024H01P5/182H03F3/602
    • In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.
    • 通常,根据本发明的示例性方面,提供了一种配置为使用诸如来自单片微波集成电路或MMIC的微波信号的组合的功率的电气系统。 在一个示例性实施例中,本发明的系统还包括电路直接连接到的低损耗接口。 在另一个示例性实施例中,电路连接到连接到低损耗接口的引脚。 在本发明的另一个示例性实施例中,提供了一种多层功率放大器,其包括两个或多个根据本发明的阻抗匹配接口的底板和电路。 该多层功率放大器被配置为放大能量信号并且与现有功率组合器相比具有显着减小的体积。
    • 6. 发明授权
    • Multi-level power amplification system
    • 多级功率放大系统
    • US08212631B2
    • 2012-07-03
    • US12403292
    • 2009-03-12
    • Noel LopezCharles WoodsRob ZienkewiczJon Filreis
    • Noel LopezCharles WoodsRob ZienkewiczJon Filreis
    • H01P5/12
    • H01P5/024H01P5/182H03F3/602
    • In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.
    • 通常,根据本发明的示例性方面,提供了一种配置为使用诸如来自单片微波集成电路或MMIC的微波信号的组合的功率的电气系统。 在一个示例性实施例中,本发明的系统还包括电路直接连接到的低损耗接口。 在另一个示例性实施例中,电路连接到连接到低损耗接口的引脚。 在本发明的另一个示例性实施例中,提供了一种多层功率放大器,其包括两个或多个根据本发明的阻抗匹配接口的底板和电路。 该多层功率放大器被配置为放大能量信号并且与现有功率组合器相比具有显着减小的体积。
    • 8. 发明申请
    • Multi-Beam Active Phased Array Architecture
    • 多光束有源相控阵列架构
    • US20120184229A1
    • 2012-07-19
    • US13412901
    • 2012-03-06
    • David W. CormanRob ZienkewiczDavid R. Saunders
    • David W. CormanRob ZienkewiczDavid R. Saunders
    • H04B1/04H01Q21/24H04B1/16
    • H01Q3/34G06G7/12H01Q3/26H01Q3/36H01Q15/242
    • In an exemplary embodiment, a phased array antenna comprises multiple subcircuits in communication with multiple radiating elements. The radio frequency signals are adjusted for both polarization control and beam steering. In a receive embodiment, multiple RF signals are received and combined into at least one receive beam output. In a transmit embodiment, at least one transmit beam input is divided and transmitted through multiple radiating elements. In an exemplary embodiment, the phased array antenna provides multi-beam formation over multiple operating frequency bands. The wideband nature of the active components allows for operation over multiple frequency bands simultaneously. Furthermore, the antenna polarization may be static or dynamically controlled at the subarray or radiating element level.
    • 在示例性实施例中,相控阵天线包括与多个辐射元件通信的多个子电路。 调整射频信号用于偏振控制和光束转向。 在接收实施例中,接收多个RF信号并将其组合成至少一个接收波束输出。 在发射实施例中,至少一个发射波束输入被分割并通过多个辐射元件传输。 在示例性实施例中,相控阵天线在多个工作频带上提供多波束形成。 有源元件的宽带特性允许同时在多个频带上进行操作。 此外,天线极化可以是在子阵列或辐射元件级别处的静态或动态控制。
    • 10. 发明授权
    • Multi-beam active phased array architecture
    • 多光束有源相控阵列架构
    • US08160530B2
    • 2012-04-17
    • US12759059
    • 2010-04-13
    • David W. CormanRob ZienkewiczDavid R Saunders
    • David W. CormanRob ZienkewiczDavid R Saunders
    • H04B1/38H01Q19/00
    • H01Q3/34G06G7/12H01Q3/26H01Q3/36H01Q15/242
    • In an exemplary embodiment, a phased array antenna comprises multiple subcircuits in communication with multiple radiating elements. The radio frequency signals are adjusted for both polarization control and beam steering. In a receive embodiment, multiple RF signals are received and combined into at least one receive beam output. In a transmit embodiment, at least one transmit beam input is divided and transmitted through multiple radiating elements. In an exemplary embodiment, the phased array antenna provides multi-beam formation over multiple operating frequency bands. The wideband nature of the active components allows for operation over multiple frequency bands simultaneously. Furthermore, the antenna polarization may be static or dynamically controlled at the subarray or radiating element level.
    • 在示例性实施例中,相控阵天线包括与多个辐射元件通信的多个子电路。 调整射频信号用于偏振控制和光束转向。 在接收实施例中,接收多个RF信号并将其组合成至少一个接收波束输出。 在发送实施例中,至少一个发射波束输入被分割并通过多个辐射元件传输。 在示例性实施例中,相控阵天线在多个工作频带上提供多波束形成。 有源元件的宽带特性允许同时在多个频带上进行操作。 此外,天线极化可以是在子阵列或辐射元件级别处的静态或动态控制。