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1. 发明授权

US06741140B2 Circuit for receiving an AC coupled broadband signal 有权
标题翻译：用于接收交流耦合宽带信号的电路
公开(公告)号：US06741140B2
公开(公告)日：2004-05-25
申请号：US10012478
申请日：2001-12-12
申请人： Riyaz R. Jamal , Gilbert P. Brunette , Simon C. Tsang
发明人： Riyaz R. Jamal , Gilbert P. Brunette , Simon C. Tsang
IPC分类号： H03H738
CPC分类号： H03F1/56 , H03H7/38
摘要： A receiving circuit having a termination impedance and an equalization capacitor. The receiving circuit is connectable to a signal source having a source impedance through a DC (direct current) blocking capacitor. The value of the equalization capacitor is chosen such that voltage spikes otherwise caused by the blocking capacitor are eliminated. The receiving circuit is especially useful in distributed electronic amplifiers and electro-optic modulators.
摘要翻译：具有端接阻抗的接收电路和均衡电容器。接收电路可通过DC（直流）阻塞电容器连接到具有源极阻抗的信号源。选择均衡电容器的值，使得消除由阻塞电容器引起的电压尖峰。接收电路在分布式电子放大器和电光调制器中特别有用。

2. 发明授权

US07030712B2 Radio frequency (RF) circuit board topology 有权
公开(公告)号：US07030712B2
公开(公告)日：2006-04-18
申请号：US10790336
申请日：2004-03-01
申请人： Gilbert P. Brunette , Eric Johnson , Stephen G. Rayment , Colin Soul
发明人： Gilbert P. Brunette , Eric Johnson , Stephen G. Rayment , Colin Soul
IPC分类号： H01P5/00
CPC分类号： H05K1/0251 , H01L2223/6616 , H01L2223/6622 , H01L2223/6627 , H01L2924/1903 , H05K1/0222 , H05K3/429 , H05K2201/0715 , H05K2201/09618 , H05K2201/09718 , H05K2201/09809
摘要： An interconnection structure for interconnecting circuitry on a first conductive layer to circuitry on a second conductive layer is provided. The interconnection structure of the present invention comprises a signal conductor via surrounded by a plurality of ground vias. The plurality of ground vias shield the signal conductor via, thus providing electrical isolation for the conductor via from the rest of the circuitry. One feature of the present invention is that the plurality of ground vias can be modified, adjusting their diameters and their placement relative to the signal conductor via, in order to affect the overall characteristic impedance of the interconnection structure. This feature is useful when propagating high frequency signals between signal traces on different conductive layers of a printed circuit board. In view of the high frequencies used in today's wireless communication systems, the interconnection structure proposed aids in the practical implementation of radio frequency modules by mitigating the effects of impedance discontinuities ordinarily present at signal trace-to-via transition regions.

3. 发明授权

US07154356B2 Radio frequency (RF) circuit board topology 有权
标题翻译：射频（RF）电路板拓扑
公开(公告)号：US07154356B2
公开(公告)日：2006-12-26
申请号：US11351041
申请日：2006-02-09
申请人： Gilbert P. Brunette , Eric Johnson , Stephen G. Rayment , Colin Soul
发明人： Gilbert P. Brunette , Eric Johnson , Stephen G. Rayment , Colin Soul
IPC分类号： H03H7/38
CPC分类号： H05K1/0251 , H01L2223/6616 , H01L2223/6622 , H01L2223/6627 , H01L2924/1903 , H05K1/0222 , H05K3/429 , H05K2201/0715 , H05K2201/09618 , H05K2201/09718 , H05K2201/09809
摘要： An interconnection structure for interconnecting circuitry on a first conductive layer to circuitry on a second conductive layer is provided. The interconnection structure of the present invention comprises a signal conductor via surrounded by a plurality of ground vias. The plurality of ground vias shield the signal conductor via, thus providing electrical isolation for the conductor via from the rest of the circuitry. One feature of the present invention is that the plurality of ground vias can be modified, adjusting their diameters and their placement relative to the signal conductor via, in order to affect the overall characteristic impedance of the interconnection structure. This feature is useful when propagating high frequency signals between signal traces on different conductive layers of a printed circuit board. In view of the high frequencies used in today's wireless communication systems, the interconnection structure proposed aids in the practical implementation of radio frequency modules by mitigating the effects of impedance discontinuities ordinarily present at signal trace-to-via transition regions.
摘要翻译：提供了用于将第一导电层上的电路与第二导电层上的电路互连的互连结构。本发明的互连结构包括被多个接地通孔包围的信号导体通路。多个接地通孔屏蔽信号导体通孔，从而为电路的其余部分提供导体通孔的电气隔离。本发明的一个特征是可以改变多个接地通孔，调整它们的直径和相对于信号导体通孔的位置，以便影响互连结构的整体特性阻抗。当在印刷电路板的不同导电层上的信号迹线之间传播高频信号时，该功能非常有用。鉴于当今无线通信系统中使用的高频，所提出的互连结构通过减轻通常存在于信号跟踪到通过过渡区域的阻抗不连续性的影响，有助于射频模块的实际实现。

4. 发明授权

US06418009B1 Broadband multi-layer capacitor 有权
标题翻译：宽带多层电容器
公开(公告)号：US06418009B1
公开(公告)日：2002-07-09
申请号：US09671251
申请日：2000-09-28
申请人： Gilbert P. Brunette
发明人： Gilbert P. Brunette
IPC分类号： H01G4228
CPC分类号： H01G4/385 , H01G4/30
摘要： The invention relates to a hybrid capacitor which combines the functionality of a multi-layer capacitor and a single layer capacitor in one component. The multi-layer capacitor component is comprised of a series of interleaved plates alternatively connected to two terminations and spaced apart by a dielectric material. The single layer capacitor component is comprised of the outer of the series of interleaved plates and an additional plate connected to the opposite termination as the outer interleaved plate and separated from that plate by a second dielectric material. This combination of an SLC and an MLC into a single hybrid capacitor facilitates easy assembly and improves electrical performance over using a separate multi-layer capacitor and a single layer capacitor.
摘要翻译：本发明涉及一种组合多层电容器和一层电容器的功能的混合电容器。多层电容器组件由交替连接到两个端子并由电介质材料隔开的一系列交错板组成。单层电容器组件由一系列交错板的外部组成，并且附加板与外部交错板连接到相对的端子，并且通过第二电介质材料与该板分离。将SLC和MLC组合成单个混合电容器有助于轻松组装，并提高使用单独的多层电容器和单层电容器的电气性能。

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