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1. 发明申请

US20080185178A1 Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment 审中-公开
标题翻译：电路板及其制造方法，半导体封装，组件内置模块和电子设备板
公开(公告)号：US20080185178A1
公开(公告)日：2008-08-07
申请号：US12011725
申请日：2008-01-29
申请人： Rikiya Okimoto , Yoji Ueda , Satoru Tomekawa , Tousaku Nishiyama , Shozo Ochi
发明人： Rikiya Okimoto , Yoji Ueda , Satoru Tomekawa , Tousaku Nishiyama , Shozo Ochi
IPC分类号： H05K1/11
CPC分类号： H01L23/49838 , H01L23/49822 , H01L24/13 , H01L24/45 , H01L24/48 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/32145 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K1/113 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K2201/0355 , H05K2201/10674 , H05K2203/0191 , H05K2203/1461 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A circuit board of the present invention, includes: an electrical insulating layer including at least one layer of electrical insulating base; and a conductive portion formed in a via hole provided in the electrical insulating base. A land for mounting only is disposed on at least one surface of the electrical insulating base that is arranged at an outermost layer. According to a method for manufacturing a circuit board of the present invention, includes the steps of: forming a via hole in an electrical insulating base; filling the via hole with a conductive paste; laminating a metal foil or a releasing sheet on the electrical insulating base, and placing a jig for pressing above and below the lamination, followed by hot-pressing so as to apply heat and pressure thereto, so as to form a conductive portion made of the conductive paste in the via hole; and forming a land for mounting only on at least one surface of the electrical insulating base that is arranged at an outermost layer. Thereby, a circuit board can be provided, having a land for mounting formed with a narrow pitch.
摘要翻译：本发明的电路板包括：电绝缘层，其包括至少一层电绝缘基底; 以及形成在设置在电绝缘基底中的通孔中的导电部分。仅用于安装的地面设置在布置在最外层的电绝缘基底的至少一个表面上。根据本发明的电路基板的制造方法，其特征在于，包括以下步骤：在电绝缘基体中形成通孔; 用导电膏填充通孔; 在电绝缘基底上层叠金属箔或脱模片，并且在层压体的上下配置压入夹具，然后进行热压，以对其进行加热和加压，从而形成由导电膏在通孔中; 并且形成用于仅安装在布置在最外层的电绝缘基底的至少一个表面上的平台。由此，可以提供具有窄间距形成的用于安装的台面的电路板。

2. 发明申请

US20050124197A1 Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment 审中-公开
标题翻译：电路板及其制造方法，半导体封装，组件内置模块和电子设备板
公开(公告)号：US20050124197A1
公开(公告)日：2005-06-09
申请号：US11003680
申请日：2004-12-03
申请人： Rikiya Okimoto , Yoji Ueda , Satoru Tomekawa , Tousaku Nishiyama , Shozo Ochi
发明人： Rikiya Okimoto , Yoji Ueda , Satoru Tomekawa , Tousaku Nishiyama , Shozo Ochi
IPC分类号： H01L23/498 , H05K1/11 , H05K3/40 , H05K3/46 , H01R13/62
CPC分类号： H01L23/49838 , H01L23/49822 , H01L24/13 , H01L24/45 , H01L24/48 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/32145 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K1/113 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K2201/0355 , H05K2201/10674 , H05K2203/0191 , H05K2203/1461 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A circuit board of the present invention, includes: an electrical insulating layer including at least one layer of electrical insulating base; and a conductive portion formed in a via hole provided in the electrical insulating base. A land for mounting only is disposed on at least one surface of the electrical insulating base that is arranged at an outermost layer. According to a method for manufacturing a circuit board of the present invention, includes the steps of: forming a via hole in an electrical insulating base; filling the via hole with a conductive paste; laminating a metal foil or a releasing sheet on the electrical insulating base, and placing a jig for pressing above and below the lamination, followed by hot-pressing so as to apply heat and pressure thereto, so as to form a conductive portion made of the conductive paste in the via hole; and forming a land for mounting only on at least one surface of the electrical insulating base that is arranged at an outermost layer. Thereby, a circuit board can be provided, having a land for mounting formed with a narrow pitch.
摘要翻译：本发明的电路板包括：电绝缘层，其包括至少一层电绝缘基底; 以及形成在设置在电绝缘基底中的通孔中的导电部分。仅用于安装的地面设置在布置在最外层的电绝缘基底的至少一个表面上。根据本发明的电路基板的制造方法，其特征在于，包括以下步骤：在电绝缘基体中形成通孔; 用导电膏填充通孔; 在电绝缘基底上层叠金属箔或脱模片，并且在层压体的上下配置压入夹具，然后进行热压，以对其进行加热和加压，从而形成由导电膏在通孔中; 并且形成用于仅安装在布置在最外层的电绝缘基底的至少一个表面上的平台。由此，可以提供具有窄间距形成的用于安装的台面的电路板。

3. 发明申请

US20090032285A1 MULTI-LAYER CIRCUIT SUBSTRATE MANUFACTURING METHOD AND MULTI-LAYER CIRCUIT SUBSTRATE 审中-公开
标题翻译：多层电路基板制造方法及多层电路基板
公开(公告)号：US20090032285A1
公开(公告)日：2009-02-05
申请号：US11814698
申请日：2005-01-27
申请人： Yoji Ueda , Susumu Matsuoka , Rikiya Okimoto , Shozo Ochi , Satoru Tomekawa
发明人： Yoji Ueda , Susumu Matsuoka , Rikiya Okimoto , Shozo Ochi , Satoru Tomekawa
IPC分类号： H05K3/46 , H05K1/14 , H05K1/00
CPC分类号： H05K1/024 , H05K3/4069 , H05K3/4614 , H05K3/462 , H05K3/4652 , H05K2201/0191 , H05K2201/0355 , H05K2201/09318 , H05K2201/09327 , H05K2201/10378 , H05K2203/061 , H05K2203/1461 , Y10T428/24843
摘要： A method of manufacturing a multilayered circuit board includes the steps of: manufacturing a laminated body by laminating a prepreg of a predetermined thickness on at least one surface of a double-sided circuit board having a grounding link and a signal wiring patterned on both surfaces thereof; and applying heat and pressure to the laminated body and completing a layered structure in which the signal wiring is laid inside the prepreg at a boundary between the double-sided circuit board and the prepreg, wherein prepreg sheets of a predetermined thickness are used in a completed layered structure so that a thickness of a prepreg of the double-sided circuit board is smaller than a distance between a surface of the prepreg on a side not opposed to the double-sided circuit board and the signal wiring laid inside the prepreg.
摘要翻译：一种制造多层电路板的方法包括以下步骤：通过在具有接地链路的双面电路板和在其两个表面上图案化的信号布线的至少一个表面层压预定厚度的预浸料来制造层压体 ; 并且对层压体施加热和压力，并且完成在双面电路板和预浸料坯之间的边界处将信号布线放置在预浸料坯内部的层状结构，其中预定厚度的预浸料片材用于完成使得双面电路板的预浸料坯的厚度小于与双面电路板不相对的一侧上的预浸料坯的表面与布置在预浸料坯内部的信号线之间的距离。

4. 发明授权

US07155820B2 Method for manufacturing printed circuit board 有权
标题翻译：印刷电路板制造方法
公开(公告)号：US07155820B2
公开(公告)日：2007-01-02
申请号：US10695302
申请日：2003-10-27
申请人： Daizo Andoh , Fumio Echigo , Tadashi Nakamura , Yasuhiro Nakatani , Yoji Ueda , Tousaku Nishiyama , Shozo Ochi
发明人： Daizo Andoh , Fumio Echigo , Tadashi Nakamura , Yasuhiro Nakatani , Yoji Ueda , Tousaku Nishiyama , Shozo Ochi
IPC分类号： H01K3/10 , H01R12/04
CPC分类号： H05K3/4069 , H05K1/0366 , H05K1/0373 , H05K3/4614 , H05K3/462 , H05K3/4652 , H05K2201/0266 , H05K2201/0355 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917
摘要： The present invention provides a method of manufacturing a printed circuit board, which includes preparing a dielectric substrate, coating surfaces of the dielectric substrate, filling a via hole with a conductor, peeling mold-releasing films, compressing the dielectric substrate and forming metal foils. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity.
摘要翻译：本发明提供一种制造印刷电路板的方法，其包括制备电介质基板，电介质基板的涂层表面，用导体填充通孔，剥离脱模膜，压缩电介质基板和形成金属箔。电介质基板在两表面上具有图案化的布线层，并且布线层通过导体彼此电连接。电介质基板由玻璃布或浸渍有与微粒混合的热固性环氧树脂的玻璃无纺布制成，并且导体中的导电填料的平均粒径大于微粒的平均粒径。因此，印刷电路板整体上具有改善的耐湿性，并且还具有优异的连接可靠性和修复电阻。此外，印刷电路板的电介质基板具有改善的机械强度，例如弯曲刚度。

5. 发明授权

US06753483B2 Printed circuit board and method of manufacturing the same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US06753483B2
公开(公告)日：2004-06-22
申请号：US09879385
申请日：2001-06-12
申请人： Daizo Andoh , Fumio Echigo , Tadashi Nakamura , Yasuhiro Nakatani , Yoji Ueda , Tousaku Nishiyama , Shozo Ochi
发明人： Daizo Andoh , Fumio Echigo , Tadashi Nakamura , Yasuhiro Nakatani , Yoji Ueda , Tousaku Nishiyama , Shozo Ochi
IPC分类号： H01R1204
CPC分类号： H05K3/4069 , H05K1/0366 , H05K1/0373 , H05K3/4614 , H05K3/462 , H05K3/4652 , H05K2201/0266 , H05K2201/0355 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917
摘要： The present invention provides a printed circuit board, which includes a dielectric substrate having via holes formed in the thickness direction, and a conductor including a conductive filler is filled in the via holes. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity. The present invention also provides a method of manufacturing such a printed circuit board.
摘要翻译：本发明提供了一种印刷电路板，其包括具有沿厚度方向形成的通孔的电介质基板，并且包含导电填料的导体填充在通孔中。电介质基板在两表面上具有图案化的布线层，并且布线层通过导体彼此电连接。电介质基板由玻璃布或浸渍有与微粒混合的热固性环氧树脂的玻璃无纺布制成，并且导体中的导电填料的平均粒径大于微粒的平均粒径。因此，印刷电路板整体上具有改善的耐湿性，并且还具有优异的连接可靠性和修复电阻。此外，印刷电路板的电介质基板具有改善的机械强度，例如弯曲刚度。本发明还提供一种制造这种印刷电路板的方法。

6. 发明授权

US06518514B2 Circuit board and production of the same 失效
公开(公告)号：US06518514B2
公开(公告)日：2003-02-11
申请号：US09928869
申请日：2001-08-13
申请人： Takeshi Suzuki , Tatsuo Ogawa , Yoshihiro Bessho , Satoru Tomekawa , Yasuhiro Nakatani , Yoji Ueda , Susumu Matsuoka , Daizo Andoh , Fumio Echigo
发明人： Takeshi Suzuki , Tatsuo Ogawa , Yoshihiro Bessho , Satoru Tomekawa , Yasuhiro Nakatani , Yoji Ueda , Susumu Matsuoka , Daizo Andoh , Fumio Echigo
IPC分类号： H01R1204
CPC分类号： H05K1/0373 , H05K1/036 , H05K3/20 , H05K3/202 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K3/4658 , H05K2201/0195 , H05K2201/0209 , H05K2201/068 , H05K2203/1461 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917
摘要： A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.

7. 发明授权

US06691409B2 Method of producing a circuit board 失效
标题翻译：电路板的制造方法
公开(公告)号：US06691409B2
公开(公告)日：2004-02-17
申请号：US10280964
申请日：2002-10-25
申请人： Takeshi Suzuki , Tatsuo Ogawa , Yoshihiro Bessho , Satoru Tomekawa , Yasuhiro Nakatani , Yoji Ueda , Susumu Matsuoka , Daizo Andoh , Fumio Echigo
发明人： Takeshi Suzuki , Tatsuo Ogawa , Yoshihiro Bessho , Satoru Tomekawa , Yasuhiro Nakatani , Yoji Ueda , Susumu Matsuoka , Daizo Andoh , Fumio Echigo
IPC分类号： H01K300
CPC分类号： H05K1/0373 , H05K1/036 , H05K3/20 , H05K3/202 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K3/4658 , H05K2201/0195 , H05K2201/0209 , H05K2201/068 , H05K2203/1461 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917
摘要： A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.
摘要翻译：电路板被构造成在布线层之间包括不少于两个布线层，用于电绝缘的绝缘体层和在绝缘体层的厚度方向上设置在绝缘体层中的内通孔导电构件，用于布线层之间的电连接。绝缘体层由包含有机树脂和热膨胀系数小于有机树脂的材料的复合材料制成，并且包括以所述顺序层压的表面部分，芯部分和表面部分，表面部分具有高含量的有机树脂，芯部分的有机树脂含量低。所述布线层具有与所述内通孔导电部件连接的台面部，所述接合部嵌入以与所述芯部大体接触，所述内通孔导电部件的厚度基本上等于芯部的厚度。根据该结构，将金属箔的一部分嵌入到绝缘体层中以与芯层接触。因此，能够提供能够选择性地压缩导电材料的部分的电路基板，由此能够确保层之间的稳定的连接。

8. 发明授权

US06459046B1 Printed circuit board and method for producing the same 有权
公开(公告)号：US06459046B1
公开(公告)日：2002-10-01
申请号：US09919319
申请日：2001-07-31
申请人： Shozo Ochi , Fumio Echigo , Yoji Ueda
发明人： Shozo Ochi , Fumio Echigo , Yoji Ueda
IPC分类号： H05K103
CPC分类号： H05K3/4069 , H05K3/20 , H05K3/386 , H05K3/4614 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4658 , H05K2201/0191 , H05K2201/0195 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49155 , Y10T29/49165 , Y10T428/12028 , Y10T428/12528
摘要： A printed circuit board of the present invention is formed of an electrical insulating base material with through holes that are formed in a thickness direction of the electrical insulating base material and are filled with an electrical conductor; the electrical insulating base material including a core layer formed by impregnating a holder with a resin and resin layers formed on both sides of the core layer; and wiring layers that are formed on both surfaces of the electrical insulating base material into a predetermined pattern and are electrically connected to each other by the electrical conductor. The wiring layer is embedded in at least one of the resin layers. The resin layers on the both sides have different thicknesses from each other, and a thinner layer out of the resin layers has a thickness equal to or smaller than a mean particle diameter of an electrically conductive filler contained in the electrical conductor. By adjusting the thickness of the resin layers formed on both sides of the resin holder such as a glass cloth, it is possible to ensure high reliability when electrically connecting circuit boards using an electrically conductive paste as the electrical conductor.

9. 发明授权

US06799369B2 Printed circuit board and method for producing the same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US06799369B2
公开(公告)日：2004-10-05
申请号：US10224031
申请日：2002-08-19
申请人： Shozo Ochi , Fumio Echigo , Yoji Ueda
发明人： Shozo Ochi , Fumio Echigo , Yoji Ueda
IPC分类号： H01K310
CPC分类号： H05K3/4069 , H05K3/20 , H05K3/386 , H05K3/4614 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4658 , H05K2201/0191 , H05K2201/0195 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49155 , Y10T29/49165 , Y10T428/12028 , Y10T428/12528
摘要： A printed circuit board of the present invention is formed of an electrical insulating base material with through holes that are formed in a thickness direction of the electrical insulating base material and are filled with an electrical conductor; the electrical insulating base material including a core layer formed by impregnating a holder with a resin and resin layers formed on both sides of the core layer; and wiring layers that are formed on both surfaces of the electrical insulating base material into a predetermined pattern and are electrically connected to each other by the electrical conductor. The wiring layer is embedded in at least one of the resin layers. The resin layers on the both sides have different thicknesses from each other, and a thinner layer out of the resin layers has a thickness equal to or smaller than a mean particle diameter of an electrically conductive filler contained in the electrical conductor. By adjusting the thickness of the resin layers formed on both sides of the resin holder such as a glass cloth, it is possible to ensure high reliability when electrically connecting circuit boards using an electrically conductive paste as the electrical conductor.
摘要翻译：本发明的印刷电路板由电绝缘基材形成，所述电绝缘基材具有沿着所述电绝缘基材的厚度方向形成并且填充有电导体的通孔; 电绝缘基材包括通过用树脂浸渍保持器形成的芯层和形成在芯层两侧的树脂层; 以及在所述电绝缘基材的两面形成为规定图案并通过所述电导体彼此电连接的布线层。布线层嵌入至少一个树脂层中。两侧的树脂层的厚度不同，树脂层的薄层的厚度等于或小于电导体中所含的导电填料的平均粒径。通过调节玻璃布等树脂保持架的两侧形成的树脂层的厚度，可以确保使用导电性糊料作为导电体的电路基板电连接时的高可靠性。

10. 发明申请

US20060081397A1 Multilayer circuit board 失效
标题翻译：多层电路板
公开(公告)号：US20060081397A1
公开(公告)日：2006-04-20
申请号：US11079373
申请日：2005-03-14
申请人： Kouhei Enchi , Yoji Ueda
发明人： Kouhei Enchi , Yoji Ueda
IPC分类号： H05K7/06
CPC分类号： H05K1/165 , H01F17/0013 , H01F17/0033 , H05K3/4069 , H05K3/4614 , H05K2201/086 , H05K2201/097 , H05K2201/10416
摘要： A multilayer circuit board includes: two or more layers of electrical insulative base members; and two or more layers of conductive patterned layers. At least two of the conductive patterned layers include coil patterns that will be a part of a coil, through holes are provided at predetermined positions of the electrical insulative base members, the positions being sandwiched between the coil patterns, so as to enable communication between respective end portions of the coil patterns, and conductive paste charged in the through holes allows electrical connection to be established between the respective end portions. The coil is formed so as to be wound in a direction perpendicular to a thickness direction of the multilayer circuit board. With this configuration, a multilayer circuit board can be provided, which facilitates increasing the winding number of a coil and has excellent flexibility of circuit design.
摘要翻译：多层电路板包括：两层或多层电绝缘基底构件; 和两层或多层导电图案层。导电图案化层中的至少两个包括将是线圈的一部分的线圈图案，通孔设置在电绝缘基底构件的预定位置处，该位置被夹在线圈图案之间，以便使各个线圈图案的端部，以及填充在通孔中的导电浆料允许在各个端部之间建立电连接。线圈被形成为沿与多层电路板的厚度方向垂直的方向缠绕。利用这种结构，可以提供多层电路板，这有助于增加线圈的绕组数，并且具有优异的电路设计灵活性。

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