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    • 3. 发明授权
    • Stepped oxide, high voltage MOS transistor with near intrinsic channel
regions of different doping levels
    • 步进氧化物,高电压MOS晶体管,具有不同掺杂浓度的近固有沟道区
    • US4236167A
    • 1980-11-25
    • US875529
    • 1978-02-06
    • Murray H. Woods
    • Murray H. Woods
    • H01L29/78H01L27/12H01L29/10H01L29/417H01L29/423H01L29/786
    • H01L29/1045H01L29/42376H01L29/42384H01L29/78624
    • A Metal-Oxide-Semiconductor-Field-Effect-Transistor (MOSFET) is described wherein a body of semiconductor material is provided with source, drain and channel regions and a gate structure located over the interstitial channel portion of the semiconductor body, between the source and drain regions. A stepped or dual thickness oxide layer, having one portion of minimum thickness formed over only a portion of the channel region and another portion of maximum thickness formed over the remaining portion of the channel region. This stepped oxide layer, together with the gate electrode, forms the gate structure. That portion of the channel region covered by the portion of minimum thickness oxide is separated from the drain region, and the portion of maximum thickness oxide is also located over both a portion of the drain region and that portion of the channel region adjacent the drain region.
    • 描述了一种金属氧化物半导体场效应晶体管(MOSFET),其中半导体材料体设置有源极,漏极和沟道区域以及位于半导体主体的间隙沟道部分之间的栅极结构,源极 和漏区。 阶梯状或双重厚度的氧化物层,其仅在沟道区域的一部分上形成最小厚度的一部分,并且在沟道区域的剩余部分上形成最大厚度的另一部分。 该阶梯状氧化物层与栅极电极一起形成栅极结构。 由最小厚度氧化物的部分覆盖的沟道区域的该部分与漏极区域分离,并且最大厚度氧化物的部分也位于漏极区域的两个部分之上,并且沟道区域的与漏极区域相邻的部分 。