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    • 3. 发明申请
    • TIN-SILVER COMPOUND COATING ON PRINTED CIRCUIT BOARDS
    • 印刷电路板上的镀银化合物涂层
    • US20090283305A1
    • 2009-11-19
    • US12466099
    • 2009-05-14
    • Joseph J. LynchRichard Schneider
    • Joseph J. LynchRichard Schneider
    • H05K1/09B05D5/12H05K3/00
    • H05K3/244H05K3/42
    • A tin-silver coating for use with circuit boards, which can include a conductive circuit with an exposed surface disposed on a substrate. The tin-silver coating covers the exposed surface of the conductive circuit. The conductive circuit can include electrical traces, contact pads and vias, each of which may include or be formed of copper. In one embodiment, the tin-silver coating can include a tin weight percentage between 85 and 99.5%, while the silver weight percentage can be between 0.5 and 15%. In one embodiment the tin-silver coating can be between 35 and 60 millionths of an inch. A barrier plate may also be included between the conductive circuit and the tin-silver coating.
    • 一种用于电路板的锡 - 银涂层,其可以包括具有设置在基板上的暴露表面的导电电路。 锡 - 银涂层覆盖导电电路的暴露表面。 导电电路可以包括电迹线,接触焊盘和通孔,其中每一个可以包括铜或由铜形成。 在一个实施方案中,锡 - 银涂层可以包括85至99.5%之间的锡重量百分比,而银重量百分比可以在0.5至15%之间。 在一个实施方案中,锡 - 银涂层可以在35至60百万分之一英寸之间。 导电电路和锡 - 银涂层之间也可以包括阻挡板。
    • 8. 发明申请
    • ELECTROSURGICAL DEVICE WITH VACUUM PORT
    • 带真空口的静电设备
    • US20110190768A1
    • 2011-08-04
    • US13021494
    • 2011-02-04
    • Kyrylo ShvetsovAnthony L. Lizauckas, IIIGregory J. PepeDaniel R. PalmertonJoseph J. LynchChristopher A. Palmerton
    • Kyrylo ShvetsovAnthony L. Lizauckas, IIIGregory J. PepeDaniel R. PalmertonJoseph J. LynchChristopher A. Palmerton
    • A61B18/18
    • A61B18/18
    • An electrosurgical device comprising: an electrode having a first portion whose exterior is electrically uninsulated, a second portion whose exterior is electrically insulated, and a third portion; an elongated hollow body having an internal cavity, a front end, a rear end, an external surface, and an electrical wire arranged within the body. The hollow body is configured to reversibly receive the third portion of the electrode at the front end of the body such that electrical contact is made between the electrode and the electrical wire and the second portion of the electrode is not surrounded by the hollow body. A first button is provided for controlling a current flow at a first level to the electrode and is arranged on the external surface. A vacuum tube is slidably engaged by the body and has an inlet generally facing the front end and adjacent the electrode. A vacuum outlet port is arranged near the rear end of the body, and the outlet port, internal cavity, and vacuum inlet are in fluid communication with each other.
    • 一种电外科装置,包括:电极,其具有外部电绝缘的第一部分,其外部电绝缘的第二部分和第三部分; 一个细长的中空体,其具有内腔,前端,后端,外表面和布置在体内的电线。 中空体构造成在主体的前端处可逆地接收电极的第三部分,使得在电极和电线之间形成电接触,并且电极的第二部分不被中空体包围。 提供第一按钮用于控制电极的第一电流的电流并且布置在外表面上。 真空管可滑动地与主体接合并且具有通常面向前端并且邻近电极的入口。 真空出口位于主体的后端附近,出口,内腔和真空入口彼此流体连通。
    • 9. 发明授权
    • Connector with base having channels to facilitate surface mount solder attachment
    • 带底座的连接器具有便于表面贴装焊接附件的通道
    • US06623283B1
    • 2003-09-23
    • US10027894
    • 2001-12-20
    • Gregory K. TorigianGary L. TomczakJoseph J. Lynch
    • Gregory K. TorigianGary L. TomczakJoseph J. Lynch
    • H01R402
    • H01R12/57H01R43/0256H01R43/0263H05K3/3426H05K13/0465Y02P70/613
    • A surface mount connector for circuit board attachment is provided in the form of an elongate pin with a head or base formed at the lower end of the pin. The base has a bottom surface that extends substantially normal to the axis of the pin and is dimensioned to be positioned on, and soldered to, a pad on a primary circuit board. A solder bond is achieved by re-flowing a quantity of solder applied to the pad along with a quantity of flux before placing the base on top of the quantity of solder. The base is formed with a plurality of channels that open through the bottom surface and through a peripheral wall of the base for permitting gases generated by vaporizing the flux during solder re-flow to escape from underneath the base and to increase the strength of the solder bond between the pad and the base. Exhaustion of the gases prevents undesirable skating of the connector and misalignment and eliminates voids in the solder bond that would otherwise weaken the bond.
    • 用于电路板连接的表面安装连接器以细长销的形式提供,其头部或底部形成在销的下端。 基座具有基本上垂直于销的轴线延伸的底表面,并且尺寸设计成定位在主电路板上的焊盘上并焊接到主电路板上的焊盘。 通过在将基底放置在焊料量的顶部之前,将一定数量的焊料与一定量的焊剂一起重新流动,来实现焊接接合。 底座形成有多个通道,该通道穿过底部表面并穿过底座的周边壁,用于允许在焊料重新流动期间汽化助焊剂而产生的气体从底部下方逸出并增加焊料的强度 垫与基座之间的接合。 气体的耗尽可防止连接器的不希望的滑冰和不对准,并且消除焊料接合中的空隙,否则会削弱接合。