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1. 发明授权

US5387547A Process for adjusting the impedance of a microwave conductor using an air bridge 失效
标题翻译：使用空气桥调整微波导体的阻抗的方法
公开(公告)号：US5387547A
公开(公告)日：1995-02-07
申请号：US965319
申请日：1992-10-23
申请人： Richard M. Dougherty , Ronald F. Kielmeyer, Jr. , Michael Dydyk , Lyle A. Fajen
发明人： Richard M. Dougherty , Ronald F. Kielmeyer, Jr. , Michael Dydyk , Lyle A. Fajen
IPC分类号： H01J23/00 , H01P3/00 , H01P5/02 , H01P5/08 , H01P11/00 , H01L21/58 , H01L21/60
CPC分类号： H01P3/003 , H01P5/028 , H01L2924/0002 , Y10T29/4913
摘要： A method for providing local matching elements for adjusting the characteristic impedance of local transmission line segments to more closely match the input or output impedance of the particular devices to which they couple. The method includes the step of providing a conductive bridge over the active lead of the transmission line, thereby lowering its characteristic impedance. The method can be applied to narrow transmission line segments needed to make contact to small active devices and/or MMIC's and which otherwise exhibit a substantial impedance mismatch with the small elements.
摘要翻译：一种用于提供局部匹配元件的方法，用于调整局部传输线段的特征阻抗以更紧密地匹配它们所耦合的特定器件的输入或输出阻抗。该方法包括在传输线的有源引线上提供导电桥，从而降低其特性阻抗的步骤。该方法可以应用于与小型有源器件和/或MMIC接触所需的窄传输线段，否则其与小元件呈现实质的阻抗失配。

2. 发明授权

US5194833A Airbridge compensated microwave conductors 失效
标题翻译： Airbridge补偿微波导体
公开(公告)号：US5194833A
公开(公告)日：1993-03-16
申请号：US792568
申请日：1991-11-15
申请人： Richard M. Dougherty , Ronald F. Kielmeyer, Jr. , Michael Dydyk , Lyle A. Fajen
发明人： Richard M. Dougherty , Ronald F. Kielmeyer, Jr. , Michael Dydyk , Lyle A. Fajen
IPC分类号： H01J23/00 , H01P3/00 , H01P5/02 , H01P5/08 , H01P11/00
CPC分类号： H01P3/003 , H01P5/028 , H01L2924/0002 , Y10T29/4913
摘要： The performance of microwave coplanar and other circuit boards is improved by providing local matching elements for adjusting the characteristic impedance of local transmission line segments to better match the input or output impedance of the particular devices to which they couple. This is accomplished by providing a conductive bridge over the active lead of the transmission line, thereby lowering its characteristic impedance. This is very useful for narrow transmission line segments needed to make contact to small active device and/or MMIC's and which otherwise exhibit a substantial impedance mismatch with such small elements.
摘要翻译：通过提供用于调整局部传输线段的特征阻抗的局部匹配元件来更好地匹配它们所耦合的特定器件的输入或输出阻抗来提高微波共面和其它电路板的性能。这通过在传输线的有源引线上提供导电桥，从而降低其特性阻抗来实现。这对于与小的有源器件和/或MMIC接触所需的窄传输线段非常有用，并且否则与这些小元件呈现出实质的阻抗失配。

3. 发明授权

US5021799A High permitivity dielectric microstrip dipole antenna 失效
标题翻译：高介电性微带偶极天线
公开(公告)号：US5021799A
公开(公告)日：1991-06-04
申请号：US374817
申请日：1989-07-03
申请人： Joseph P. Kobus , Ronald F. Kielmeyer, Jr. , Arthur Diaz
发明人： Joseph P. Kobus , Ronald F. Kielmeyer, Jr. , Arthur Diaz
IPC分类号： H01Q9/28
CPC分类号： H01Q9/285
摘要： A miniature microstrip dipole antenna is constructed on a high permitivity dielectric substrate for compactibility with microwave monolithic integrated circuit (MMIC) technology. The antenna comprises two dipole arms coupled to opposite faces of the substrate. The dipole arms are coupled to a microstrip transmission line through a tapered balun. The tapered balun comprises two conductors on opposite faces of the substrate which are coupled to corresponding dipole arms. The conductors are separated laterally (with respect to the width of the face of the substrate) a calculated distance, and are gradually tapered. This allows the balun to efficiently transform unbalanced signals at the microstrip transmission line to balanced signals at the plurality of dipole arms. Alternatively, the balun allows balanced signals at the dipole arms to be efficiently transformed to unbalanced signals at the microstrip transmission line. To achieve additional radiation directivity, a ground plane is coupled to and parallel with a back face of the substrate. By using a high dielectric substrate, the cavity formed between the substrate and the ground plane is relatively very shallow.
摘要翻译：微型微带偶极天线由高介电性介质基片构成，用于微波单片集成电路（MMIC）技术的紧凑性。天线包括耦合到衬底的相对面的两个偶极臂。偶极臂通过锥形平衡 - 不平衡转换器耦合到微带传输线。锥形平衡 - 不平衡变压器包括耦合到对应偶极臂的衬底相对面上的两个导体。导体横向（相对于基板的表面的宽度）分开计算的距离，并逐渐变细。这允许平衡 - 不平衡变换器有效地将微带传输线处的不平衡信号转换成多个偶极臂处的平衡信号。或者，平衡 - 不平衡转换器允许在偶极臂处的平衡信号被有效地转换成微带传输线上的不平衡信号。为了获得附加的辐射方向性，接地平面耦合到衬底的背面并平行于衬底的背面。通过使用高电介质衬底，形成在衬底和接地平面之间的腔相对较浅。

4. 发明授权

US5192875A Analog frequency divider utilizing two amplifiers and a LC resonant circuit 失效
标题翻译：使用两个放大器和LC谐振电路的模拟分频器
公开(公告)号：US5192875A
公开(公告)日：1993-03-09
申请号：US787474
申请日：1991-11-04
申请人： Ronald F. Kielmeyer, Jr.
发明人： Ronald F. Kielmeyer, Jr.
IPC分类号： H03B19/14
CPC分类号： H03B19/14
摘要： An microwave analog frequency divider capable of ten percent bandwidth at 10 GHz has push-push amplifiers forming an injection locked oscillator. The input frequency f.sub.i is injected at the amplifier reference terminals. The amplifier control terminals are coupled by L's and the reference terminals are coupled by C's and the reference and control terminals form with the L's and C's a resonant circuit tuned approximately to the output frequency f.sub.o =f.sub.i /N, where N is the divisor. Parallel resonant circuits in the f.sub.i injection path have high impedance at f.sub.o to prevent loading of the oscillator. A control device in the f.sub.i injection path turns the oscillator on when f.sub.i is present and off when f.sub.i is absent. Matching networks are included at input, output and between the control device and the oscillator to obtain efficient operation.
摘要翻译： 10 GHz带宽为10％的微波模拟分频器具有形成注入锁定振荡器的推挽放大器。输入频率fi注入放大器参考端。放大器控制端子由L s耦合，参考端子由C耦合，参考和控制端子形成，L和C的谐振电路近似调谐到输出频率fo = fi / N，其中N是除数。 fi注入路径中的并联谐振电路在fo处具有高阻抗，以防止振荡器的负载。当fi不存在时，fi注入路径中的控制装置会使振荡器接通，如果fi存在则关闭振荡器。匹配网络包括在输入，输出和控制设备与振荡器之间，以获得有效的操作。

5. 发明授权

US4873497A Wide band voltage controlled R-C oscillator for use with MMIC technology 失效
标题翻译：用于MMIC技术的宽带电压控制R-C振荡器
公开(公告)号：US4873497A
公开(公告)日：1989-10-10
申请号：US252204
申请日：1988-10-03
申请人： Ronald F. Kielmeyer, Jr.
发明人： Ronald F. Kielmeyer, Jr.
IPC分类号： H03B5/18 , H03B5/24
CPC分类号： H03B5/24 , H03B5/18
摘要： A wide band tunable microwave oscillator for monolithic microwave integrated circuits. The oscillator does not use varactors or inductors for oscillation, but uses a voltage variable resistor coupled to a first MESFET supplying a capacitance, and to an amplifying element to create an RC oscillator. The voltage variable resistor is a second MESFET coupled to a variable voltage source. The oscillator takes advantage of the gate capacitance of the first MESFET, as well as the gain available from using an active element within the feedback loop.
摘要翻译：用于单片微波集成电路的宽带可调微波振荡器。振荡器不使用变容二极管或电感器进行振荡，而是使用耦合到提供电容的第一MESFET的电压可变电阻器和用于产生RC振荡器的放大元件。电压可变电阻器是耦合到可变电压源的第二MESFET。振荡器利用第一MESFET的栅极电容，以及在反馈环路内使用有源元件可获得的增益。

6. 发明授权

US4777718A Method of forming and connecting a resistive layer on a pc board 失效
标题翻译：在电路板上形成和连接电阻层的方法
公开(公告)号：US4777718A
公开(公告)日：1988-10-18
申请号：US880613
申请日：1986-06-30
申请人： James M. Henderson , Ronald F. Kielmeyer, Jr.
发明人： James M. Henderson , Ronald F. Kielmeyer, Jr.
IPC分类号： H01C17/07 , H01Q21/00 , H05K1/16 , H05K3/06 , H05K3/42 , H05K3/46 , H05K3/32 , H01C17/06
CPC分类号： H05K1/167 , H01C17/07 , H01Q21/0075 , H05K2201/0355 , H05K2201/09254 , H05K2201/09536 , H05K2203/0361 , H05K3/06 , H05K3/427 , H05K3/4652 , Y10T29/49099 , Y10T29/49126 , Y10T29/49165
摘要： A resistive element is formed on a printed circuit board using only printed circuit board fabrication techniques. A substrate having a bi-metallic cladding on one side of the substrate and a conductive metallic cladding on an opposing side of the substrate is used. A predetermined trace pattern is formed in the metallic cladding. Resistive elements are formed in the bi-metallic cladding opposing their desired locations in the trace pattern. The bi-metallic cladding consists of a resistive layer between the substrate and a second conductive layer. Tabs are etched in the second conductive layer, then resistors, which couple various tabs together, are etched in the resistive layer. Plated holes connect the tabs to desired locations in the trace pattern located on the opposing side of the substrate.
摘要翻译：电阻元件仅使用印刷电路板制造技术形成在印刷电路板上。使用在基板的一侧具有双金属包层的基板和在基板的相对侧上的导电金属包层。在金属包层中形成预定的迹线图案。电阻元件形成在双金属包层中，与其在迹线图案中的期望位置相对。双金属包层由衬底和第二导电层之间的电阻层组成。在第二导电层中蚀刻标签，然后在电阻层中蚀刻将各种接片连接在一起的电阻器。电镀的孔将接片连接到位于衬底的相对侧上的迹线图案中的所需位置。

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