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1. 发明授权

US09362427B2 Metallization of solar cells 有权
标题翻译：太阳能电池的金属化
公开(公告)号：US09362427B2
公开(公告)日：2016-06-07
申请号：US14137782
申请日：2013-12-20
申请人： Richard Hamilton Sewell , David Aaron Randolph Barkhouse , Junbo Wu , Michael Cudzinovic , Paul Loscutoff , Joseph Behnke , Michel Arsène Olivier Ngamo Toko
发明人： Richard Hamilton Sewell , David Aaron Randolph Barkhouse , Junbo Wu , Michael Cudzinovic , Paul Loscutoff , Joseph Behnke , Michel Arsène Olivier Ngamo Toko
IPC分类号： H01L31/0224 , H01L31/18 , H01L31/068 , H01L31/0745
CPC分类号： H01L31/022441 , H01L31/02008 , H01L31/0682 , H01L31/0745 , Y02E10/547 , Y02P70/521
摘要： Approaches for the metallization of solar cells and the resulting solar cells are described. In an example, a method of fabricating a solar cell involves forming a barrier layer on a semiconductor region disposed in or above a substrate. The semiconductor region includes monocrystalline or polycrystalline silicon. The method also involves forming a conductive paste layer on the barrier layer. The method also involves forming a conductive layer from the conductive paste layer. The method also involves forming a contact structure for the semiconductor region of the solar cell, the contact structure including at least the conductive layer.
摘要翻译：描述了用于太阳能电池的金属化和所得到的太阳能电池的方法。在一个实例中，制造太阳能电池的方法涉及在设置在基板中或上方的半导体区域上形成阻挡层。半导体区域包括单晶硅或多晶硅。该方法还涉及在阻挡层上形成导电糊层。该方法还涉及从导电浆料层形成导电层。该方法还包括形成用于太阳能电池的半导体区域的接触结构，该接触结构至少包括导电层。

2. 发明申请

US20150179836A1 METALLIZATION OF SOLAR CELLS 有权
标题翻译：太阳能电池的金属化
公开(公告)号：US20150179836A1
公开(公告)日：2015-06-25
申请号：US14137782
申请日：2013-12-20
申请人： Richard Hamilton Sewell , David Aaron Randolph Barkhouse , Junbo Wu , Michael Cudzinovic , Paul Loscutoff , Joseph Behnke , Michel Arsène Olivier Ngamo Toko
发明人： Richard Hamilton Sewell , David Aaron Randolph Barkhouse , Junbo Wu , Michael Cudzinovic , Paul Loscutoff , Joseph Behnke , Michel Arsène Olivier Ngamo Toko
IPC分类号： H01L31/0224 , H01L31/18
CPC分类号： H01L31/022441 , H01L31/02008 , H01L31/0682 , H01L31/0745 , Y02E10/547 , Y02P70/521
摘要： Approaches for the metallization of solar cells and the resulting solar cells are described. In an example, a method of fabricating a solar cell involves forming a barrier layer on a semiconductor region disposed in or above a substrate. The semiconductor region includes monocrystalline or polycrystalline silicon. The method also involves forming a conductive paste layer on the barrier layer. The method also involves forming a conductive layer from the conductive paste layer. The method also involves forming a contact structure for the semiconductor region of the solar cell, the contact structure including at least the conductive layer.
摘要翻译：描述了用于太阳能电池的金属化和所得到的太阳能电池的方法。在一个实例中，制造太阳能电池的方法涉及在设置在基板中或上方的半导体区域上形成阻挡层。半导体区域包括单晶硅或多晶硅。该方法还涉及在阻挡层上形成导电糊层。该方法还涉及从导电浆料层形成导电层。该方法还包括形成用于太阳能电池的半导体区域的接触结构，该接触结构至少包括导电层。

3. 发明申请

US20160276504A1 METALLIZATION OF SOLAR CELLS 审中-公开
公开(公告)号：US20160276504A1
公开(公告)日：2016-09-22
申请号：US15170786
申请日：2016-06-01
申请人： Richard Hamilton Sewell , David Aaron Randolph Barkhouse , Junbo Wu , Michael Cudzinovic , Paul Loscutoff , Joseph Behnke , Michel Arsène Olivier Ngamo Toko
发明人： Richard Hamilton Sewell , David Aaron Randolph Barkhouse , Junbo Wu , Michael Cudzinovic , Paul Loscutoff , Joseph Behnke , Michel Arsène Olivier Ngamo Toko
IPC分类号： H01L31/0224 , H01L31/02
CPC分类号： H01L31/022441 , H01L31/02008 , H01L31/0682 , H01L31/0745 , Y02E10/547 , Y02P70/521
摘要： Approaches for the metallization of solar cells and the resulting solar cells are described. In an example, a method of fabricating a solar cell involves forming a barrier layer on a semiconductor region disposed in or above a substrate. The semiconductor region includes monocrystalline or polycrystalline silicon. The method also involves forming a conductive paste layer on the barrier layer. The method also involves forming a conductive layer from the conductive paste layer. The method also involves forming a contact structure for the semiconductor region of the solar cell, the contact structure including at least the conductive layer.

4. 发明申请

US20140174518A1 ENHANCED ADHESION OF SEED LAYER FOR SOLAR CELL CONDUCTIVE CONTACT 有权
标题翻译：用于太阳能电池导电接触的增强层粘合剂
公开(公告)号：US20140174518A1
公开(公告)日：2014-06-26
申请号：US13723901
申请日：2012-12-21
申请人： Junbo Wu , Michael C. Johnson , Michael Cudzinovic , Joseph Behnke , Xi Zhu , David D. Smith , Richard Sewell Hamilton , Xiuwen Tu , Seung Bum Rim
发明人： Junbo Wu , Michael C. Johnson , Michael Cudzinovic , Joseph Behnke , Xi Zhu , David D. Smith , Richard Sewell Hamilton , Xiuwen Tu , Seung Bum Rim
IPC分类号： H01L31/0224 , H01L31/18
CPC分类号： H01L31/022425 , H01L31/02167 , H01L31/022441 , H01L31/0682 , H01L31/1864 , Y02E10/50 , Y02E10/547
摘要： Enhanced adhesion of seed layers for solar cell conductive contacts and methods of forming solar cell conductive contacts are described. For example, a method of fabricating a solar cell includes forming an adhesion layer above an emitter region of a substrate. A metal seed paste layer is formed on the adhesion layer. The metal seed paste layer and the adhesion layer are annealed to form a conductive layer in contact with the emitter region of the substrate. A conductive contact for the solar cell is formed from the conductive layer.
摘要翻译：描述了用于太阳能电池导电触点的种子层的增强的附着和形成太阳能电池导电触点的方法。例如，制造太阳能电池的方法包括在基板的发射极区域的上方形成粘附层。在粘合层上形成金属种子糊层。将金属种子糊层和粘附层退火以形成与衬底的发射极区域接触的导电层。用于太阳能电池的导电接触由导电层形成。

5. 发明授权

US09263601B2 Enhanced adhesion of seed layer for solar cell conductive contact 有权
标题翻译：种子层增强了太阳能电池导电接触的附着力
公开(公告)号：US09263601B2
公开(公告)日：2016-02-16
申请号：US13723901
申请日：2012-12-21
申请人： Junbo Wu , Michael C. Johnson , Michael Cudzinovic , Joseph Behnke , Xi Zhu , David D. Smith , Richard Sewell Hamilton , Xiuwen Tu , Seung Bum Rim
发明人： Junbo Wu , Michael C. Johnson , Michael Cudzinovic , Joseph Behnke , Xi Zhu , David D. Smith , Richard Sewell Hamilton , Xiuwen Tu , Seung Bum Rim
IPC分类号： H01L31/042 , H01L31/0224 , H01L31/18 , H01L31/0216
CPC分类号： H01L31/022425 , H01L31/02167 , H01L31/022441 , H01L31/0682 , H01L31/1864 , Y02E10/50 , Y02E10/547
摘要： Enhanced adhesion of seed layers for solar cell conductive contacts and methods of forming solar cell conductive contacts are described. For example, a method of fabricating a solar cell includes forming an adhesion layer above an emitter region of a substrate. A metal seed paste layer is formed on the adhesion layer. The metal seed paste layer and the adhesion layer are annealed to form a conductive layer in contact with the emitter region of the substrate. A conductive contact for the solar cell is formed from the conductive layer.
摘要翻译：描述了用于太阳能电池导电触点的种子层的增强的附着和形成太阳能电池导电触点的方法。例如，制造太阳能电池的方法包括在基板的发射极区域的上方形成粘附层。在粘合层上形成金属种子糊层。将金属种子糊层和粘附层退火以形成与衬底的发射极区域接触的导电层。用于太阳能电池的导电接触由导电层形成。

6. 发明申请

US20140162399A1 METHODS FOR ELECTROLESS CONDUCTIVITY ENHANCEMENT OF SOLAR CELL METALLIZATION 有权
标题翻译：太阳能电池金属电解电导率增强方法
公开(公告)号：US20140162399A1
公开(公告)日：2014-06-12
申请号：US14097164
申请日：2013-12-04
申请人： Michael Cudzinovic , Joseph Behnke
发明人： Michael Cudzinovic , Joseph Behnke
IPC分类号： H01L31/18
CPC分类号： H01L31/0682 , C23C18/1653 , C25D5/10 , C25D7/126 , H01L31/022425 , H01L31/022441 , H01L31/0745 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： A method for forming a contact region for a solar cell is disclosed. The method includes depositing a paste composed of a first metal above a substrate of the solar cell, curing the paste to form a first metal layer, electrolessly plating a second metal layer on the first metal layer and electrolyticly plating a third metal layer on the second metal layer, where the second metal layer electrically couples the first metal layer to the third metal layer. The method can further include electrolyticly plating a fourth metal layer on the third metal layer.
摘要翻译：公开了一种形成太阳能电池接触区域的方法。该方法包括在太阳能电池基板上沉积由第一金属构成的糊料，固化该糊料以形成第一金属层，在第一金属层上无电镀第二金属层，并在第二金属层上电解电镀第三金属层金属层，其中第二金属层将第一金属层电耦合到第三金属层。该方法还可以包括在第三金属层上电镀第四金属层。

7. 发明申请

US20060243598A1 Auxiliary electrode encased in cation exchange membrane tube for electroplating cell 有权
标题翻译：辅助电极封装在电镀槽的阳离子交换膜管中
公开(公告)号：US20060243598A1
公开(公告)日：2006-11-02
申请号：US11362432
申请日：2006-02-24
申请人： Saravjeet Singh , Hooman Hafezi , Manoocher Birang , Aron Rosenfeld , Joseph Behnke
发明人： Saravjeet Singh , Hooman Hafezi , Manoocher Birang , Aron Rosenfeld , Joseph Behnke
IPC分类号： C25D3/56
CPC分类号： C25D17/10 , C25D5/04 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/007 , C25D17/02 , H01L21/2885
摘要： A method and apparatus for plating a metal onto a substrate. One embodiment of the invention provides an apparatus for electrochemically plating a substrate. The apparatus comprises a fluid basin configured to retain a plating solution therein, an anode assembly disposed in the fluid basin, a substrate support member configured to support the substrate and contact the substrate electrically, and an encased auxiliary electrode assembly disposed in the fluid basin. The encased auxiliary electrode assembly generally comprises an auxiliary electrode disposed in a protective tube.
摘要翻译：一种用于将金属电镀到基底上的方法和装置。本发明的一个实施例提供了一种用于对基底进行电化学电镀的装置。该装置包括被配置为在其中保持电镀溶液的流体池，设置在流体池中的阳极组件，被配置为支撑基板并电连接基板的基板支撑构件以及设置在流体池中的封装辅助电极组件。包封的辅助电极组件通常包括设置在保护管中的辅助电极。

8. 发明授权

US09328427B2 Edgeless pulse plating and metal cleaning methods for solar cells 有权
标题翻译：无极脉冲电镀和太阳能电池的金属清洗方法
公开(公告)号：US09328427B2
公开(公告)日：2016-05-03
申请号：US13630546
申请日：2012-09-28
申请人： Joseph Behnke
发明人： Joseph Behnke
IPC分类号： C25D5/48 , C25D5/18 , C25D5/10 , C25D7/12 , H01L31/0224
CPC分类号： C25D5/10 , C25D5/18 , C25D5/48 , C25D7/126 , H01L31/022441 , Y02E10/50
摘要： A method for plating metal to a solar cell is disclosed. The method includes plating a metal layer only on the surface of solar cell without plating metal along the solar cell edges by conducting a first current in a first direction in an electroplating bath, ejecting metal from the metal layer by conducting a second current in a second direction and plating additional metal to the metal layer by conducting a third current in the first direction. The first, second and third current can be alternated. Subsequent to an electroplating process, an ultrasonic cleaning process is performed on the solar cell to remove any excess plated metal along the surface and edges of the solar cell.
摘要翻译：公开了一种将金属电镀到太阳能电池的方法。该方法包括仅在太阳能电池的表面上镀覆金属层，而不通过在电镀槽中沿第一方向进行第一电流而沿着太阳能电池边缘镀覆金属，通过在第二电极中进行第二电流从金属层喷射金属方向，并通过在第一方向上传导第三电流将附加金属镀覆到金属层。第一，第二和第三电流可以交替。在电镀工艺之后，对太阳能电池进行超声波清洗处理，以沿着太阳能电池的表面和边缘去除任何多余的电镀金属。

9. 发明申请

US20150090606A1 ENHANCED POROSIFICATION 有权
标题翻译：增强化学成分
公开(公告)号：US20150090606A1
公开(公告)日：2015-04-02
申请号：US14040116
申请日：2013-09-27
申请人： Joseph Behnke , Seung Bum Rim
发明人： Joseph Behnke , Seung Bum Rim
IPC分类号： C25F3/30 , H01L31/18
CPC分类号： C25F3/30 , C25F3/12 , C25F7/00 , H01L21/0203 , H01L31/0682 , H01L31/1804 , H01L31/1892 , Y02E10/547 , Y02P70/521
摘要： Forming a porous layer on a silicon substrate. Forming the porous layer can include placing a first silicon substrate in a solution, where a first electrode is within a threshold distance to an edge of the silicon substrate. It can further include conducting a first current through the silicon substrate, where the first electrode can be positioned relative to the edge allowing for substantially uniform porosification along the edge of the first silicon substrate.
摘要翻译：在硅衬底上形成多孔层。形成多孔层可以包括将第一硅衬底放置在溶液中，其中第一电极处于与硅衬底的边缘的阈值距离内。其还可以包括通过硅衬底进行第一电流，其中第一电极可相对于边缘定位，允许沿着第一硅衬底的边缘基本上均匀的孔隙化。

10. 发明申请

US20060175201A1 Immersion process for electroplating applications 审中-公开
标题翻译：电镀应用的浸渍工艺
公开(公告)号：US20060175201A1
公开(公告)日：2006-08-10
申请号：US11052443
申请日：2005-02-07
申请人： Hooman Hafezi , Joseph Behnke , Aron Rosenfeld , Timothy Webb , Joseph Yahalom , Christopher McGuirk
发明人： Hooman Hafezi , Joseph Behnke , Aron Rosenfeld , Timothy Webb , Joseph Yahalom , Christopher McGuirk
IPC分类号： C25D5/18
CPC分类号： C25D5/18 , C25D5/34 , C25D7/123 , H01L21/2885 , H01L21/76877
摘要： A method for immersing a substrate into a plating solution. In one embodiment, the method includes applying a first waveform to the substrate as the substrate is being immersed into the plating solution, stopping the application of the first waveform to the substrate as soon as the substrate is fully immersed inside the plating solution, and applying a second waveform to the substrate prior to the substrate being situated into a plating position.
摘要翻译：将基板浸入电镀液中的方法。在一个实施例中，该方法包括当衬底浸入电镀溶液中时将第一波形施加到衬底，一旦衬底完全浸入电镀溶液中，就停止向衬底施加第一波形，并施加在衬底位于电镀位置之前的到衬底的第二波形。

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