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    • 1. 发明授权
    • Ratio of open area to closed area in panels for electronic equipment enclosures
    • 电子设备外壳面板开放面积与封闭面积的比例
    • US07438638B2
    • 2008-10-21
    • US11548158
    • 2006-10-10
    • Richard Evans Lewis, IIIan SeatonJames I. Lawrence
    • Richard Evans Lewis, IIIan SeatonJames I. Lawrence
    • H05K7/20H05K5/00
    • H05K9/0041
    • A method of providing an electronic equipment enclosure having a plurality of panels, including identifying at least one panel through which air is intended to flow, determining the design parameters of the identified panel, and providing an electronic equipment enclosure that includes the identified panel, constructed according to the determined design parameters. Determining the design parameters of the identified panel includes first establishing a maximum ratio of open area to closed area of between 60% and 70% and then determining one or more other parameters of the design of the identified panel in view of the established maximum ratio of open area to closed area. Other parameters include the material of which the identified panel is to be constructed, its thickness, and its rigidity. Specific enclosures benefiting from the design process are also described.
    • 一种提供具有多个面板的电子设备外壳的方法,包括识别空气要流动的至少一个面板,确定所识别的面板的设计参数,以及提供包括所识别的面板的电子设备外壳,构成 根据确定的设计参数。 确定所识别的面板的设计参数包括首先建立开放面积与封闭面积的最大比率在60%至70%之间,然后根据建立的最大比例确定所识别面板的设计的一个或多个其他参数 开放区域到封闭区域。 其他参数包括识别的面板要构造的材料,其厚度和刚度。 还描述了受益于设计过程的特定外壳。