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1. 发明申请

US20050103987A1 Semiconductor component, wafer and package having an optical sensor 审中-公开
标题翻译：具有光学传感器的半导体元件，晶片和封装
公开(公告)号：US20050103987A1
公开(公告)日：2005-05-19
申请号：US10958673
申请日：2004-10-05
申请人： Remi Brechignac , Jonathan Hurwitz
发明人： Remi Brechignac , Jonathan Hurwitz
IPC分类号： H01L31/0203 , H01L31/0216 , H01L31/0232 , H01J5/16
CPC分类号： H01L31/0203 , H01L31/02162 , H01L31/02325 , H01L2224/48091 , H01L2924/00014
摘要： A semiconductor component, semiconductor wafer and semiconductor package include an integrated-circuit chip having, on a front face, an optical sensor and electrical connection pads between the edge of this face and this optical sensor. A protective patch made of a transparent material is placed in front of the optical sensor but does not cover the said optical connection pads. The said protective patch is fixed to the front face of the said chip by a bead of an adhesive extending annularly between, and at a certain distance from, the edge of the said optical sensor and of the electrical connection pads. At least one of the faces of the patch is covered with a protective layer of a material that filters out infrared light rays.
摘要翻译：半导体部件，半导体晶片和半导体封装包括集成电路芯片，其在正面上具有光学传感器和在该面的边缘与该光学传感器之间的电连接焊盘。由透明材料制成的保护贴片放置在光学传感器的前面，但不覆盖所述光学连接垫。所述保护贴片通过在所述光学传感器和所述电连接垫的边缘之间并且距离所述光学传感器的边缘和一定距离之间环形延伸的粘合剂珠固定到所述芯片的前表面。补片的至少一个面被被过滤掉红外光的材料的保护层覆盖。

2. 发明授权

US06969898B1 Optical semiconductor housing and method for making same 有权
标题翻译：光学半导体外壳及其制造方法
公开(公告)号：US06969898B1
公开(公告)日：2005-11-29
申请号：US10129297
申请日：2000-10-30
申请人： Juan Exposito , Remi Brechignac
发明人： Juan Exposito , Remi Brechignac
IPC分类号： H01L25/16 , H01L31/0203 , H01L21/52 , H01L23/04 , H01L23/043
CPC分类号： H01L27/14618 , H01L25/167 , H01L31/0203 , H01L2224/16225 , H01L2224/48227 , H01L2224/48091 , H01L2924/00014
摘要： Optical semiconductor package and its fabrication process, in which: a rear face of a first semiconductor component (3) such as a microprocessor is supported by a front face of an electrical connection support plate (1); a rear face of a second semiconductor component (11) is fixed to a front face of the said first component (3) and a front face of this second component has an optical sensor (13); first electrical connection means (6) connect the said first component to the front face of the said support plate; second electrical connection means (14) connect the said second component to the front face of the said support plate; means (17) ensure encapsulation of the said components stacked on the said support plate and of the said electrical connection means, the said encapsulation means being made from a transparent material which is opposite the said optical sensor; and external electrical connection means (24) are located on an exposed part of the said support plate.
摘要翻译：光半导体封装及其制造工艺，其中：诸如微处理器的第一半导体部件（3）的后表面由电连接支撑板（1）的前表面支撑; 第二半导体部件（11）的后表面固定到所述第一部件（3）的前表面，并且所述第二部件的前表面具有光学传感器（13）; 第一电连接装置（6）将所述第一部件连接到所述支撑板的前表面; 第二电连接装置（14）将所述第二部件连接到所述支撑板的前表面; 装置（17）确保堆放在所述支撑板和所述电连接装置上的所述部件的封装，所述封装装置由与所述光学传感器相对的透明材料制成; 并且外部电连接装置（24）位于所述支撑板的暴露部分上。

3. 发明授权

US06870238B2 Shielded housing for optical semiconductor component 有权
标题翻译：用于光学半导体元件的屏蔽外壳
公开(公告)号：US06870238B2
公开(公告)日：2005-03-22
申请号：US10478177
申请日：2002-05-17
申请人： Juan Exposito , Remi Brechignac , Julien Vittu
发明人： Juan Exposito , Remi Brechignac , Julien Vittu
IPC分类号： G02B6/42 , H01L31/0203 , H01L31/0232 , H01L27/14
CPC分类号： H01L27/14618 , G02B6/4277 , H01L31/0203 , H01L31/02325 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/49171 , H01L2924/16195 , H01L2924/3025 , H01L2924/00 , H01L2924/00014
摘要： An optical semiconductor package includes an optical semiconductor component (8), a front face of which has an optical sensor (10), and encapsulation defining a cavity in which the optical component is placed and having external electrical connection (11) of this optical semiconductor component (8). The encapsulation (2, 5) includes a glass pane letting light through to the optical sensor. The encapsulation (2, 5) includes electromagnetic screening (23, 24, 28) made of an electrically conductive material, that is externally connectable, this screening being electrically isolated in the optical semiconductor package from the electrical connection of the optical semiconductor component (8).
摘要翻译：光学半导体封装包括光学半导体部件（8），其前表面具有光学传感器（10），并且封装限定了光学部件放置在其中并具有该光学半导体的外部电连接（11）的空腔组件（8）。封装（2,5）包括一个使光通过光学传感器的玻璃板。封装（2,5）包括由外部可连接的导电材料制成的电磁屏蔽（23,24,28），该屏蔽在光学半导体封装中与光学半导体部件（8）的电连接电隔离）。

4. 发明申请

US20060012002A1 Device for mounting a semiconductor package on a support plate via a base 审中-公开
公开(公告)号：US20060012002A1
公开(公告)日：2006-01-19
申请号：US11223233
申请日：2005-09-09
申请人： Remi Brechignac , Kevin Channon , Juan Exposito
发明人： Remi Brechignac , Kevin Channon , Juan Exposito
IPC分类号： H01L23/12 , H01L31/0232
CPC分类号： H05K3/325 , H01L31/0203 , H01L2224/48227 , H01L2224/48091 , H01L2924/00014
摘要： A semiconductor package is mounted to a support plate through a base. The base is inserted between a rear face of the semiconductor package and a front face of the support plate. An electrical connection mechanism is provided to connect the semiconductor package to the support plate pass. This mechanism passes through the base. The mounting of the semiconductor package is accomplished by a variety of structures to fasten the package onto the said support plate. These structures cooperate with and are placed below the rear face of the semiconductor package.

5. 发明授权

US06713876B1 Optical semiconductor housing and method for making same 有权
标题翻译：光学半导体外壳及其制造方法
公开(公告)号：US06713876B1
公开(公告)日：2004-03-30
申请号：US10129372
申请日：2002-10-01
申请人： Julien Vittu , Remi Brechignac
发明人： Julien Vittu , Remi Brechignac
IPC分类号： H01L310232
CPC分类号： H01L31/0203 , H01L25/167 , H01L2224/16 , H01L2224/48091 , H01L2924/00014
摘要： Optical semiconductor package and process for fabricating an optical semiconductor package, in which an electrical connection support plate (2) has a through-passage (5); a first semiconductor component (4) such as a microprocessor placed behind the support plate and lying opposite the through-passage; electrical connection metal balls (9) inserted into the annular space separating the first component from the support plate; encapsulation mechanism including an encapsulation material (12) lying in the annular space; a second semiconductor component (13), a front face (15) of which has an optical sensor and a rear face of which is fixed to the front face (20) of the first component (4) through the through-passage (5) of the support plate (2); metal electrical connection wires (17) connecting the front face of the second component and the front face of the support plate; a front encapsulation lid (21) which covers the through-passage and the metal wires at some distance and which has at least one transparent part (23) lying in front of the optical sensor, and external electrical connection (25) located on an exposed part of the support plate.
摘要翻译：光学半导体封装以及用于制造光学半导体封装的工艺，其中电连接支撑板（2）具有通路（5）; 第一半导体部件（4），例如放置在支撑板后面并与通路对置的微处理器; 插入到将第一部件与支撑板分离的环形空间中的电连接金属球（9）封装机构包括位于环形空间中的封装材料（12）; 第二半导体部件（13），其前表面（15）具有光学传感器，并且其后表面经由通路（5）固定到第一部件（4）的前表面（20）的支撑板（2）; 连接第二部件的前表面和支撑板的前表面的金属电连接线（17）在所述光学传感器的前面具有至少一个透明部分（23）的外部电连接（25），所述前部封装盖（21）在一定距离处覆盖所述通路和所述金属线，部分支撑板。

6. 发明授权

US06893169B1 Optical semiconductor package and process for fabricating the same 有权
标题翻译：光半导体封装及其制造方法
公开(公告)号：US06893169B1
公开(公告)日：2005-05-17
申请号：US10129371
申请日：2000-10-30
申请人： Juan Exposito , Remi Brechignac
发明人： Juan Exposito , Remi Brechignac
IPC分类号： H01L27/14 , H01L25/16 , H01L31/02 , H01L31/0203 , G02B6/36
CPC分类号： H01L31/0203 , H01L25/167 , H01L2224/05553 , H01L2224/48247 , H01L2924/16195 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要： A process is provided for fabricating an optical semiconductor package. According to the process, a first semiconductor component is fixed to a rear face of an electrical connection support plate, and this first component is electrically connected to the support plate. An encapsulation block for the first component is molded on the rear face of the support plate. A second semiconductor component, a front face of which has an optical sensor, is fixed to one face of the first component, and this second component is electrically connected to the support plate. The second component is encapsulated on the front face of the support plate. Also provided is an optical semiconductor package.
摘要翻译：提供了一种用于制造光学半导体封装的工艺。根据该过程，第一半导体部件被固定到电连接支撑板的后表面，并且该第一部件电连接到支撑板。用于第一部件的封装块模制在支撑板的后表面上。其前表面具有光学传感器的第二半导体部件被固定到第一部件的一个面上，并且该第二部件电连接到支撑板。第二部件封装在支撑板的前表面上。还提供了一种光学半导体封装。

7. 发明申请

US20050046973A1 Method for fixing a lens of an optic group with respect to an optical sensor inside an electronic device able to acquire images and corresponding device 有权
标题翻译：将能够拍摄图像的电子设备内的光学传感器的光学组的透镜固定的方法及对应的装置
公开(公告)号：US20050046973A1
公开(公告)日：2005-03-03
申请号：US10895012
申请日：2004-07-19
申请人： Pierangelo Magni , Remi Brechignac , Chek Kho , Kum Weng Loo
发明人： Pierangelo Magni , Remi Brechignac , Chek Kho , Kum Weng Loo
IPC分类号： G02B7/02 , G02B27/62 , H04N5/225
CPC分类号： G02B13/001 , G02B7/02 , G02B27/62 , H01L2224/48227 , H04N5/2254
摘要： A method is described for fixing a lens of an optical group with respect to an optical sensor in an image acquisition device comprising the steps of housing the optical sensor in a housing, fixing a lower holder of the optical group to the housing, aligning an upper holder of the optical group, wherein the lens is placed, with the sensor so as to align a focusing point of the lens with respect to the sensor, welding the upper holder to the lower holder. The welding step may be performed by means of ultrasounds.
摘要翻译：描述了一种用于在图像采集装置中固定相对于光学传感器的光学组的透镜的方法，包括以下步骤：将光学传感器容纳在壳体中，将光学组的下部固定器固定到壳体上，将光学组的保持器放置在传感器上，以便使透镜的聚焦点相对于传感器对准，将上支架焊接到下支架。焊接步骤可以通过超声波进行。

8. 发明授权

US06597020B1 Process for packaging a chip with sensors and semiconductor package containing such a chip 失效
标题翻译：用于封装具有传感器的芯片和包含这种芯片的半导体封装的工艺
公开(公告)号：US06597020B1
公开(公告)日：2003-07-22
申请号：US09648843
申请日：2000-08-25
申请人： Remi Brechignac , Juan Exposito
发明人： Remi Brechignac , Juan Exposito
IPC分类号： H01L3300
CPC分类号： H01L31/0203 , H01L21/565 , H01L23/3121 , H01L24/48 , H01L24/49 , H01L31/02325 , H01L2224/05553 , H01L2224/05599 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49171 , H01L2224/85399 , H01L2924/00014 , H01L2924/10162 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2224/45099
摘要： A method is provided for packaging an integrated circuit chip that has a front face with sensors located in a central region and electrical connection areas located in a region that lies between at least one edge of the chip and the central region. According to the method, a rear face of the chip is cemented to a front face of a substrate that includes through-holes, with the rear face of the substrate including electrical connection areas that pass in front of the through-holes such that the through-holes are located laterally with respect to the edge of the chip. The electrical connection areas on the front face of the chip are connected to the electrical connection areas on the substrate through the through-holes, and the chip is embedded in an optically transparent encapsulating material so as to form an encapsulating block on the same side as the front face of the substrate. The substrate is cut around the encapsulating block, following the perimeter of the encapsulating block. Also provided is a semiconductor package that includes an integrated circuit chip, a substrate, electrical connectors, and an encapsulating material.
摘要翻译：提供一种用于封装集成电路芯片的方法，所述集成电路芯片具有位于中心区域中的传感器的正面和位于芯片的至少一个边缘与中心区域之间的区域中的电连接区域。根据该方法，将芯片的背面胶合到包括通孔的基板的正面，基板的背面包括穿过通孔前方的电连接区域，使得通孔相对于芯片的边缘横向设置孔。芯片正面的电气连接区域通过通孔与基板上的电气连接区域连接，芯片嵌入光学透明的封装材料中，与同一侧的封装块形成封装块基板的正面。沿着封装块的周边围绕封装块切割衬底。还提供了包括集成电路芯片，基板，电连接器和封装材料的半导体封装。

9. 发明申请

US20110248397A1 SEMICONDUCTOR DEVICE HAVING STACKED COMPONENTS 有权
标题翻译：具有堆叠组件的半导体器件
公开(公告)号：US20110248397A1
公开(公告)日：2011-10-13
申请号：US13130169
申请日：2009-11-10
申请人： Romain Coffy , Remi Brechignac , Carlo Cognetti De Martiis
发明人： Romain Coffy , Remi Brechignac , Carlo Cognetti De Martiis
IPC分类号： H01L25/065 , H01L21/98 , H01L23/538
CPC分类号： H01L25/50 , H01L21/565 , H01L23/5384 , H01L23/5389 , H01L24/16 , H01L24/19 , H01L24/82 , H01L24/96 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L2224/04105 , H01L2224/12105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/97 , H01L2225/06517 , H01L2225/06524 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/01058 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/19105 , H01L2224/81 , H01L2224/0401
摘要： A semiconductor device includes at least one first component (5) (for example, a first integrated circuit), having a front face provided with electrical connection pads. The first component is embedded in a support layer (2) is a position such that the front face of the first component is not covered and lies parallel to a first face of the support layer. An intermediate layer (8) is formed on the front face of the first component and on the first face of the support layer. An electrical connection network (9) within the intermediate layer selectively connects to the electrical connection pads of the first component. The device further includes at least one second component (11) (for example, a second integrate circuit, having one face placed above the intermediate layer and provided with electrical connection pads selectively connected to the electrical connection network. Electrical connection vias (17) pass through the support layer and selectively connect the electrical connection network to an external electrical connection formed on a second face of the support layer.
摘要翻译：半导体器件包括至少一个第一部件（5）（例如，第一集成电路），其具有设置有电连接焊盘的正面。第一部件嵌入在支撑层（2）中，是使得第一部件的前表面不被覆盖并平行于支撑层的第一面的位置。在第一部件的正面和支撑层的第一面上形成中间层（8）。中间层内的电连接网络（9）选择性地连接到第一部件的电连接焊盘。该装置还包括至少一个第二部件（11）（例如，第二集成电路，其中一个面放置在中间层的上方，并且具有选择性地连接到电连接网络的电连接焊盘）。电连接通孔（17）通过通过支撑层并且将电连接网络选择性地连接到形成在支撑层的第二面上的外部电连接。

10. 发明授权

US07327005B2 Optical semiconductor package with incorporated lens and shielding 有权
标题翻译：带半导体封装的光学半导体封装和屏蔽
公开(公告)号：US07327005B2
公开(公告)日：2008-02-05
申请号：US10478178
申请日：2002-05-17
申请人： Remi Brechignac , Juan Exposito
发明人： Remi Brechignac , Juan Exposito
IPC分类号： H01L31/0203
CPC分类号： H01L23/552 , G01D5/264 , G01D11/245 , H01L24/48 , H01L24/49 , H01L27/14618 , H01L27/14625 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/12043 , H01L2924/15153 , H01L2924/15162 , H01L2924/15165 , H01L2924/1517 , H01L2924/15174 , H01L2924/16151 , H01L2924/16195 , H01L2924/3025 , H04N5/2257 , H01L2924/00 , H01L2224/45099
摘要： An optical semiconductor module including an optical semiconductor component that has a front face including an optical sensor. Encapsulation, defining a cavity in which the optical component is disposed, includes external electrical connections for the optical semiconductor component, and includes a window allowing light to pass through it toward the optical sensor. An optical lens (17) is disposed in the cavity (6) between the optical sensor (10) and the window (5). A support structure (18) supports the optical lens. This optical semiconductor module may also include a shield (24).
摘要翻译：一种光学半导体模块，包括具有包括光学传感器的正面的光学半导体部件。限定其中设置有光学部件的空腔的封装包括用于光学半导体部件的外部电连接，并且包括允许光通过光学传感器的窗口。光学透镜（17）设置在光学传感器（10）和窗口（5）之间的空腔（6）中。支撑结构（18）支撑光学透镜。该光学半导体模块还可以包括屏蔽（24）。

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