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    • 1. 发明授权
    • Single unitary plastic package for a magnetic field sensing device
    • 用于磁场感测装置的单一整体塑料封装
    • US06265865B1
    • 2001-07-24
    • US09311868
    • 1999-05-14
    • Raymond W EngelRavi VigJay Gagnon J Gagnon
    • Raymond W EngelRavi VigJay Gagnon J Gagnon
    • G01R3306
    • G01R33/07G01V3/08Y10T29/49007
    • A magnetic field sensor assembly has a magnet, a semiconductor sensor and a metal leadframe encapsulated in a plastic package to form a semiconductor integrated circuit. A metal leadframe has a die attach pad on which the sensor is secured and an assembly having one or more projections for securing the magnet in close proximity to the sensor. The leadframe is made from a metal having sufficient spring tension so that the assembly having the projections will secure the magnet. The sensor is adjacent to a ferromagnetic object and will detect a change in magnetic field caused by the ferromagnetic object. Only a thin layer of the plastic package covers the sensor thus reducing the distance between the sensor and the ferromagnetic object but still maintaining an air gap between the plastic package and the ferromagnetic object sufficient to allow passage of the ferromagnetic object.
    • 磁场传感器组件具有磁体,半导体传感器和封装在塑料封装中以形成半导体集成电路的金属引线框架。 金属引线框架具有芯片附接垫,传感器固定在该芯片附接垫上,以及具有一个或多个突起的组件,用于将磁体固定在传感器附近。 引线框架由具有足够的弹簧张力的金属制成,使得具有突起的组件将固定磁体。 传感器与铁磁物体相邻,并且将检测由铁磁物体引起的磁场变化。 只有塑料封装的薄层覆盖传感器,从而减小传感器和铁磁物体之间的距离,但仍然保持塑料封装和铁磁物体之间的空气间隙足以允许铁磁物体通过。
    • 2. 发明授权
    • Package for a magnetic field sensing device
    • 用于磁场感测装置的封装
    • US5963028A
    • 1999-10-05
    • US916746
    • 1997-08-19
    • Raymond W EngelRavi VigJay Gagnon J Gagnon
    • Raymond W EngelRavi VigJay Gagnon J Gagnon
    • G01D5/245G01R33/07G01V3/08G01R33/06G01P3/488H01L43/00
    • G01R33/07G01V3/08Y10T29/49007
    • A magnetic field sensor assembly has a magnet, a semiconductor sensor and a metal leadframe encapsulated in a plastic package to form a semiconductor integrated circuit. A metal leadframe has a die attach pad on which the sensor is secured and an assembly having one or more projections for securing the magnet in close proximity to the sensor. The leadframe is made from a metal having sufficient spring tension so that the assembly having the projections will secure the magnet. The sensor is adjacent to a ferromagnetic object and will detect a change in magnetic field caused by the ferromagnetic object. Only a thin layer of the plastic package covers the sensor thus reducing the distance between the sensor and the ferromagnetic object but still maintaining an air gap between the plastic package and the ferromagnetic object sufficient to allow passage of the ferromagnetic object.
    • 磁场传感器组件具有磁体,半导体传感器和封装在塑料封装中以形成半导体集成电路的金属引线框架。 金属引线框架具有芯片附接垫,传感器固定在该芯片附接垫上,以及具有一个或多个突起的组件,用于将磁体固定在传感器附近。 引线框架由具有足够的弹簧张力的金属制成,使得具有突起的组件将固定磁体。 传感器与铁磁物体相邻,并且将检测由铁磁物体引起的磁场变化。 只有塑料封装的薄层覆盖传感器,从而减小传感器和铁磁物体之间的距离,但仍然保持塑料封装和铁磁物体之间的空气间隙足以允许铁磁物体通过。
    • 3. 发明授权
    • Hall-effect ferrous-article-proximity sensor assembly
    • 霍尔效应亚铁制品 - 接近传感器组件
    • US5581179A
    • 1996-12-03
    • US454916
    • 1995-05-31
    • Raymond W. EngelPeter J. GilbertRavi VigTeri TuTerry Clapp
    • Raymond W. EngelPeter J. GilbertRavi VigTeri TuTerry Clapp
    • G01P3/488G01B7/00G01D5/14G01D5/245G01D11/24G01P3/487G01P1/02G01B7/14G01P3/42H05K5/00
    • G01P3/487G01D11/245G01D5/147
    • This invention is a magnetic-field sensor assembly comprising a preformed housing shell having a first end which includes an opening, and a second end which includes a window and having a cylindrical shape with a flattened portion to produce a truncated circular cross-section, a sensor package including an integrated-circuit magnetic-field-sensor chip encapsulated in a protective body with first and second opposite and mutually parallel faces and a plurality of integral conductive leads, each lead having a proximal portion, a distal portion, and a central portion, the proximal portion of each of said plurality of leads extending from said body, the central portion of said plurality of leads extending away from the body and positioned substantially normal the faces of the body, said sensor-package body being positioned in said housing shell part way through said window with said one body face extending outwardly from said housing shell and with said lead distal portions extending from said housing shell through said opening, a magnet having a first end and a second end and positioned in said housing shell with said first end adjacent to said second sensor-package body face, and an endcap adapted to close said opening in said housing shell.
    • 本发明是一种磁场传感器组件,其包括具有包括开口的第一端的预成型壳体壳体,以及包括窗口并且具有扁平部分的圆柱形形状以产生截面圆形横截面的第二端, 传感器封装,其包括封装在具有第一和第二相对且相互平行的面的保护体中的集成电路磁场传感器芯片,以及多个整体式导电引线,每个引线具有近端部分,远端部分和中心部分 所述多个引线中的每一个的近端部分从所述主体延伸,所述多个引线的中心部分远离主体延伸并且基本上垂直于主体的表面定位,所述传感器封装主体位于所述壳体壳体中 部分通过所述窗口,所述一个主体面从所述壳体外壳向外延伸,并且所述引线远端部分从s延伸 通过所述开口帮助壳体壳体,具有第一端和第二端并且定位在所述壳体壳体中的所述第一端部与所述第二传感器封装主体面相邻的磁体,以及用于封闭所述壳体壳体中的所述开口的端盖。
    • 5. 发明申请
    • INTEGRATED SENSOR
    • 集成传感器
    • US20070247146A1
    • 2007-10-25
    • US11767631
    • 2007-06-25
    • Jason StauthRichard DickinsonGlenn ForrestRavi Vig
    • Jason StauthRichard DickinsonGlenn ForrestRavi Vig
    • G01R33/00
    • G01R15/205G01R15/207G01R33/09H01L2224/48091H01L2224/48137H01L2224/48247H01L2224/4903H01L2924/00014
    • An electronic circuit includes a first substrate having a first substrate surface and a device supported by the first substrate surface. The device is selected from among a passive electronic component and an active electronic component. The electronic circuit also includes a second substrate having a second substrate surface and a conductor proximate to the second substrate. The electronic circuit also includes a magnetic field transducer disposed over the conductor and coupled to the device and an insulating layer disposed between the conductor and the second substrate. The conductor is adapted to carry an electrical current to generate a first magnetic field. The electronic circuit is responsive to the first magnetic field. In some embodiments, the conductor is a secondary conductor and the circuit further includes a primary conductor disposed proximate to the magnetic field transducer and an insulating layer disposed between the primary conductor and the second substrate.
    • 电子电路包括具有第一衬底表面的第一衬底和由第一衬底表面支撑的器件。 从无源电子部件和有源电子部件中选择该装置。 电子电路还包括具有第二衬底表面和靠近第二衬底的导体的第二衬底。 电子电路还包括设置在导体上并耦合到器件的磁场换能器,以及设置在导体和第二衬底之间的绝缘层。 导体适于承载电流以产生第一磁场。 电子电路响应于第一磁场。 在一些实施例中,导体是次级导体,并且电路还包括邻近磁场换能器设置的主导体和设置在主导体和第二衬底之间的绝缘层。
    • 6. 发明授权
    • Integrated sensor
    • 集成传感器
    • US07259545B2
    • 2007-08-21
    • US10364442
    • 2003-02-11
    • Jason StauthRichard DickinsonGlenn ForrestRavi Vig
    • Jason StauthRichard DickinsonGlenn ForrestRavi Vig
    • G01R15/20
    • G01R15/205G01R15/207G01R33/09H01L2224/48091H01L2224/48137H01L2224/48247H01L2224/4903H01L2924/00014
    • An integrated sensor includes a magnetoresistance element electrically coupled to a device disposed on or integrated in a silicon substrate. A conductor is provided proximate to the magnetoresistance element. The integrated sensor can be used to provide various devices, such as a current sensor, a magnetic field sensor, or an isolator. Further, the integrated sensor can be used in an open loop configuration or in a closed loop configuration in which an additional conductor is provided. The magntoresistance element may be formed over the silicon substrate or on a separate, non-silicon substrate. Also described is an integrated sensor comprising a substrate, a magnetic field transducer disposed over a surface of the substrate, and a conductor disposed over the surface of the substrate proximate to the magnetic field transducer. The magnetic field transducer can be a Hall effect transducer or a magnetoresistance element.
    • 集成传感器包括电耦合到设置在硅衬底上或集成在硅衬底中的器件的磁阻元件。 导体靠近磁阻元件设置。 集成传感器可用于提供各种设备,例如电流传感器,磁场传感器或隔离器。 此外,集成传感器可以以开环配置或闭环配置使用,其中提供附加导体。 可以在硅衬底上或在单独的非硅衬底上形成磁阻电阻元件。 还描述了一种集成传感器,其包括衬底,设置在衬底的表面上的磁场换能器,以及设置在靠近磁场换能器的衬底表面上的导体。 磁场传感器可以是霍尔效应传感器或磁阻元件。