专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070246450A1 High temperature anodic bonding apparatus 审中-公开
标题翻译：高温阳极接合装置
公开(公告)号：US20070246450A1
公开(公告)日：2007-10-25
申请号：US11417445
申请日：2006-05-03
申请人： Raymond Cady , Alexander Lakota , William Lock , John Thomas , John Costello
发明人： Raymond Cady , Alexander Lakota , William Lock , John Thomas , John Costello
IPC分类号： D06F75/26
CPC分类号： H01L21/67092 , H01L21/67121 , H01L21/67144 , H01L21/76254
摘要： An anodic bonding apparatus includes: a first bonding plate mechanism operable to engage a first material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a second bonding plate mechanism operable to engage a second material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a pressure mechanism operatively coupled to the first and second bonding plate mechanisms and operable to urge the first and second bonding plate mechanisms toward one another to achieve controlled pressure of the first and second material sheets against one another along respective surfaces thereof; a control unit operable to produce control signals to the first and second bonding plate mechanisms and the pressure mechanism to provide heating, voltage, and pressure profiles sufficient to achieve anodic bonding between the first and second material sheets.
摘要翻译：阳极接合装置包括：第一接合板机构，其可操作以接合第一材料片，并且提供受控加热，电压和冷却中的至少一个; 第二接合板机构，其可操作以接合第二材料片，并且提供受控制的加热，电压和冷却中的至少一个; 压力机构，其可操作地联接到所述第一和第二接合板机构并且可操作以将所述第一和第二接合板机构朝向彼此推动，以实现所述第一和第二材料片在其相应表面上彼此相对的受控压力; 控制单元，可操作以产生对第一和第二接合板机构和压力机构的控制信号，以提供足以实现第一和第二材料片之间的阳极接合的加热，电压和压力分布。

IPRDB

热门服务

关于我们

友情链接

联系方式