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    • 2. 发明申请
    • System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
    • 用于改进布置在印刷电路板内的电 - 光发射器的系统,方法和装置
    • US20070063342A1
    • 2007-03-22
    • US11524581
    • 2006-09-21
    • Ray ChenChulchae Choi
    • Ray ChenChulchae Choi
    • H01L23/34
    • H05K1/0274G02B6/4214G02B6/43H05K1/0203
    • The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.
    • 本发明提供了一种用于改进布置在印刷电路板(104)内的电 - 光发射机(100)的系统,方法和装置。 散热器(110,200)是设置在印刷电路板(104)的空腔(102)内并且热耦合到电 - 光发射器(100)的底表面(112)的导热材料, 。 导热材料的一部分大致延伸到印刷电路板(104)的层(114,116或118)的外表面(120,122或124)。 印刷电路板可以包括平面化信号通信系统或光电子信号通信系统。 此外,本发明提供一种制造散热器的方法,其中设置在印刷电路板的空腔内的电 - 光发射器被制造。 还提供了用于柔性波导和微镜耦合器的新方法。
    • 3. 发明申请
    • System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
    • 用于改进布置在印刷电路板内的电 - 光发射器的系统,方法和装置
    • US20050046011A1
    • 2005-03-03
    • US10888350
    • 2004-07-07
    • Ray ChenChulchae Choi
    • Ray ChenChulchae Choi
    • G02B6/42G02B6/43H01L23/15H05K1/02
    • H05K1/0274G02B6/4214G02B6/43H05K1/0203
    • The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.
    • 本发明提供了一种用于改进布置在印刷电路板(104)内的电 - 光发射机(100)的系统,方法和装置。 散热器(110,200)是设置在印刷电路板(104)的空腔(102)内并且热耦合到电 - 光发射器(100)的底表面(112)的导热材料, 。 导热材料的一部分大致延伸到印刷电路板(104)的层(114,116或118)的外表面(120,122或124)。 印刷电路板可以包括平面化信号通信系统或光电子信号通信系统。 此外,本发明提供一种制造散热器的方法,其中设置在印刷电路板的空腔内的电 - 光发射器被制造。 还提供了用于柔性波导和微镜耦合器的新方法。
    • 4. 发明授权
    • System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
    • 用于改进布置在印刷电路板内的电 - 光发射器的系统,方法和装置
    • US07529448B2
    • 2009-05-05
    • US11524581
    • 2006-09-21
    • Ray T. ChenChulchae Choi
    • Ray T. ChenChulchae Choi
    • G02B6/26G02B6/42
    • H05K1/0274G02B6/4214G02B6/43H05K1/0203
    • The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.
    • 本发明提供了一种用于改进布置在印刷电路板(104)内的电 - 光发射机(100)的系统,方法和装置。 散热器(110,200)是设置在印刷电路板(104)的空腔(102)内并且热耦合到电 - 光发射器(100)的底表面(112)的导热材料, 。 导热材料的一部分大致延伸到印刷电路板(104)的层(114,116或118)的外表面(120,122或124)。 印刷电路板可以包括平面化信号通信系统或光电子信号通信系统。 此外,本发明提供一种制造散热器的方法,其中设置在印刷电路板的空腔内的电 - 光发射器被制造。 还提供了用于柔性波导和微镜耦合器的新方法。
    • 5. 发明授权
    • System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
    • 用于改进布置在印刷电路板内的电 - 光发射器的系统,方法和装置
    • US07444041B1
    • 2008-10-28
    • US11524557
    • 2006-09-21
    • Ray T. ChenChulchae Choi
    • Ray T. ChenChulchae Choi
    • G02B6/30G02B6/42
    • H05K1/0274G02B6/4214G02B6/43H05K1/0203
    • The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.
    • 本发明提供了一种用于改进布置在印刷电路板(104)内的电 - 光发射机(100)的系统,方法和装置。 散热器(110,200)是设置在印刷电路板(104)的空腔(102)内并且热耦合到电 - 光发射器(100)的底表面(112)的导热材料, 。 导热材料的一部分大致延伸到印刷电路板(104)的层(114,116或118)的外表面(120,122或124)。 印刷电路板可以包括平面化信号通信系统或光电子信号通信系统。 此外,本发明提供一种制造散热器的方法,其中设置在印刷电路板的空腔内的电 - 光发射器被制造。 还提供了用于柔性波导和微镜耦合器的新方法。
    • 8. 发明申请
    • SYSTEM, METHOD AND APPARATUS FOR IMPROVED ELECTRICAL-TO-OPTICAL TRANSMITTERS DISPOSED WITHIN PRINTED CIRCUIT BOARDS
    • 在印刷电路板中处理改进的电光放大器的系统,方法和装置
    • US20080273830A1
    • 2008-11-06
    • US11524557
    • 2006-09-21
    • Ray T. ChenChulchae Choi
    • Ray T. ChenChulchae Choi
    • G02B6/30
    • H05K1/0274G02B6/4214G02B6/43H05K1/0203
    • The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.
    • 本发明提供了一种用于改进布置在印刷电路板(104)内的电 - 光发射机(100)的系统,方法和装置。 散热器(110,200)是设置在印刷电路板(104)的空腔(102)内并且热耦合到电 - 光发射器(100)的底表面(112)的导热材料, 。 导热材料的一部分大致延伸到印刷电路板(104)的层(114,116或118)的外表面(120,122或124)。 印刷电路板可以包括平面化信号通信系统或光电子信号通信系统。 此外,本发明提供一种制造散热器的方法,其中设置在印刷电路板的空腔内的电 - 光发射器被制造。 还提供了用于柔性波导和微镜耦合器的新方法。