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1. 发明授权

US07235112B2 Micro-battery fabrication process including formation of an electrode on a metal strip, cold compression and removal of the metal strip 有权
标题翻译：微电池制造工艺包括在金属带上形成电极，冷压和去除金属带
公开(公告)号：US07235112B2
公开(公告)日：2007-06-26
申请号：US10250903
申请日：2002-10-21
申请人： Raphaël Salot , Sébastien Martinet , Jean Brun , Gilles Poupon
发明人： Raphaël Salot , Sébastien Martinet , Jean Brun , Gilles Poupon
IPC分类号： H01M4/82 , B05D1/28 , B23K31/02
CPC分类号： H01M10/0436 , H01L2224/16225 , H01L2224/48091 , H01M2/1066 , H01M2/20 , H01M4/04 , H01M4/64 , H01M6/181 , H01M6/188 , H01M6/40 , H01M10/0472 , Y10S228/901 , Y10T29/49108 , Y10T29/49112 , Y10T29/49115 , H01L2924/00014
摘要： The electrodes are formed by surface coating and cold compression on metal strips. They are then assembled, by hot pressing, with an electrolytic membrane. The metal strips are then removed, preferably by mechanical detachment. Current collectors are then formed on each of the electrodes by PVD type techniques that are conventional in microelectronics. The resulting thin micro-battery with high surface capacity can then be integrated in an integrated circuit, in particular by bonding by means of indium connecting balls.
摘要翻译：电极通过金属条上的表面涂覆和冷压缩形成。然后通过热压将其与电解质膜组装。然后移除金属条，优选通过机械拆卸。然后通过微电子学中常规的PVD型技术在每个电极上形成集电器。因此，所得到的具有高表面积的薄电池可以集成在集成电路中，特别是通过铟连接球的结合。

2. 发明申请

US20050001214A1 Micro- or nano-electronic component comprising a power source and means for protecting the power source 审中-公开
标题翻译：微电子或纳米电子部件包括电源和用于保护电源的装置
公开(公告)号：US20050001214A1
公开(公告)日：2005-01-06
申请号：US10492048
申请日：2002-10-21
申请人： Jean Brun , Raphael Salot , Gilles Poupon , Helene Rouault
发明人： Jean Brun , Raphael Salot , Gilles Poupon , Helene Rouault
IPC分类号： H01G9/00 , G06K19/073 , H01L21/48 , H01L23/20 , H01L23/26 , H01L23/58 , H01L29/04
CPC分类号： H01L23/573 , G06K19/073 , G06K19/07372 , H01L21/4803 , H01L23/20 , H01L23/58 , H01L2924/0002 , H01L2924/15153 , H01L2924/15165 , H01L2924/16152 , H01L2924/16195 , H01L2924/00
摘要： The component comprises a sealed cavity wherein the unprotected power source formed by a micro-battery or a micro-supercapacitance is deposited. Any penetration of the ambient atmosphere into the sealed cavity causes destruction of the power source by oxidation, thereby making the component inoperative. The cavity can be in a vacuum or filled with an inert gas. A pressure sensor can be fitted inside the cavity and detect a pressure variation inside the cavity to make the component inoperative when the pressure variation exceeds a predetermined threshold. The cavity can be closed by a cover or filled with a filling material consisting of silicone resin, thermosetting resin, polymer, epoxy, fusible glass or a metal chosen from indium, tin, lead or alloys thereof.
摘要翻译：该组件包括密封腔，其中沉积由微电池或微超电容形成的未受保护的电源。环境气氛渗透到密封腔中会导致氧化破坏电源，从而使部件不起作用。空腔可以在真空中或填充惰性气体。压力传感器可以安装在腔体内部，并且在压力变化超过预定阈值时检测空腔内部的压力变化，以使部件不起作用。空腔可以由盖子封闭或填充有由硅树脂，热固性树脂，聚合物，环氧树脂，可熔玻璃或选自铟，锡，铅或其合金的金属组成的填充材料。

3. 发明授权

US08782880B2 Apparatus for assembling chip devices on wires 有权
标题翻译：用于在芯片上组装芯片的装置
公开(公告)号：US08782880B2
公开(公告)日：2014-07-22
申请号：US13115419
申请日：2011-05-25
申请人： Dominique Vicard , Jean Brun
发明人： Dominique Vicard , Jean Brun
IPC分类号： B23P19/00 , H01R43/00 , B65B15/00 , H01L25/065
CPC分类号： B65B15/00 , H01L25/0655 , H01L2924/0002 , Y10T29/5187 , Y10T29/5193 , Y10T29/53178 , Y10T29/53213 , Y10T29/53261 , H01L2924/00
摘要： An apparatus for assembling chip devices on a wire, each chip device comprising two substantially parallel lateral walls, and a groove in one of the lateral walls for receiving said wire. The apparatus includes a pinching device having two opposing surfaces, the distance between the opposing surfaces being substantially constant and substantially equal to the distance between the two lateral walls of a chip device. A wire feeder is adapted to continuously feed the wire in contact with one of the opposing surfaces of the pinching device. A chip device feeder is adapted to drive chip devices, one at a time, between the opposing surfaces, with their grooves turned towards the wire. The pinching device may comprise two cylindrical rollers having rotation axes substantially perpendicular to the wire, the opposing surfaces being formed by respective surfaces of the rollers.
摘要翻译：一种用于在线上组装芯片器件的装置，每个芯片器件包括两个基本上平行的侧壁，以及用于接收所述线的一个侧壁中的凹槽。该装置包括具有两个相对表面的夹持装置，相对表面之间的距离基本上恒定并且基本上等于芯片装置的两个侧壁之间的距离。供线器适于连续地将电线与夹持装置的相对表面中的一个接触。芯片装置馈送器适于在相对的表面之间一次一个地驱动芯片装置，并且它们的槽朝向导线。夹持装置可以包括具有基本上垂直于线的旋转轴的两个圆柱形辊，相对的表面由辊的相应表面形成。

4. 发明授权

US08611101B2 Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly 有权
标题翻译：具有带有线材形式的线元件的凹槽的微电子芯片的组装，以及组装方法
公开(公告)号：US08611101B2
公开(公告)日：2013-12-17
申请号：US13124762
申请日：2009-10-21
申请人： Jean Brun , Sophie Verrun , Dominique Vicard
发明人： Jean Brun , Sophie Verrun , Dominique Vicard
IPC分类号： H01R9/00 , H01R43/00
CPC分类号： H01L25/0657 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/85 , H01L25/065 , H01L25/50 , H01L2224/32014 , H01L2224/45015 , H01L2224/45028 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48699 , H01L2224/49111 , H01L2224/858 , H01L2225/06527 , H01L2225/06555 , H01L2225/06575 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01079 , Y10T29/49194 , H01L2924/00 , H01L2924/01049 , H01L2924/01006 , H01L2224/85399 , H01L2224/05599
摘要： Assembly of at least one microelectronic chip with a wire element, the chip comprising a groove for embedment of the wire element. The wire element is a strand with a longitudinal axis substantially parallel to the axis of the groove, comprising at least two electrically conducting wires covered with insulator. The chip comprises at least one electrically conducting bump in the groove, this bump being in electric contact with a stripped area of a single one of the electrically conducting wires of the strand.
摘要翻译：组装具有线元件的至少一个微电子芯片，该芯片包括用于嵌入线元件的凹槽。线元件是具有基本上平行于凹槽的轴线的纵向轴线的线，包括至少两个被绝缘体覆盖的导电线。该芯片包括凹槽中的至少一个导电凸块，该凸起与该线束的单根导电线的剥离区域电接触。

5. 发明申请

US20100245182A1 Assembly of Radiofrequency Chips 有权
标题翻译：射频芯片组装
公开(公告)号：US20100245182A1
公开(公告)日：2010-09-30
申请号：US12665419
申请日：2008-06-18
申请人： Dominique Vicard , Jean Brun , Benoit Lepine
发明人： Dominique Vicard , Jean Brun , Benoit Lepine
IPC分类号： H01Q1/24 , H01L21/98
CPC分类号： H01L25/50 , G06K19/07718 , G06K19/07754 , G06K19/07779 , G06K19/07786 , H01L21/6835 , H01L23/5387 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/82 , H01L24/94 , H01L25/0655 , H01L2223/6677 , H01L2224/24137 , H01L2224/45015 , H01L2224/451 , H01L2224/4519 , H01L2224/48139 , H01L2224/8585 , H01L2224/94 , H01L2924/00014 , H01L2924/14 , H01L2924/19042 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01Q1/2283 , Y10T29/49016 , H01L2224/85 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： The invention relates to the fabrication of radiofrequency transmission/reception devices. The invention makes provision for: the making of radiofrequency transmission/reception chips devoid of antennas; the connecting in series of the chips by at least two conducting wire elements whose respective lengths between two neighboring chips are chosen as a function of the transmission/reception frequency, each element contacting electrically at least one terminal of a chip and ensuring an at least temporary function of mechanical holding of the chips chainwise; and the cutting at regular intervals of the serial connection to form, for each chip, two strands of an antenna of the device.
摘要翻译：本发明涉及射频发送/接收设备的制造。本发明提供：制造没有天线的射频发送/接收芯片; 通过至少两个导线元件连接芯片的串联，其中两个相邻芯片之间的相应长度被选择为发射/接收频率的函数，每个元件电接触芯片的至少一个端子并确保至少临时机械夹持芯片的功能; 并且以规则的间隔对串行连接进行切割，以便为每个芯片形成设备的天线的两股。

6. 发明授权

US6029517A Miniaturized accelerometer of the type using spring compensation of the effect of gravity and its production process 失效
标题翻译：使用弹簧补偿的重力及其制作过程的微型加速度计
公开(公告)号：US6029517A
公开(公告)日：2000-02-29
申请号：US88683
申请日：1998-06-02
申请人： Jean Brun , Stephane Caplet
发明人： Jean Brun , Stephane Caplet
IPC分类号： G01P15/125 , G01V1/18 , G01P15/00
CPC分类号： G01V1/181 , G01P15/125 , G01P2015/0814
摘要： The invention relates to a miniaturized accelerometer of the type with spring compensation of the gravity effect. The accelerometer seismic mass (1), its support and the compensating spring (2) are produced in the same substrate (10), regulating means being provided for placing the spring under mechanical tension.
摘要翻译：本发明涉及一种具有重力作用的弹簧补偿型的微型加速度计。加速度计地震质量（1），其支撑和补偿弹簧（2）在相同的基板（10）中产生，调节装置用于将弹簧放置在机械张力下。

7. 发明授权

US5922955A Gravity-compensation type accelerometer and process for producing such an accelerometer 失效
标题翻译：重力补偿型加速度计及其制造方法
公开(公告)号：US5922955A
公开(公告)日：1999-07-13
申请号：US776845
申请日：1997-02-13
申请人： Jean Brun , Stephane Caplet , Patricia Touret , Gerard Ruzie
发明人： Jean Brun , Stephane Caplet , Patricia Touret , Gerard Ruzie
IPC分类号： G01P21/00 , B81B3/00 , B81C1/00 , G01P15/02 , G01P15/08 , G01P15/00
CPC分类号： G01P15/02 , G01P15/0802 , G01P2015/0828
摘要： An accelerometer includes a seismic mass which is subjected to a force when accelerated. The seismic mass is connected to a support by a mechanical connection which can bend under the influence of the force. A detector is provided to determine the acceleration induced in the seismic mass by the force. Compensation can be provided for the force exerted on the mass due to gravity. The mechanical connection includes at least one component which provides compensation and induces in the mechanical connection a prestress counteracting the force exerted on the mass by gravity.
摘要翻译： PCT No.PCT / FR96 / 00904 Sec。 371日期1997年2月13日 102（e）1997年2月13日PCT PCT 1996年6月13日PCT公布。公开号WO97 / 00451 日期1997年1月3日加速度计包括在加速时受到力的地震质量。地震质量通过能够在力的作用下弯曲的机械连接连接到支撑体上。提供一个检测器，用于确定由力引起的地震质量中的加速度。可以为因重力而施加在质量上的力提供补偿。机械连接包括至少一个部件，其提供补偿并且在机械连接中引起抵抗由重力施加在质量块上的力的预应力。

8. 发明授权

US09093289B2 Method for assembling at least one chip using a fabric, and fabric including a chip device 有权
标题翻译：使用织物组装至少一个芯片的方法，以及包括芯片装置的织物
公开(公告)号：US09093289B2
公开(公告)日：2015-07-28
申请号：US13521589
申请日：2011-02-02
申请人： Dominique Vicard , Jean Brun
发明人： Dominique Vicard , Jean Brun
IPC分类号： H05K7/06 , F21V21/00 , H05K13/00 , H01L29/06 , D03D1/00 , D03D9/00 , D03D15/00 , H01L23/00 , H01L25/065 , H01L25/00
CPC分类号： H01L29/0657 , D03D1/0088 , D03D9/00 , D03D15/00 , D10B2401/16 , D10B2401/18 , D10B2501/00 , H01L24/48 , H01L24/49 , H01L24/72 , H01L25/0655 , H01L25/50 , H01L2224/4807 , H01L2224/49 , H01L2224/858 , H01L2924/00014 , H01L2924/01014 , H01L2924/01029 , H01L2924/01058 , H01L2924/01079 , H01L2924/12041 , H01L2924/14 , Y10T29/49002 , H01L2924/00 , H01L2224/45099
摘要： A method for assembling a device on two substantially parallel taut threads. The device includes an electronic chip and two substantially parallel grooves open on opposite sides of the device. The distance separating the grooves corresponds to the distance separating the threads. The device presents a penetrating shape along an axis perpendicular to the plane of the grooves, having a base at the level of the grooves and an apex of smaller size than the distance separating the threads. The method includes the steps consisting in placing the apex of the device between the two threads; in moving the device between the two threads resulting in the threads being separated from one another by the penetrating shape of the device; and in continuing movement of the device until the threads penetrate into the grooves reverting to their initial separation distance.
摘要翻译：一种用于在两个基本上平行的拉紧螺纹上组装装置的方法。该装置包括电子芯片和在装置的相对侧上开放的两个基本上平行的凹槽。分离槽的距离对应于分开螺纹的距离。该装置沿着垂直于凹槽平面的轴线具有穿透形状，在凹槽的水平处具有基部，并且具有比分开螺纹的距离更小的顶点。该方法包括将装置的顶点放置在两个螺纹之间的步骤; 在所述两个螺纹之间移动所述装置，导致所述螺纹通过所述装置的穿透形状彼此分离; 并且在设备的持续运动中，直到螺纹穿透到凹槽中，从而恢复到其初始间隔距离。

9. 发明授权

US08860200B2 Stacked electronic device and method of making such an electronic device 有权
标题翻译：堆叠的电子设备和制造这种电子设备的方法
公开(公告)号：US08860200B2
公开(公告)日：2014-10-14
申请号：US12737060
申请日：2009-06-02
申请人： Jean Brun
发明人： Jean Brun
IPC分类号： H01L23/02 , H01L21/00
CPC分类号： H01L25/0657 , H01L23/3121 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/90 , H01L25/50 , H01L2224/05568 , H01L2224/05573 , H01L2224/1147 , H01L2224/13078 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2224/90 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01057 , H01L2924/01058 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01094 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/1461 , H01L2924/18161 , Y10T29/49117 , H01L2924/00 , H01L2224/05599
摘要： This invention relates to a stacked electronic device composed of stacked electronic components (120, 130) distributed on one or several added-on levels (N2, N3) each added on the preceding level starting from a base level (N1) possibly containing at least one electronic component (110). At least one electrolytic connection pad of a first type (10.1) on an add-on level (N2) directly connects a conducting element (c1) placed on one face of an electronic component (120) on an add-on level (N2) to a conducting element (z1) placed on an opposite face of a neighboring level (N1) while at least one electrolytic connection pad of a second type (20.1) on the add-on level (N2) passes through a coating layer (220) coating the sides of the electronic component (120) on the add-on level (N2) and directly electrically connects two conducting elements (z1, z2) located on each side of said coating layer (220).
摘要翻译：本发明涉及一种层叠的电子设备，其由堆叠的电子元件（120,130）组成，分布在一个或多个附加电平（N 2，N 3）上，每个级别（N2，N3）从基本级别（N1）一个电子部件（110）。在附加级（N2）上的第一类型（10.1）的至少一个电解连接焊盘直接连接放置在附加层（N2）上的电子部件（120）的一个面上的导电元件（c1）（N2）上的第二类型（20.1）的至少一个电解连接垫穿过涂层（220），所述导电元件（z1）放置在相邻电平（N1）的相对表面上，在所述附加层（N2）上涂覆所述电子部件（120）的侧面并且直接电连接位于所述涂层（220）的每一侧上的两个导电元件（z1，z2）。

10. 发明授权

US08723312B2 Assembly of a wire element with a microelectronic chip with a groove comprising at least one bump securing the wire element 有权
标题翻译：具有微电子芯片的线元件的组装，所述微电子芯片具有凹槽，所述凹槽包括固定所述线元件的至少一个凸块
公开(公告)号：US08723312B2
公开(公告)日：2014-05-13
申请号：US12919512
申请日：2008-10-21
申请人： Jean Brun , Dominique Vicard , Sophie Verrun
发明人： Jean Brun , Dominique Vicard , Sophie Verrun
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/02
CPC分类号： H01L25/0655 , H01L21/6835 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L25/50 , H01L2223/6677 , H01L2224/45015 , H01L2224/451 , H01L2224/45139 , H01L2224/45144 , H01L2224/48 , H01L2224/78301 , H01L2224/85001 , H01L2224/85365 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/20751 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , Y10T29/41 , H01L2924/20752 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： The assembly comprises at least one microelectronic chip having two parallel main surfaces and lateral surfaces, at least one of the lateral faces comprising a longitudinal groove housing a wire element having an axis parallel to the longitudinal axis of the groove. The groove is delineated by at least two side walls. The wire element is secured to the chip at the level of a clamping area between at least one bump arranged on one of the side walls, and the side wall of the groove opposite said bump. The clamping area has a smaller height than the diameter of the wire element and a free area is arranged laterally to the bump along the longitudinal axis of the groove. The free area has a height, corresponding to the distance separating the two side walls, that is greater than the diameter of the wire element.
摘要翻译：组件包括至少一个具有两个平行的主表面和侧表面的微电子芯片，至少一个侧面包括容纳具有平行于凹槽的纵向轴线的线的线元件的纵向槽。凹槽由至少两个侧壁描绘。线元件在布置在一个侧壁上的至少一个凸块与与凸起相对的凹槽的侧壁之间的夹紧区域的水平处固定到芯片。夹紧区域具有比线元件的直径更小的高度，并且沿凹槽的纵向轴线横向布置凸块的自由区域。自由区域具有与分离两个侧壁的距离相对应的高度，该高度大于线元件的直径。

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