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    • 2. 发明授权
    • System and method of optically inspecting manufactured devices
    • 光学检查制造装置的系统和方法
    • US06246788B1
    • 2001-06-12
    • US09074301
    • 1998-05-06
    • Ramakrishna PattikondaYouling LinKathleen Hennessey
    • Ramakrishna PattikondaYouling LinKathleen Hennessey
    • G06K900
    • G01N21/9501G06T7/0006G06T2207/10152G06T2207/30141H01L22/12H01L22/20H01L2924/0002H01L2924/014H01L2924/00
    • An apparatus, system, and method of optically inspecting printed circuit boards (PCBs) for defects, that reliably determines the dimensions of components including those having the same color as the background, and which can detect components which are missing, misoriented, misaligned, or not properly seated. The apparatus uses a camera and a coherent primary light source mounted at an angle away from the vertical so as to produce sharply defined PCB component shadows on the top surface of the PCB. An image of the PCB is captured, the shadow edges are symbolically decomposed into primitives from which gradients are produced, and then compared to a previously captured gradient of a defect-free PCB. Differences in the two image gradients, if any, are used to identify missing, misaligned, misoriented, and improperly seated components, and to detect foreign objects and other PCB defects.
    • 用于光学检查印刷电路板(PCB)的缺陷的装置,系统和方法,其可靠地确定包括具有与背景相同颜色的部件的部件的尺寸,并且其可以检测缺失,取向偏移,未对准的部件或 未正确就位 该装置使用安装在离垂直方向成一定角度的照相机和相干一次光源,以便在PCB的顶表面上产生明显限定的PCB部件阴影。 捕获PCB的图像,阴影边缘被符号分解成从其生成梯度的图元,然后与先前捕获的无缺陷PCB梯度进行比较。 两个图像梯度的差异(如果有的话)用于识别缺失的,未对准的,不对齐的,不正确的组件,以及检测异物和其他PCB缺陷。
    • 4. 发明授权
    • System and method for three-dimensional surface inspection
    • 三维表面检测系统及方法
    • US07039228B1
    • 2006-05-02
    • US09444034
    • 1999-11-19
    • Ramakrishna PattikondaYouling Lin
    • Ramakrishna PattikondaYouling Lin
    • G06K9/00
    • G01B11/0608G01N21/956G06K9/2018G06T7/521G06T2207/10024G06T2207/10152G06T2207/30141
    • An optical inspection system and method for inspecting a component on a printed circuit board (PCB) which determines three-dimensional information in a single scan. A first visual light source illuminates the PCB surface and component with a green light while a second visual light source illuminates the PCB and component with a blue light. At least one laser light source simultaneously illuminates the surface of the PCB with a narrow coherent red-light laser beam. The laser light source is mounted off vertical on a movable mount which enables the laser beam to be directed over an area of interest on the surface of the PCB. The system also includes a color scan camera mounted vertically above the PCB. The camera has red, green, and blue channels. The green and blue channels capture an image of the illuminated surface of the PCB which is used by a computer to determine two-dimensional information about the component. The red channel captures a path of the laser beam as it strikes the surface of the PCB and the component. The computer uses the path to determine height information for the component.
    • 用于检查在单次扫描中确定三维信息的印刷电路板(PCB)上的部件的光学检查系统和方法。 第一视觉光源用绿光照亮PCB表面和部件,而第二视觉光源用蓝光照亮PCB和部件。 至少一个激光光源同时用窄的相干红光激光束照射PCB的表面。 激光光源垂直安装在可移动的安装座上,使得激光束能够被引导到PCB表面上的感兴趣区域上。 该系统还包括垂直安装在PCB上的彩色扫描照相机。 相机具有红色,绿色和蓝色通道。 绿色和蓝色通道捕获由计算机用于确定关于组件的二维信息的PCB的照亮表面的图像。 红色通道捕获激光束在撞击PCB和元件表面时的路径。 计算机使用路径来确定组件的高度信息。
    • 5. 发明授权
    • System and method for circuit repair
    • 电路修复的系统和方法
    • US06205239B1
    • 2001-03-20
    • US08866553
    • 1997-05-30
    • YouLing LinA. Kathleen HennesseyRamakrishna PattikondaRajasekar ReddyVeera S. KhajaC. Rinn Cleavelin
    • YouLing LinA. Kathleen HennesseyRamakrishna PattikondaRajasekar ReddyVeera S. KhajaC. Rinn Cleavelin
    • G06K900
    • G06T7/001G01N21/95607G06T7/0002G06T2207/10056G06T2207/30148H01L22/20H01L2924/014
    • A system and method for repairing a defect on a manufactured object, which may be a semiconductor wafer, uses a computer and a repair tool. The method includes placing the manufactured device on a moveable stage; capturing and preparing a digital-pixel-based representation of the image; symbolically decomposing the digital-pixel-based representation of an image to create a primitive-based representation of the image; analyzing the primitive-based representation of the image to detect and locate an anomaly; isolating primitives associated with the anomaly; comparing the isolated primitives associated with the anomaly with primitives in a knowledgebase to locate a set of primitives in the knowledgebase that are most like the isolated primitives associated with the anomaly; assigning a defect-type label associated with the set of primitives in the knowledge base that was most similar to the isolated primitives associated with the anomaly; and using a repair tool to repair the defect based on defect-type label for the anomaly.
    • 用于修复可以是半导体晶片的制造对象上的缺陷的系统和方法使用计算机和修理工具。 该方法包括将制造的装置放置在可移动台上; 捕获和准备图像的基于数字像素的表示; 象征性地分解图像的基于数字像素的表示以创建图像的基于图元的表示; 分析图像的基于图元的表示以检测和定位异常; 隔离与异常相关的原语; 将与异常相关联的孤立原语与知识库中的原语进行比较,以定位知识库中最像是与异常相关联的孤立原语的一组原语; 分配与所述知识库中与所述异常相关联的所述孤立原语最相似的所述原始集合相关联的缺陷类型标签; 并使用维修工具根据异常的缺陷型标签修复缺陷。