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    • 7. 发明授权
    • Method of fabricating a bipolar transistor having reduced collector-base capacitance
    • 制造具有减小的集电极 - 基极电容的双极晶体管的方法
    • US07462547B2
    • 2008-12-09
    • US11633380
    • 2006-12-04
    • Hiroyuki AkatsuRama DivakaruniMarwan KhaterChristopher M. SchnabelWilliam Tonti
    • Hiroyuki AkatsuRama DivakaruniMarwan KhaterChristopher M. SchnabelWilliam Tonti
    • H01L21/331H01L27/082
    • H01L29/66242H01L29/0649H01L29/0692H01L29/0821
    • A method is provided for fabricating a bipolar transistor that includes growing an epitaxial layer onto an underlaying region having a low dopant concentration and a trench isolation region defining the edges of an active region layer, implanting a portion of the epitaxial layer through a mask to define a collector region having a relatively high dopant concentration, the collector region laterally adjoining a second region of the epitaxial layer having the low dopant concentration; forming an intrinsic base layer overlying the collector region and the second region, the intrinsic base layer including an epitaxial region in conductive communication with the collector region; forming a low-capacitance region laterally separated from the collector region by the second region, the low-capacitance region including a dielectric region disposed in an undercut directly underlying the intrinsic base layer; and forming an emitter layer overlying the intrinsic base layer.
    • 提供了一种用于制造双极晶体管的方法,该双极晶体管包括将外延层生长到具有低掺杂剂浓度的衬底区域和限定有源区域层的边缘的沟槽隔离区域,通过掩模注入外延层的一部分以限定 具有相对较高掺杂剂浓度的集电极区域,所述集电极区域横向邻接所述外延层的具有低掺杂浓度的第二区域; 形成覆盖所述集电极区域和所述第二区域的本征基极层,所述本征基极层包括与所述集电极区域导通连通的外延区域; 形成由所述第二区域与所述集电极区域横向分离的低电容区域,所述低电容区域包括设置在所述本征基极层下方的底切处的电介质区域; 并形成覆盖本征基层的发射极层。
    • 10. 发明授权
    • Nitrided STI liner oxide for reduced corner device impact on vertical device performance
    • 氮化氮化物衬垫氧化物,用于减少拐角装置对垂直装置性能的影响
    • US06998666B2
    • 2006-02-14
    • US10707754
    • 2004-01-09
    • Jochen BeintnerRama DivakaruniRajarao Jammy
    • Jochen BeintnerRama DivakaruniRajarao Jammy
    • H01L21/8242
    • H01L27/10864H01L27/10841H01L27/10894
    • A method of fabricating an integrated circuit device comprises etching a trench in a substrate and forming a dynamic random access memory (DRAM) cell having a storage capacitor at a lower end and an overlying vertical metal oxide semiconductor field effect transistor (MOSFET) comprising a gate conductor and a boron-doped channel. The method includes forming trenches adjacent the DRAM cell and a silicon-oxy-nitride isolation liner on either side of the DRAM cell, adjacent the gate conductor. Isolation regions are then formed in the trenches on either side of the DRAM cell. Thereafter, the DRAM cell, including the boron-containing channel region adjacent the gate conductor, is subjected to elevated temperatures by thermal processing, for example, forming a support device on the substrate adjacent the isolation regions. The nitride-containing isolation liner reduces segregation of the boron in the channel region, as compared to an essentially nitrogen-free oxide-containing isolation liner.
    • 一种制造集成电路器件的方法包括蚀刻衬底中的沟槽并形成具有位于下端的存储电容器的动态随机存取存储器(DRAM)单元和覆盖的垂直金属氧化物半导体场效应晶体管(MOSFET),其包括栅极 导体和掺硼通道。 该方法包括在DRAM单元附近形成沟槽和在DRAM单元的任一侧上与栅极导体相邻的硅 - 氮氧化物隔离衬垫。 然后在DRAM单元的两侧的沟槽中形成隔离区。 此后,包括与栅极导体相邻的含硼沟道区域的DRAM单元通过热处理受到升高的温度,例如,在邻近隔离区域的衬底上形成支撑器件。 与基本上不含氮氧化物的隔离衬垫相比,含氮化物的隔离衬垫减少了沟道区域中的硼的偏析。