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    • 7. 发明申请
    • Integrated stacked microchannel heat exchanger and heat spreader
    • 集成堆叠微通道换热器和散热器
    • US20060244127A1
    • 2006-11-02
    • US11453428
    • 2006-06-14
    • Ven HolalkereRavi PrasherStephen Montgomery
    • Ven HolalkereRavi PrasherStephen Montgomery
    • H01L23/34
    • H01L23/473F28D15/0266F28F2260/02H01L21/563H01L23/4006H01L23/427H01L2224/16H01L2224/16227H01L2224/73204H01L2224/73253H01L2924/01019H01L2924/01078H01L2924/01079
    • Integrated stacked microchannrel heat exchanger and heat spreaders for cooling integrated circuit (IC) dies and packages and cooling systems employing the same are disclosed. In one embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an interstitial solder or a solderable material in combination with solder. In another embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an adhesive. In a further embodiment, a stacked microchannel heat exchanger is operatively coupled to an IC die or package by fasteners and is thermally coupled to the IC die or package using a thermal interface material. The integrated stacked microchannel heat exchanger and heat spreaders may be employed in a closed loop cooling system including a pump and a heat rejecter. The integrated stacked microchannel heat exchanger and heat spreaders are configured to support either a two-phase or a single-phase heat transfer process using a working fluid such as water.
    • 公开了用于冷却集成电路(IC)的集成式微型集管式热交换器和散热器以及采用该集成电路的封装和冷却系统。 在一个实施例中,堆叠的微通道热交换器使用与焊料组合的间隙焊料或可焊接材料来操作和热耦合到IC管芯或封装。 在另一个实施例中,堆叠的微通道热交换器使用粘合剂可操作地和热耦合到IC管芯或封装。 在另一个实施例中,堆叠的微通道热交换器通过紧固件可操作地耦合到IC管芯或封装,并且使用热界面材料热耦合到IC管芯或封装。 集成的堆叠微通道热交换器和散热器可以用于包括泵和排热器的闭环冷却系统中。 集成的堆叠微通道热交换器和散热器被配置为支持使用诸如水的工作流体的两相或单相热传递过程。