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1. 发明授权

US08581094B2 Electronic device module comprising polyolefin copolymer 有权
标题翻译：包含聚烯烃共聚物的电子器件模块
公开(公告)号：US08581094B2
公开(公告)日：2013-11-12
申请号：US11857208
申请日：2007-09-18
申请人： Rajen M. Patel , Shaofu Wu , Mark T. Bernius , Mohamed Esseghir , Robert L. McGee , Michael H. Mazor , John Naumovitz
发明人： Rajen M. Patel , Shaofu Wu , Mark T. Bernius , Mohamed Esseghir , Robert L. McGee , Michael H. Mazor , John Naumovitz
IPC分类号： H02N6/00 , H01L31/042 , H01L31/00
CPC分类号： H01L31/0481 , B32B17/10018 , B32B17/10678 , B32B2457/12 , C08L51/06 , H01L31/18 , Y02E10/50 , C08L2666/02 , C08L2666/04
摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an α-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/α-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.
摘要翻译：一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料，所述聚合材料包含（1）聚烯烃共聚物，（a）小于约0.90g / cc的密度，（b）通过ASTM D-882-02测量的小于约150兆帕（mPa）的2％割线模量中的至少一个），（c）熔点低于约95℃，（d）基于聚合物重量，至少约15-小于约50重量％的α-烯烃含量，（e）小于约-35℃的Tg，和（f）至少约50的SCBDI，（2）任选的自由基引发剂，例如过氧化物或偶氮化合物，或光引发剂，例如二苯甲酮，和（3）任选的助剂。通常，聚烯烃共聚物是乙烯/α-烯烃共聚物。任选地，聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂，并且共聚物可保持未交联或交联。

2. 发明申请

US20080115825A1 Electronic Device Module Comprising an Ethylene Multi-Block Copolymer 审中-公开
标题翻译：包含乙烯多嵌段共聚物的电子器件模块
公开(公告)号：US20080115825A1
公开(公告)日：2008-05-22
申请号：US11857195
申请日：2007-09-18
申请人： Rajen M. Patel , Shaofu Wu , Mark T. Bernius , Mohamed Esseghir , Robert L. McGee , Michael H. Mazor , John Naumovitz
发明人： Rajen M. Patel , Shaofu Wu , Mark T. Bernius , Mohamed Esseghir , Robert L. McGee , Michael H. Mazor , John Naumovitz
IPC分类号： H01L31/00
CPC分类号： C08F210/02 , B32B17/10018 , B32B17/10678 , B32B17/10697 , H01L31/048 , H01L31/0481 , Y02E10/50
摘要： An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.
摘要翻译：电子设备模块包括：A.至少一个电子设备，例如太阳能电池和B.与电子设备的至少一个表面紧密接触的聚合材料，聚合物材料包含乙烯多嵌段共聚物。通常，聚烯烃材料是密度小于约0.90克/立方厘米（g / cc）的乙烯多嵌段共聚物。聚合物材料可以完全封装电子器件，或者它可以层压到器件的一个表面。任选地，聚合物材料还可以包含焦烧抑制剂，并且该共聚物可以保持未交联或可以交联。

3. 发明申请

US20110290317A1 ELECTRONIC DEVICE MODULE COMPRISING POLYOLEFIN COPOLYMER WITH LOW UNSATURATION AND OPTIONAL VINYL SILANE 审中-公开
标题翻译：具有低不饱和度和可选的乙烯基硅烷的聚烯烃共聚物的电子器件模块
公开(公告)号：US20110290317A1
公开(公告)日：2011-12-01
申请号：US13116520
申请日：2011-05-26
申请人： John Naumovitz , Rajen M. Patel , Shaofu Wu , Debra H. Niemann
发明人： John Naumovitz , Rajen M. Patel , Shaofu Wu , Debra H. Niemann
IPC分类号： H01L31/0216
CPC分类号： C08L23/08 , B32B17/10018 , B32B17/1055 , C08L2205/02 , H01L31/0481 , Y02E10/50 , C08L2666/06
摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) an ethylene-based polymer composition characterized by a Comonomer Distribution Constant greater than about 45, more preferably greater than 50, most preferably greater than 95, and as high as 400, preferably as high as 200, wherein the composition has less than 120 total unsaturation unit/1,000,000C, preferably the ethylene-based polymer compositions comprise up to about 3 long chain branches/1000 carbons, more preferably from about 0.01 to about 3 long chain branches/1000 carbons; the ethylene-based polymer composition can have a ZSVR of at least 2; the ethylene-based polymer compositions can be further characterized by comprising less than 20 vinylidene unsaturation unit/1,000,000C; the ethylene-based polymer compositions can have a bimodal molecular weight distribution (MWD) or a multi-modal MWD; the ethylene-based polymer compositions can have a comonomer distribution profile comprising a mono or bimodal distribution from 35° C. to 120° C., excluding purge; the ethylene-based polymer compositions can comprise a single DSC melting peak; the ethylene-based polymer compositions can comprise a weight average molecular weight (Mw) from about 17,000 to about 220,000, (2) optionally, a vinyl silane, (3) optionally, a free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (4) optionally, a co-agent.
摘要翻译：一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料，所述聚合物材料包括（1）基于乙烯的聚合物组合物的特征在于共聚单体分布常数大于约45，更优选大于50，最优选大于95，高达400，优选高达200，其中组合物具有小于120总不饱和单元/ 1,000,000C 优选地，基于乙烯的聚合物组合物包含最多约3个长链分支/ 1000个碳，更优选约0.01至约3个长支链/ 1000个碳; 基于乙烯的聚合物组合物可以具有至少2的ZSVR; 基于乙烯的聚合物组合物可以进一步表征为包含少于20个亚乙烯基不饱和单元/ 1,000,000C; 乙烯基聚合物组合物可以具有双峰分子量分布（MWD）或多模态MWD; 乙烯基聚合物组合物可以具有包含35℃至120℃的单峰或双峰分布的共聚单体分布分布，不包括吹扫; 基于乙烯的聚合物组合物可以包含单个DSC熔融峰; 基于乙烯的聚合物组合物可包含约17,000至约220,000的重均分子量（Mw），（2）任选的乙烯基硅烷，（3）任选的自由基引发剂，例如过氧化物或偶氮化合物，或光引发剂，例如二苯甲酮，和（4）任选的助剂。

4. 发明申请

US20130233383A1 Electronic Device Module Comprising Film of Homogeneous Polyolefin Copolymer and Grafted Silane 审中-公开
标题翻译：包含均相聚烯烃共聚物和接枝硅烷的膜的电子器件模块
公开(公告)号：US20130233383A1
公开(公告)日：2013-09-12
申请号：US13701534
申请日：2011-06-06
申请人： John A. Naumovitz , Rajen M. Patel , Shaofu Wu , Debra H. Neimann
发明人： John A. Naumovitz , Rajen M. Patel , Shaofu Wu , Debra H. Neimann
IPC分类号： H01L31/0203 , H01L23/29
CPC分类号： H01L31/0203 , B32B17/10018 , B32B17/1055 , C08F210/16 , C08F255/02 , C08L23/08 , H01L23/293 , H01L31/0481 , H01L2924/0002 , Y02E10/50 , C08L2666/24 , C08F210/14 , C08F2500/02 , C08F2500/09 , C08F2500/11 , C08F2500/26 , H01L2924/00 , C08F230/08
摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) an ethylene interpolymer comprising an overall polymer density of not more than 0.905 g/cm3; total unsaturation of not more than 125 per 100,000 carbons; up to 3 long chain branches/1000 carbons; vinyl-3 content of less than 5 per 100,000 carbons; and a total number of vinyl groups/1000 carbons of less than the quantity (8000/Mn), wherein the vinyl-3 content and vinyl group measurements are measured by gel permeation chromatography (145° C.) and 1H-NMR (125° C.), (2) grafted vinyl silane, (3) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt % based on the weight of the copolymer, and (3) optionally, a co-agent in an amount of at least about 0.05 wt % based upon the weight of the copolymer.
摘要翻译：一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合物材料，所述聚合物材料包含（1）乙烯互聚物，其包含总聚合物密度不大于0.905g / cm3; 总不饱和度不超过125 / 100,000个碳; 最多3条长支链/ 1000个碳; 乙烯基-3含量小于5 / 100,000碳; 和总数（1000 / Mn）的乙烯基/ 1000个碳的总数，其中通过凝胶渗透色谱（145℃）和1 H-NMR（125°）测量乙烯基-3含量和乙烯基测量值 C.），（2）接枝的乙烯基硅烷，（3）任选的自由基引发剂或光引发剂，其量为基于共聚物重量的至少约0.05重量％，和（3）任选的助剂其量为基于共聚物重量的至少约0.05重量％。

5. 发明申请

US20130087198A1 Electronic Device Module Comprising Heterogeneous Polyolefin Copolymer and Optionally Silane 审中-公开
标题翻译：包含非均相聚烯烃共聚物和任选的硅烷的电子器件模块
公开(公告)号：US20130087198A1
公开(公告)日：2013-04-11
申请号：US13703405
申请日：2011-06-15
申请人： John A. Naumovitz , Debra H. Niemann , Rajen M. Patel , Shaofu Wu
发明人： John A. Naumovitz , Debra H. Niemann , Rajen M. Patel , Shaofu Wu
IPC分类号： H01L31/0203 , H05K1/03
CPC分类号： H01L31/0203 , B32B17/10018 , B32B17/1055 , B32B17/10697 , B32B17/10788 , C08L23/0815 , C08L2203/204 , H01L31/0481 , H05K1/032 , Y02E10/50
摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer characterized as having has an average Mv and a valley temperature between the interpolymer and high crystalline fraction, Thc, such that the average Mv for a fraction above Thc from ATREF divided by average Mv of the whole polymer from ATREF (Mhc/Mp) is less than about 1.95 and wherein the copolymer has a CDBI of less than 60%, (2) optionally, a vinyl silane, (3) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt % based on the weight of the copolymer, and (4) optionally, a co-agent in an amount of at least about 0.05 wt % based upon the weight of the copolymer.
摘要翻译：一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料，所述聚合物材料包括（1）聚烯烃共聚物，具有在互聚物和高结晶部分Thc之间具有平均Mv和谷值温度，使得在ATREF之上的Thc以上的分数的平均Mv除以ATREF（Mhc / Mp）之外的整个聚合物的平均Mv小于约1.95，并且其中所述共聚物的CDBI小于60％，（2）任选的乙烯基硅烷，（3）任选的自由基引发剂或光引发剂，其量为至少约0.05重量％共聚物，和（4）任选地，基于共聚物的重量，至少约0.05重量％的助剂。

6. 发明申请

US20130087199A1 Electronic Device Module Comprising Long Chain Branched (LCB), Block or Interconnected Copolymers of Ethylene and Optionally Silane 审中-公开
标题翻译：包括长链支化（LCB），乙烯和任选的硅烷的嵌段或互连共聚物的电子器件模块
公开(公告)号：US20130087199A1
公开(公告)日：2013-04-11
申请号：US13703639
申请日：2011-06-15
申请人： John A. Naumovitz , Debra H. Neimann , Rajen M. Patel , Shaofu Wu
发明人： John A. Naumovitz , Debra H. Neimann , Rajen M. Patel , Shaofu Wu
IPC分类号： H01L31/0203 , H05K1/03
CPC分类号： H01L31/0203 , B32B17/10018 , B32B17/1055 , B32B17/10678 , B32B17/10697 , H01L23/293 , H01L31/0481 , H01L2924/0002 , H05K1/032 , Y02E10/50 , H01L2924/00
摘要： An electronic device module is disclosed comprising: A. at least one electronic device, and B. a polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) An ethylenic polymer comprising at least 0.1 amyl branches per 1000 carbon atoms as determined by Nuclear Magnetic Resonance and both a highest peak melting temperature, Tm, in ° C., and a heat of fusion, Hf, in J/g, as determined by DSC Crystallinity, where the numerical values of Tm and Hf correspond to the relationship: Tm≧(0.2143*Hf)+79.643, and wherein the ethylenic polymer has less than about 1 mole percent ctane comonomer, and less than about 0.5 mole percent ctane, pentene, or ctane comonomer. (2) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt % based on the weight of the copolymer, (3) optionally, a co-agent in an amount of at least about 0.05 wt % based upon the weight of the copolymer, and (4) optionally, a vinyl silane compound.
摘要翻译：公开了一种电子设备模块，包括：A.至少一个电子设备，以及B.与所述电子设备的至少一个表面紧密接触的聚合物材料，所述聚合物材料包含（1）包含至少0.1个戊基通过核磁共振确定的每1000个碳原子的分支，并且通过DSC结晶度测定的最高峰值熔融温度Tm，℃和熔融热Hf（J / g），其中数值 Tm和Hf对应于Tm≥（0.2143×Hf）+79.643的关系，并且其中乙烯类聚合物具有小于约1摩尔％的正丁烯共聚单体，和小于约0.5摩尔％的正丁烯，戊烯或者正庚烷共聚单体。（2）任选地，基于共聚物重量的至少约0.05重量％的自由基引发剂或光引发剂，（3）任选地，基于以下物质的至少约0.05重量％的量的助剂：共聚物的重量，和（4）任选的乙烯基硅烷化合物。

7. 发明申请

US20130206224A1 Electronic Device Module Comprising Film of Homogeneous Polyolefin Copolymer and Adhesive Property Enhancing Graft Polymer 审中-公开
标题翻译：包含均匀聚烯烃共聚物膜和粘合剂性能的电子装置模块增强接枝聚合物
公开(公告)号：US20130206224A1
公开(公告)日：2013-08-15
申请号：US13701060
申请日：2011-06-06
申请人： John A. Naumovitz , Rajen M. Patel , Shaofu Wu , Debra H. Niemann
发明人： John A. Naumovitz , Rajen M. Patel , Shaofu Wu , Debra H. Niemann
IPC分类号： H05K1/03 , H01L31/048
CPC分类号： H05K1/0353 , B32B17/10018 , B32B17/1055 , B32B17/10697 , C08F210/16 , C08L23/08 , H01L31/0481 , Y02E10/50 , C08L2666/24 , C08F210/14 , C08F2500/08 , C08F2500/09 , C08F2500/26
摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) an ethylene interpolymer comprising an overall polymer density of not more than 0.905 g/cm3; total unsaturation of not more than 125 per 100,000 carbons; and; up to 3 long chain branches/1000 carbons; vinyl-3 content of less than 5 per 100,000 carbons; and a total number of vinyl groups/1000 carbons of less than the quantity (8000/Mn), wherein the vinyl-3 content and vinyl group measurements are measured by gel permeation chromatography (145° C.) and 1H-NMR (125° C.), (2) a graft polymer to enhance the adhesion, (3) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt % based on the weight of the copolymer, and (3) optionally, a co-agent in an amount of at least about 0.05 wt% based upon the weight of the copolymer.
摘要翻译：一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合物材料，所述聚合物材料包含（1）乙烯互聚物，其包含总聚合物密度不大于0.905g / cm3; 总不饱和度不超过125 / 100,000个碳; 和; 最多3条长支链/ 1000个碳; 乙烯基-3含量小于5 / 100,000碳; 和总数（1000 / Mn）的乙烯基/ 1000个碳的总数，其中通过凝胶渗透色谱（145℃）和1 H-NMR（125°）测量乙烯基-3含量和乙烯基测量值（3）任选的自由基引发剂或光引发剂，其量为至少约0.05重量％，基于共聚物的重量，和（3）任选地，基于共聚物的重量，至少约0.05重量％的量的助剂。

8. 发明申请

US20130167926A1 Electronic Device Module Comprising Ethylene-Alpha Olefin Tapered Block Copolymers and Optional Vinyl Silane 审中-公开
标题翻译：包含乙烯-α烯烃锥形嵌段共聚物和任选的乙烯基硅烷的电子器件模块
公开(公告)号：US20130167926A1
公开(公告)日：2013-07-04
申请号：US13821272
申请日：2011-09-02
申请人： Debra H. Niemann , John A. Naumovitz , Rajen M. Patel , Shaofu Wu
发明人： Debra H. Niemann , John A. Naumovitz , Rajen M. Patel , Shaofu Wu
IPC分类号： H01L31/048
CPC分类号： H01L31/0481 , B32B17/10018 , B32B17/10036 , B32B17/1055 , B32B2457/12 , Y02E10/50
摘要： An electronic device module such as a solar cell is described. The electronic device module is made using a polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising a tapered block copolymer comprising an A block, and a B block.
摘要翻译：描述了诸如太阳能电池的电子设备模块。电子器件模块使用与电子器件的至少一个表面紧密接触的聚合物材料制成，聚合物材料包含包含A嵌段和B嵌段的渐缩嵌段共聚物。

9. 发明申请

US20120052273A1 HEAT SEALABLE AND ORIENTED MULTI-LAYER POLYPROPYLENE-BASED FILMS FOR SHRINK APPLICATIONS 审中-公开
标题翻译：高密度和面向多层聚丙烯的薄膜，用于收缩应用
公开(公告)号：US20120052273A1
公开(公告)日：2012-03-01
申请号：US13319452
申请日：2010-05-06
申请人： Maria Isabel Arroyo Villan , Rajen M. Patel , Julie R. Hatlewick , Robert L. McGee , Stephen J. Skapik, III
发明人： Maria Isabel Arroyo Villan , Rajen M. Patel , Julie R. Hatlewick , Robert L. McGee , Stephen J. Skapik, III
IPC分类号： B32B7/02 , B32B3/00 , B32B27/08
CPC分类号： B32B27/32 , B32B3/266 , B32B25/08 , B32B27/16 , B32B27/18 , B32B27/20 , B32B27/327 , B32B2250/24 , B32B2307/31 , B32B2307/50 , B32B2307/514 , B32B2307/558 , B32B2307/72 , B32B2307/736 , B32B2307/75 , B32B2519/00 , Y10T428/2495 , Y10T428/31909
摘要： The present invention relates to a multi-layer oriented shrink film comprising a first and a second skin layer comprising a propylene-based polymer having a melting point greater than 130 C and at least one core layer comprising a propylene-based plastomer or elastomer. The films are preferably primarily oriented in either the machine or the cross direction. These films are ideally suited for use as a shrink label which can be applied either as a CD shrink sleeve or applied using a continuous roll process. The films ideally have an overall density of less than 1.0 g/cm3, to facilitate recycling efforts.
摘要翻译：本发明涉及一种多层定向收缩膜，其包括第一和第二表皮层，其包含熔点大于130℃的丙烯类聚合物和至少一个包含基于丙烯的塑性体或弹性体的核心层。膜优选主要在机器或横向方向上定向。这些膜理想地适合用作收缩标签，其可以作为CD收缩套筒使用，或者使用连续辊式方法施加。这些膜理想地具有小于1.0g / cm 3的总密度，以便于再循环。

10. 发明授权

US08609228B2 High performance sealable coextruded biaxially oriented polypropylene film 有权
标题翻译：高性能可密封共挤双轴取向聚丙烯薄膜
公开(公告)号：US08609228B2
公开(公告)日：2013-12-17
申请号：US12757091
申请日：2010-04-09
申请人： Yong Chen , Hongyu Chen , Xiao Bing Yun , Jing Li , Morgan M. Hughes , Rajen M. Patel
发明人： Yong Chen , Hongyu Chen , Xiao Bing Yun , Jing Li , Morgan M. Hughes , Rajen M. Patel
IPC分类号： B32B7/02
CPC分类号： B32B27/32 , B32B7/02 , B32B27/327 , B32B2250/03 , B32B2250/04 , B32B2250/05 , B32B2250/242 , B32B2307/31 , B32B2307/518 , B32B2439/70 , B32B2553/00 , Y10T428/24942 , Y10T428/265 , Y10T428/266 , Y10T428/2817 , Y10T428/31917 , Y10T428/31924 , Y10T428/31938
摘要： A multilayer biaxially oriented polypropylene film is disclosed which comprises at least three layers. The first layer is an outer layer comprising a first polymer which is a homopolymer polypropylene resin having a melting point of at least 155° C. The second layer is a core layer, having a melting point greater than 150° C. The core layer includes a blend comprising a second polymer which is a polypropylene homopolymer having a melting point of at least 155° C. and a third polymer having a melting point no greater than 145° C. The second polymer comprises from 20% to 80% by weight of the core layer while the third polymer comprises from 80% to 20% by weight of the core layer. The last required layer in the film is a sealant layer. The sealant layer comprises a fourth polymer having a melting point no greater than 145° C.
摘要翻译：公开了一种包括至少三层的多层双轴取向聚丙烯薄膜。第一层是包含第一聚合物的外层，第一聚合物是熔点至少为155℃的均聚聚丙烯树脂。第二层是熔点大于150℃的芯层。芯层包括共混物，其包含第二聚合物，其是熔点为至少155℃的聚丙烯均聚物和熔点不大于145℃的第三聚合物。第二聚合物包含20重量％至80重量％核心层，而第三聚合物占芯层重量的80％至20％。膜中最后需要的层是密封剂层。密封层包括熔点不大于145℃的第四聚合物

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